公开(公告)号：US20070290359A1

公开(公告)日：2007-12-20

申请号：US11846248

申请日：2007-08-28

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  William Murphy ,  Vidhya Ramachandran

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  William Murphy ,  Vidhya Ramachandran

IPC分类号： H01L23/48

CPC分类号： H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method to integrate MIM capacitors into conductive interconnect levels, with low cost impact, and high yield, reliability and performance than existing integration methods is provided. This is accomplished by recessing a prior level dielectric for MIM capacitor level alignment followed by deposition and patterning of the MIM capacitor films. Specifically, the method includes providing a substrate including a wiring level, the wiring level comprising at least one conductive interconnect formed in a dielectric layer; selectively removing a portion of the dielectric layer to recess the dielectric layer below an upper surface of the at least one conductive interconnect; forming a dielectric stack upon the at least one conductive interconnect and the recessed dielectric layer; and forming a metal-insulator-metal (MIM) capacitor on the dielectric stack. The MIM capacitor includes a bottom plate electrode, a dielectric and a top plate electrode. The bottom and top plate electrodes can comprise the same or different conductive metal.

摘要翻译： 提供了一种将MIM电容器集成到导电互连级别中的方法，具有低成本影响，并且提供了比现有集成方法高的产量，可靠性和性能。 这通过将用于MIM电容器电平对准的先前级别的电介质凹入，然后MIM电容器膜的沉积和图案化来实现。 具体地，该方法包括提供包括布线层的衬底，所述布线层包括形成在电介质层中的至少一个导电布线; 选择性地去除所述电介质层的一部分以使所述电介质层在所述至少一个导电互连的上表面下方凹陷; 在所述至少一个导电互连和所述凹入的介电层上形成电介质叠层; 以及在介电叠层上形成金属绝缘体金属（MIM）电容器。 MIM电容器包括底板电极，电介质和顶板电极。 底板和顶板电极可以包括相同或不同的导电金属。

公开(公告)号：US20050274987A1

公开(公告)日：2005-12-15

申请号：US10709829

申请日：2004-06-01

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  William Murphy ,  Vidhya Ramachandran

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  William Murphy ,  Vidhya Ramachandran

IPC分类号： H01L21/00 ,  H01L23/52 ,  H01L23/522

CPC分类号： H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method to integrate MIM capacitors into conductive interconnect levels, with low cost impact, and high yield, reliability and performance than existing integration methods is provided. This is accomplished by recessing a prior level dielectric for MIM capacitor level alignment followed by deposition and patterning of the MIM capacitor films. Specifically, the method includes providing a substrate including a wiring level, the wiring level comprising at least one conductive interconnect formed in a dielectric layer; selectively removing a portion of the dielectric layer to recess the dielectric layer below an upper surface of the at least one conductive interconnect; forming a dielectric stack upon the at least one conductive interconnect and the recessed dielectric layer; and forming a metal-insulator-metal (MIM) capacitor on the dielectric stack. The MIM capacitor includes a bottom plate electrode, a dielectric and a top plate electrode. The bottom and top plate electrodes can comprise the same or different conductive metal.

摘要翻译： 提供了一种将MIM电容器集成到导电互连级别中的方法，具有低成本影响，并且提供了比现有集成方法高的产量，可靠性和性能。 这通过将用于MIM电容器电平对准的先前级别的电介质凹入，然后MIM电容器膜的沉积和图案化来实现。 具体地，该方法包括提供包括布线层的衬底，所述布线层包括形成在电介质层中的至少一个导电布线; 选择性地去除所述电介质层的一部分以使所述电介质层在所述至少一个导电互连的上表面下方凹陷; 在所述至少一个导电互连和所述凹入的介电层上形成电介质叠层; 以及在介电叠层上形成金属绝缘体金属（MIM）电容器。 MIM电容器包括底板电极，电介质和顶板电极。 底板和顶板电极可以包括相同或不同的导电金属。

