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公开(公告)号：US20060204109A1
公开(公告)日：2006-09-14
申请号：US11364103
申请日：2006-02-28
CPC分类号： G06T7/001 , G01N21/95607 , G06T2207/30148
摘要： A method of determining defects in a plurality of images having essentially the same image contents is disclosed. A comparison operation is carried out once three fully comparable images having essentially the same image contents are present in the intermediate memory. The stored individual images are accessed randomly. A paired comparison operation between the three difference images is carried out.
摘要翻译： 公开了一种确定具有基本上相同图像内容的多个图像中的缺陷的方法。 一旦在中间存储器中存在具有基本上相同的图像内容的三个完全可比的图像，则进行比较操作。 存储的各个图像被随机访问。 执行三个差分图像之间的配对比较操作。
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2.发明授权Detecting defects by three-way die-to-die comparison with false majority determination 有权通过与多数确定的三次模 - 对数比较来检测缺陷公开(公告)号：US07657077B2
公开(公告)日：2010-02-02
申请号：US11364103
申请日：2006-02-28
CPC分类号： G06T7/001 , G01N21/95607 , G06T2207/30148
摘要： A method of determining defects in a plurality of images having essentially the same image contents is disclosed. A comparison operation is carried out once three fully comparable images having essentially the same image contents are present in the intermediate memory. The stored individual images are accessed randomly. A paired comparison operation between the three difference images is carried out.
摘要翻译： 公开了一种确定具有基本上相同图像内容的多个图像中的缺陷的方法。 一旦在中间存储器中存在具有基本上相同的图像内容的三个完全可比的图像，则进行比较操作。 存储的各个图像被随机访问。 执行三个差分图像之间的配对比较操作。
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公开(公告)号：US20050008217A1
公开(公告)日：2005-01-13
申请号：US10883823
申请日：2004-07-06
申请人： Thin Luu , Bernd Jungmann , Detlef Michelsson
发明人： Thin Luu , Bernd Jungmann , Detlef Michelsson
CPC分类号： G06T7/001 , G06T2207/30148 , H01L22/12 , H01L22/20
摘要： A method for defect segmentation in features on semiconductor substrates is disclosed. After acquisition of an image of a semiconductor substrate, identical features or feature elements are subtracted from one another. The resulting difference function is compared with an upper and a lower threshold in order to identify defects.
摘要翻译： 公开了一种在半导体衬底上的特征中的缺陷分割方法。 在获取了半导体衬底的图像之后，相同的特征或特征元素被相互减去。 将所得的差分函数与上限和下限阈值进行比较，以便识别缺陷。
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4.发明授权Method for inspection and detection of defects on surfaces of disc-shaped objects and computer system with a software product for carrying out the method 有权用于执行该方法的软件产品的盘形物体和计算机系统的表面上的缺陷的检查和检测方法公开(公告)号：US08705837B2
公开(公告)日：2014-04-22
申请号：US13293169
申请日：2011-11-10
申请人： Detlef Michelsson , Daniel Skiera
发明人： Detlef Michelsson , Daniel Skiera
CPC分类号： G06F17/153 , G01N21/9501 , G01N21/9506 , G01N21/956 , G01N2021/9513 , G06T7/001 , G06T2207/10024 , G06T2207/30121 , G06T2207/30148
摘要： An image (30) of a disc-shaped object (100) is recorded, wherein the entire surface (100O) is captured with a plurality of fields (60). A difference image (31) is formed, by subtracting a reference from each field (60) of the surface (100O) of the disc-shaped object (100), and subject to a color transformation, wherein by a suitable choice of transformation signals in one channel are maximized, while at the same time undesired variations, caused by production, of the fields (60) are moved to a different channel. That combination of transformation and detection channel is chosen for which the largest number of pixels of a field (60) with the defect to be found are located outside the spread of the pixels of the respective field (60) on the surface (100O) of the respective disc-shaped object (100) from production and provide the largest signals for the defect.
