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公开(公告)号：US12232288B2
公开(公告)日：2025-02-18
申请号：US18045180
申请日：2022-10-10
Applicant: Delta Electronics, Inc.
Inventor： Haoyi Ye , Jianhong Zeng , Yu Zhang , Peiqing Hu , Ziying Zhou
IPC: H05K7/02 , G06F1/18 , G06F1/20 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/10 , H05K7/20 , H01L25/16
Abstract: The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.
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公开(公告)号：US20220149738A1
公开(公告)日：2022-05-12
申请号：US17584926
申请日：2022-01-26
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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公开(公告)号：US20210081013A1
公开(公告)日：2021-03-18
申请号：US17105180
申请日：2020-11-25
Applicant: Delta Electronics, Inc.
Inventor： Tao Wang , Min Zhou , Yuliang Zhang , Jianhong Zeng
Abstract: Disclosed herein is a power supply apparatus that includes a bearing plate, insulation material and a plurality of pins. The insulation material is formed on two opposite surfaces of the bearing plate. The plurality of pins are electrically connected to the bearing plate and allocated along lateral sides of the insulation material.
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公开(公告)号：US20190379362A1
公开(公告)日：2019-12-12
申请号：US16548781
申请日：2019-08-22
Applicant: Delta Electronics, Inc.
Inventor： Peiqing Hu , Jianhong Zeng , Haoyi Ye
IPC: H03K3/012 , H03K17/687
Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.
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公开(公告)号：US11437910B2
公开(公告)日：2022-09-06
申请号：US16560820
申请日：2019-09-04
Applicant: Delta Electronics, Inc.
Inventor： Jianhong Zeng , Haoyi Ye , Peiqing Hu , Pengkai Ji
IPC: H02M3/00 , H02M3/335 , H05K1/14 , G09G1/00 , H02M3/158 , H02M7/04 , H02M7/49 , H02M1/42 , G06F1/20 , G06F1/26 , H05K1/02 , H02M1/00
Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.
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Patent Agency Ranking
公开(公告)号：US10249550B2
公开(公告)日：2019-04-02
申请号：US15720062
申请日：2017-09-29
Applicant: Delta Electronics, Inc.
Inventor： Pengkai Ji , Shouyu Hong , Zhenqing Zhao , Jianhong Zeng
Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
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公开(公告)号：US20180124922A1
公开(公告)日：2018-05-03
申请号：US15720062
申请日：2017-09-29
Applicant: Delta Electronics, Inc.
Inventor： Pengkai JI , Shouyu HONG , Zhenqing ZHAO , Jianhong Zeng
CPC classification number: H01L23/3121 , H01L21/561 , H01L21/565 , H01L23/4334 , H01L23/492 , H01L23/49811 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/40
Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
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公开(公告)号：US10734976B2
公开(公告)日：2020-08-04
申请号：US16548781
申请日：2019-08-22
Applicant: Delta Electronics, Inc.
Inventor： Peiqing Hu , Jianhong Zeng , Haoyi Ye
IPC: H03K3/00 , H03K3/012 , H02M1/08 , H03K17/0412 , H03K17/16 , H03K17/687 , H02M3/158 , H02M1/34
Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.
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公开(公告)号：US10511176B2
公开(公告)日：2019-12-17
申请号：US15134478
申请日：2016-04-21
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jianhong Zeng , Peiqing Hu , Haoyi Ye , Yan Chen , Jiale Dai , Ziying Zhou
Abstract: The present disclosure provides a power converter, including: a pre-stage circuit, configured to receive an input voltage and convert the input voltage to a bus voltage; and plurality of post-stage circuits, connected in parallel to an output terminal of the pre-stage circuit, and configured to receive the bus voltage from the pre-stage circuit and each converts the bus voltage to an output voltage. The power converter provided by the present disclosure can effectively solve the problems of isolation and the wide range of operating voltage, and can take both of high efficiency and high power density into consideration.
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公开(公告)号：US20190013736A1
公开(公告)日：2019-01-10
申请号：US16130850
申请日：2018-09-13
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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