摘要:
A method and apparatus are provided for reducing leakage current in a read only memory device. Leakage current is reduced by reducing the duration of the precharge cycle during each read cycle so that the associated leakage current will flow for a shorter time period during each cycle. The precharge phase is positioned at the beginning of each read cycle, prior to the evaluation phase. The precharge phase is terminated by a subsequent clock edge or by an internal time out prior to a subsequent clock edge. The time interval between when the columns reach their precharge voltage and the evaluation phase begins is reduced.
摘要:
A method and apparatus are provided for reducing leakage current in a read only memory device. Leakage current is reduced by reducing the duration of the precharge cycle during each read cycle so that the associated leakage current will flow for a shorter time period during each cycle. The precharge phase is positioned at the beginning of each read cycle, prior to the evaluation phase. The precharge phase is terminated by a subsequent clock edge or by an internal time out prior to a subsequent clock edge. The time interval between when the columns reach their precharge voltage and the evaluation phase begins is reduced.
摘要:
A method and apparatus are provided for reducing leakage current in a read only memory device. Leakage current is reduced by applying a biased gate voltage (relative to a source voltage) to the gate of at least one of transistor in the array. The biased gate voltage is applied at least during a precharge phase of a read cycle. When the array transistors are n-channel transistors, the biased voltage is a negative bias voltage (relative to the source voltage). When the array transistors are p-channel transistors, the biased voltage is a positive bias voltage (relative to the source voltage). Applying a negative backgate bias to the transistor's p-well contact can also reduce n-channel transistor subthreshold leakage current. Thus, for an n-channel array, a negative gate voltage and backgate bias (optional) are applied to cell transistors in the off state. Similarly, the subthreshold leakage current of p-channel transistors is reduced by applying a more positive gate-to-source bias and a positive n-well-to-source bias.
摘要:
A method and apparatus are provided for reducing leakage current in a read only memory device. Leakage current is reduced by precharging only a portion of the columns in a read only memory array during a given read cycle. The portion of the columns that are precharged is limited to a subset of columns that includes those columns that will be read during a given read cycle. A read column address is decoded to precharge only the portion of the columns of transistors that will be read during the given read cycle. The columns of transistors can be grouped into a plurality of sub-arrays and only those sub-arrays having columns that will be read during a given read cycle are precharged during the read cycle.
摘要:
The present invention provides a read-only memory (ROM) architecture. An exemplary ROM array includes a plurality of columns, a plurality of rows, a first plurality of transistors or other switches representing a “0” data state or low voltage state, and a second plurality of transistors or other switches representing a “1” data state or high voltage state. Each transistor has a corresponding drain coupled to a column and a gate coupled to a row. Each transistor of the first plurality has a source coupled to a source voltage bus, and each transistor of the second plurality has a source not coupled to the source voltage bus, through use of a programmable contact window during fabrication. In various embodiments, for a selected column, drains of pair-wise adjacent transistors share a common drain-column contact and common diffusion region.
摘要:
One time programmable memory devices are disclosed that are programmed using hot carrier induced degradation to alter one or more transistors characteristics. A one time programmable memory device is comprised of an array of transistors. Transistors in the array are selectively programmed using hot carrier induced changes in one or more transistor characteristics, such as changes to the saturation current, threshold voltage or both, of the transistors. The changes to the transistor characteristics are achieved in a similar manner to known hot carrier transistor aging principles. The disclosed one time programmable memory devices are small and programmable at low voltages and small current.
摘要:
A non-volatile memory cell and associated cell array and memory device having reduced program disturb, improved retention of programmed information, and reduced power consumption are disclosed. The memory cell includes a control device coupled to a switch device via a common floating gate, with the control device and the switch device formed on a common substrate, and the switch device formed at least in part in a tub region on the substrate. The tub region has a contact region formed therein. The contact region is adapted for application of a bias voltage to the tub region during a programming operation of the memory cell so as to reduce a programming voltage required to program the memory cell. In an illustrative embodiment, a drain-to-substrate voltage required to program the memory cell is reduced from a conventional value of about 6.5 volts to a value of about 3.5 volts, thus alleviating program disturb problems that can result, e.g., when the drain-to-substrate voltage is applied to multiple columns of an array of cells that are programmed one row at a time. The memory cell is programmed by channel initiated secondary electron (CHISEL) injection of charge onto the floating gate. The invention is particularly well suited for implementation in single-poly flash EEPROM embedded memory devices in integrated circuit applications.
摘要:
The voltage regulator includes a regulator circuit, connected between a high potential and a low potential, regulating an output voltage based on an input voltage. The regulator circuit includes a changing circuit which changes at least one of a voltage range of the output voltage and a rate at which the output voltage changes with respect to changes in the input voltage. The changing circuit selectively increases a maximum value of the voltage range of the output voltage, and also selectively increases the rate at which the output voltage changes with respect to changes in the input voltage.
摘要:
An integrated circuit memory array has a plurality of rows of memory cells, each row of memory cells being coupled to a respective row line for enabling the memory cells of the row. A row driver of the memory array provides a row voltage on the row line. A pull-up transistor of the row driver pulls up the row voltage in response to a row control signal. A parasitic diode of the pull-up transistor is coupled at its anode to the row line and is adapted to pull the row voltage down from a high state voltage to a diode drop voltage plus a low state voltage in response an enable block signal coupled to the cathode of the parasitic diode. A pull-down transistor of the row driver also pulls down the row voltage in response to the row control signal.
摘要:
A memory self-testing system, apparatus, and method are provided which allow for testing for a plurality of bit errors and passing memory arrays having an error level which is correctable using selected error correction coding. An exemplary system embodiment includes a memory array, a comparator, an integrator, and a test control circuit. The memory array is adapted to store input test data and output stored test data during a plurality of memory read and write test operations. The comparator compares the input test data and the stored test data for a plurality of bit positions, and provides a corresponding error signal when the stored test data is not identical to the input test data for each bit position of the plurality of bit positions. The integrator receives the corresponding error signal and maintains the corresponding error signal for each bit position during the plurality of test operations. The test control circuit provides a fail signal when a predetermined level of corresponding error signals have been provided for the plurality of bit positions.