摘要翻译： 记录盘形物体（100）的图像（30），其中，整个表面（100O）被捕获有多个场（60）。 通过从盘形物体（100）的表面（100O）的每个场（60）中减去参考，并进行颜色变换，形成差分图像（31），其中通过适当的变换信号选择 在一个通道中被最大化，同时由场（60）产生的不期望的变化被移动到不同的通道。 选择变换和检测通道的组合，其中具有要找到的缺陷的场（60）的最大数量的像素位于相应场（60）的像素的扩展之外，表面（100）的表面（100O） 相应的盘形物体（100）从生产中提供最大的缺陷信号。
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5.发明申请Method, device and software for the optical inspection of a semi-conductor substrate 有权用于半导体衬底的光学检查的方法，装置和软件公开(公告)号：US20060176476A1
公开(公告)日：2006-08-10
申请号：US10546372
申请日：2004-01-13
申请人： Detlef Michelsson
发明人： Detlef Michelsson
CPC分类号： G01N21/9501 , G01D1/14 , G06T7/0004 , G06T2207/30148
摘要： The invention relates to a method and a device for the optical inspection of the surface of semi-conductor substrate. An image (1) is captured on the surface of the semi-conductor substrate which is covered with a thin layer. Said image is made of a plurality of pixels having associated colour values and intensities. The frequency distribution of pixels having equal colour co-ordination values is calculated (3,4,5) from the colour values in a colour range (2), said colour range having a colour intensity and colour co-ordinates. The thus calculated frequency distribution is used (7, 9) to compare a second correspondingly calculated frequency distribution or a variable derived therefrom. According to the invention, the colour shift (9) and/or differences (7) in the colour distribution are determined according to fluctuations in the intensity of the illumination. The invention also relates to a method and a device for producing a structured semi-conductor substrate by using the above-mentioned method or the above-mentioned device and software for carrying out said method.
摘要翻译： 本发明涉及一种用于光学检查半导体衬底表面的方法和装置。 图像（1）被捕获在半导体衬底的被薄层覆盖的表面上。 所述图像由具有相关联的颜色值和强度的多个像素构成。 从颜色范围（2）中的颜色值计算具有相同颜色协调值的像素的频率分布（3,4,5），所述颜色范围具有颜色强度和颜色坐标。 使用这样计算的频率分布（7,9）来比较第二相应计算的频率分布或从其导出的变量。 根据本发明，颜色分布中的颜色偏移（9）和/或差异（7）根据照明强度的波动来确定。 本发明还涉及通过使用上述方法或上述用于执行所述方法的装置和软件来生产结构化半导体衬底的方法和装置。
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6.发明授权Method for determining the position of the edge bead removal line of a disk-like object 有权用于确定盘状物体的边缘珠去除线的位置的方法公开(公告)号：US07973931B2
公开(公告)日：2011-07-05
申请号：US12231465
申请日：2008-09-03
申请人： Detlef Michelsson , Guido Dietzler
发明人： Detlef Michelsson , Guido Dietzler
CPC分类号： G01N21/8806 , G01N21/9503 , G06K9/3216 , G06K2009/3225 , G06T7/0004 , G06T7/12 , G06T2207/30148 , G06T2207/30204
摘要： A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I′max of the intensity profile I are plotted as points in a diagram, segment sets are formed in the diagram, the segment sets are fitted in ellipses, and a quality criterion qges is determined for each ellipse.
