摘要:
A method of manufacturing a semiconductor device in which a surface zone (3) adjoining a surface (2) is formed in a silicon semiconductor body (1) by local application of carbon and dopant atoms, the carbon atoms being provided by means of implantation (4). Halogen atoms are provided simultaneously with the carbon atoms by means of an implantation with ions of a carbon-halogen compound, after which a heat treatment is carried out such that non-bonded halogen atoms are removed from the surface zone (3). Such a method is suitable for making a surface zone (3) which has a greater bandgap than silicon. The surface (3) is suitable, for example, for making an emitter region of a heterojunction bipolar transistor (HBT).
摘要:
A device for directing electrically charged particles towards a target present on a connection place of a support comprises an electrostatic deflection system having deflection plates for controlling a beam of charged particles in two mutually perpendicular directions towards the target with the deflection plates being brought at a desired voltage by means of an electronic control system, and two juxtaposed rods of electrically conductive material being provided on oppositely located sides of the target with the rods being each connected by a resistor to a fixed potential and being furthermore connected to a control device which reacts to a voltage which arises across the resistors if the beam of electrically charged particles impinges on a rod and which, if the beam, during each stroke across the target, impinges on a combination of rods other than the two innermost rods, produces a correction voltage for the control of the deflection plates.
摘要:
In a method of implanting ions in a target, an ion beam is directed onto the target by means of an electrostatic deflection system where the beam describes a pattern over the target dependent on voltage variations on two mutually perpendicular sets of deflection plates. One of the sets of deflection plates is subjected to a varying voltage difference and the other set of deflection plates is subjected to a constant voltage difference so that the ion beam describes a straight line on the target, while at the end of the beam stroke a fixed voltage difference is superimposed on the plates having a constant voltage difference and the variation in the voltage difference is reversed in the plates having a varying voltage difference in such manner that lines described consecutively by the ion beam are always parallel and are situated at a fixed distance from each other.
摘要:
A particle optical apparatus, such as an ion implantation apparatus, an Auger electron spectrometer, an XPS analysis apparatus, and the like, is provided with a radiation source by means of which a wafer or substrate brought into the apparatus can be bombarded by radiation providing for at least a positively charged surface layer of the wafer or substrate. The apparatus further comprises a charge neutralization device with means for providing secondary electron emission and transport means for transporting secondary electrons. This transport means device is provided with a hollow insulating structure for controlled electron transport based on secondary electron emission, particularly in the form of an electron fibre with electrodes at the entrance and exit. The exit of the electron fibre forms a clean secondary electron source.
摘要:
An ion implantation device includes at least two successive deceleration stages the first deceleration stage, looking in the downstream direction, being arranged to decelerate the ion beam, to deflect the ion beam, and to form an intermediate crossover, whereas the second deceleration stage is arranged to decelerate the ion beam further and to subject the beam to a converging effect.
摘要:
A low-energetic charged particle beam, involving only a slight space charge effect, can be obtained by high-frequency deflection of a charged particle beam before deceleration. Using a deceleration element provided with curved surfaces and a slit-shaped aperture, a focusing effect is obtained so that the charged particle beam is imaged along a linear path on a target surface. For implantation of a semiconductor substrate, a uniform and shallow implantation can be achieved at adequate speed by means of a low-energetic ion beam obtained in the above manner.