公开(公告)号：US20080196246A1

公开(公告)日：2008-08-21

申请号：US11676467

申请日：2007-02-19

申请人： Dean Tran ,  Alan Hirschberg ,  Melissa Fuller ,  Phillip Hayes ,  Greg Keller

发明人： Dean Tran ,  Alan Hirschberg ,  Melissa Fuller ,  Phillip Hayes ,  Greg Keller

IPC分类号： H01R43/04 ,  H01R43/02

CPC分类号： H01R43/048 ,  H01R4/20 ,  Y10T29/4914 ,  Y10T29/49181 ,  Y10T29/49192 ,  Y10T29/49194 ,  Y10T29/49213 ,  Y10T29/49218

摘要： A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.

摘要翻译： 一种用于组装束电缆连接器组件的方法，其消除鸟笼，通过连接器销挤出的线丝，松散的线螺纹，电介质屏蔽收缩等。该方法包括剥离线以产生鸟笼预防区和暴露的尖端，其具有 在其间的卷边区域，以及在鸟笼预防区域和尖端处涂覆暴露的线。 该方法然后包括将线插入连接器针中，并且使用热量将引脚压接在压接区处的导线上，使得镀锡焊料熔化。 该方法然后包括将销安装到连接器主体并将线锁定装置安装到连接器主体以将销锁定到连接器主体。

公开(公告)号：US07610676B2

公开(公告)日：2009-11-03

申请号：US11676467

申请日：2007-02-19

申请人： Dean Tran ,  Alan Hirschberg ,  Melissa Fuller ,  Phillip Hayes ,  Greg Keller

发明人： Dean Tran ,  Alan Hirschberg ,  Melissa Fuller ,  Phillip Hayes ,  Greg Keller

IPC分类号： H01R43/04

CPC分类号： H01R43/048 ,  H01R4/20 ,  Y10T29/4914 ,  Y10T29/49181 ,  Y10T29/49192 ,  Y10T29/49194 ,  Y10T29/49213 ,  Y10T29/49218

摘要： A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.

摘要翻译： 一种用于组装束电缆连接器组件的方法，其消除鸟笼，通过连接器销挤出的线丝，松散的线螺纹，电介质屏蔽收缩等。该方法包括剥离线以产生鸟笼预防区和暴露的尖端，其具有 在其间的卷边区域，以及在鸟笼预防区域和尖端处涂覆暴露的线。 该方法然后包括将线插入连接器针中，并且使用热量将引脚压接在压接区处的导线上，使得镀锡焊料熔化。 该方法然后包括将销安装到连接器主体并将线锁定装置安装到连接器主体以将销锁定到连接器主体。

公开(公告)号：US20070184285A1

公开(公告)日：2007-08-09

申请号：US11349609

申请日：2006-02-08

申请人： Dean Tran ,  Thomas Chung ,  Alan Hirschberg ,  Luis Rochin ,  Mark Kintis

发明人： Dean Tran ,  Thomas Chung ,  Alan Hirschberg ,  Luis Rochin ,  Mark Kintis

IPC分类号： B32B17/06 ,  B32B15/00

CPC分类号： B32B15/017 ,  B32B15/018 ,  C23C2/06 ,  C23C28/021 ,  C23C28/023 ,  C23C30/00 ,  C25D7/00 ,  H01R13/6581 ,  H01R13/6598

摘要： Protection against x-ray radiation is provided by a thin layer of a zinc-based alloy. An electronics component housing and lid are made to include a base of a lightweight alloy, a thin coating of the zinc-based alloy and an exterior finish metal layer. The zinc-based alloy provides excellent radiation protection and other advantages, without a significant weight penalty.

摘要翻译： 通过锌基合金的薄层提供对x射线辐射的保护。 电子部件壳体和盖子被制成为包括轻质合金的基底，锌基合金的薄涂层和外部精加工金属层。 锌基合金提供优异的辐射防护等优点，而没有显着的重量损失。

公开(公告)号：US07476606B2

公开(公告)日：2009-01-13

申请号：US11390772

申请日：2006-03-28

申请人： Dean Tran ,  Alan Hirschberg ,  Ha K. DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven J. Mass

发明人： Dean Tran ,  Alan Hirschberg ,  Ha K. DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven J. Mass

IPC分类号： H01L21/00 ,  H01L21/28

CPC分类号： H01L21/2007

摘要： Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.

摘要翻译： 通常非常薄且因此非常脆弱的超高速半导体仍需要连接到电路板和传热通路。 超高速电路和半导体器件具有通过各种沉积方法形成在晶片或衬底的背面上的载体板。 载体板是一系列金属层，每个金属层被选择为能够将相对厚的铜载体板附接到基板或晶片的背面。

公开(公告)号：US20070235744A1

公开(公告)日：2007-10-11

申请号：US11390772

申请日：2006-03-28

申请人： Dean Tran ,  Alan Hirschberg ,  Ha DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven Mass

发明人： Dean Tran ,  Alan Hirschberg ,  Ha DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven Mass

IPC分类号： H01L33/00

CPC分类号： H01L21/2007

摘要： Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.

摘要翻译： 通常非常薄且因此非常脆弱的超高速半导体仍需要连接到电路板和传热通路。 超高速电路和半导体器件具有通过各种沉积方法形成在晶片或衬底的背面上的载体板。 载体板是一系列金属层，每个金属层被选择为能够将相对厚的铜载体板附接到基板或晶片的背面。