摘要翻译： 公开了一种用于确定在边缘区域上具有边缘区域和对准标记的圆盘状物体的边缘珠粒移除线的位置的方法，其中包括边缘珠粒移除线的边缘区域被逐行成像 利用相机逐行地获得包括边缘珠去除线的成像边缘区域的强度分布I，并且检测边缘区域和对准标记，其中局部强度最大值I 强度分布I的最大值被绘制为图中的点，在图中形成段集合，将段集合以椭圆拟合，并且为每个椭圆确定质量标准qges。
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7.发明申请Method for determining the position of the edge bead removal line of a disk-like object 有权用于确定盘状物体的边缘珠去除线的位置的方法公开(公告)号：US20090130784A1
公开(公告)日：2009-05-21
申请号：US12231465
申请日：2008-09-03
申请人： Detlef Michelsson , Guido Dietzler
发明人： Detlef Michelsson , Guido Dietzler
CPC分类号： G01N21/8806 , G01N21/9503 , G06K9/3216 , G06K2009/3225 , G06T7/0004 , G06T7/12 , G06T2207/30148 , G06T2207/30204
摘要： A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I′max of the intensity profile I are plotted as points in a diagram, segment sets are formed in the diagram, the segment sets are fitted in ellipses, and a quality criterion qges is determined for each ellipse.
摘要翻译： 公开了一种用于确定在边缘区域上具有边缘区域和对准标记的圆盘状物体的边缘珠粒移除线的位置的方法，其中包括边缘珠粒移除线的边缘区域被逐行成像 利用相机逐行地获得包括边缘珠去除线的成像边缘区域的强度分布I，并且检测边缘区域和对准标记，其中局部强度最大值I 强度分布I的最大值被绘制为图中的点，在图中形成段集合，将段集合以椭圆拟合，并且为每个椭圆确定质量标准qges。
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公开(公告)号：US20080249728A1
公开(公告)日：2008-10-09
申请号：US12056734
申请日：2008-03-27
申请人： Detlef Michelsson , Daniel Skiera
发明人： Detlef Michelsson , Daniel Skiera
IPC分类号： G06F19/00
CPC分类号： G01N21/9501 , G06T7/0004 , G06T2207/10024
摘要： The invention relates to a method for detecting defects on the back side of a semiconductor wafer. The brightness distribution of the color values is essentially a normal distribution. An average value and surroundings can be defined using the determined normal distribution, which are criteria for the occurrence of a defect.
摘要翻译： 本发明涉及一种用于检测半导体晶片背面的缺陷的方法。 颜色值的亮度分布基本上是正态分布。 可以使用确定的正态分布来定义平均值和周围环境，该正态分布是缺陷发生的标准。
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公开(公告)号：US07292328B2
公开(公告)日：2007-11-06
申请号：US11011059
申请日：2004-12-15
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Defects on a wafer (26) can be detected using bright-field and/or dark-field illumination. The radiation incident onto the wafer (26) has, in this context, a substantial influence on the reliability of the measurement results. To improve the reliability of the measurement results, the wafer (26) is illuminated with an illumination device (12), adjustment of the illumination device (12), in particular its brightness and frequency, being accomplished in consideration of read-out stored illumination setpoints. These illumination setpoints are determined by way of a previous reference measurement.
摘要翻译： 可以使用亮场和/或暗场照明来检测晶片（26）上的缺陷。 在本文中，入射到晶片（26）上的辐射对测量结果的可靠性具有实质性的影响。 为了提高测量结果的可靠性，晶片（26）用照明装置（12）照明，照明装置（12）的调整，特别是其亮度和频率的调整是考虑到读出的存储照明 设定值。 这些照明设定点通过先前的参考测量来确定。
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公开(公告)号：US20060103838A1
公开(公告)日：2006-05-18
申请号：US11254024
申请日：2005-10-19
申请人： Joerg Richter , Detlef Michelsson
发明人： Joerg Richter , Detlef Michelsson
IPC分类号： G01N21/88
CPC分类号： H01L22/34 , G01N21/95607
摘要： The examination of a wafer (10) has until now been implemented by means of wafer-to-wafer comparison of the entire wafer (10). In order to ensure timely detection of defects, or the development of defects, on a wafer (10) wafer-to-wafer comparison is limited to particular comparison regions (22) selected by the user.
摘要翻译： 迄今为止，晶片（10）的检查已经通过整个晶片（10）的晶片对晶片比较来实现。 为了确保及时检测缺陷或缺陷的发展，在晶片（10）晶片与晶片之间的比较被限制于由用户选择的特定比较区域（22）。
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