公开(公告)号：US20080042798A1

公开(公告)日：2008-02-21

申请号：US11848263

申请日：2007-08-31

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

IPC分类号： H01C1/08

CPC分类号： H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

摘要： A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

公开(公告)号：US20060152333A1

公开(公告)日：2006-07-13

申请号：US10905546

申请日：2005-01-10

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

IPC分类号： H01C1/08

CPC分类号： H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

摘要： A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

摘要翻译： 提供带散热片的电阻。 散热器包括具有导热性高的金属或其它热导体的导电路径。 为了避免使用热导体将电阻器短路接地，在热导体和电阻体之间插入有一层薄导电电绝缘体。 因此，电阻器可承载大量的电流，因为高导电性热导体将热量从电阻器传导到散热器。 除了降低寄生电容和其他寄生电效应之外，提供各种配置的导热体和散热片，提供良好的导热性能，这将降低电阻器的高频响应。

公开(公告)号：US20110113461A1

公开(公告)日：2011-05-12

申请号：US12900402

申请日：2010-10-07

申请人： Robert Laganiere ,  William Murphy ,  Pascal Blais ,  Jason Philips

发明人： Robert Laganiere ,  William Murphy ,  Pascal Blais ,  Jason Philips

IPC分类号： H04N7/173

CPC分类号： H04N7/183 ,  G08B13/19656 ,  G08B13/19669 ,  H04N7/185 ,  H04N21/23113 ,  H04N21/23418 ,  H04N21/2743 ,  H04N21/64322

摘要： A method comprises receiving first video data at a source end, the first video data including video data relating to an event of interest captured using a video camera disposed at the source end. The first video data is retrievably stored in a memory storage device. Video analytics is performed on the first video data to identify a first portion of the first video data that is representative of the event of interest. Subsequently, portions of the first video data other than the first portion are deleted from the memory storage device.

摘要翻译： 一种方法包括：在源端接收第一视频数据，所述第一视频数据包括与使用设置在所述源端处的摄像机捕获的关注事件相关的视频数据。 第一视频数据被可检索地存储在存储器存储设备中。 对第一视频数据执行视频分析，以识别表示感兴趣事件的第一视频数据的第一部分。 随后，从存储器存储装置中删除第一部分以外的第一视频数据的部分。

公开(公告)号：US20110109742A1

公开(公告)日：2011-05-12

申请号：US12900374

申请日：2010-10-07

申请人： Robert Laganiere ,  William Murphy ,  Pascal Blais ,  Jason Phillips

发明人： Robert Laganiere ,  William Murphy ,  Pascal Blais ,  Jason Phillips

IPC分类号： H04N5/225 ,  H04N7/18

CPC分类号： H04N7/185 ,  H04N21/222 ,  H04N21/23103 ,  H04N21/2405

摘要： A method comprises transmitting video data from a source end to a central server via a Wide Area Network (WAN). The video data includes video data relating to an event of interest, and is captured using a video camera disposed at the source end. Via a plurality of streams, the video data is transmitted from the central server to each one of a plurality of different video analytics engines. Different video analytics processing of the video data is performed using each one of the plurality of different video analytics engines.

摘要翻译： 一种方法包括经由广域网（WAN）将视频数据从源端发送到中央服务器。 视频数据包括与感兴趣的事件相关的视频数据，并且使用设置在源端的摄像机进行拍摄。 通过多个流，将视频数据从中央服务器发送到多个不同的视频分析引擎中的每一个。 使用多个不同的视频分析引擎中的每一个来执行视频数据的不同视频分析处理。

公开(公告)号：US07761482B2

公开(公告)日：2010-07-20

申请号：US11407999

申请日：2006-04-21

申请人： Neal D. Goldman ,  William Murphy

发明人： Neal D. Goldman ,  William Murphy

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06Q40/06 ,  Y10S707/99933 ,  Y10S707/99945

摘要： A system and method locates a number in a source document by presenting and manipulating data on private and public companies. A central database of financial information is established. A target entity is entered within the central database by a user, and financial information of the target entity from the central database is displayed. Once a number within the display of financial information is selected, the system and method determines which document is the source document containing the numbers, searches through the source document for the number, identifies the location of the number in the source document and highlights and displays the number as it appears in the source document to the user.

摘要翻译： 系统和方法通过呈现和操纵私人和上市公司的数据来定位源文档中的数字。 建立了财务信息的中央数据库。 目标实体由用户在中央数据库中输入，并且显示来自中央数据库的目标实体的财务信息。 一旦选择财务信息显示中的数字，系统和方法确定哪个文档是包含数字的源文档，通过源文档搜索数字，识别源文档中的数字的位置并突出显示 在源文档中显示给用户的号码。

公开(公告)号：US20080032455A1

公开(公告)日：2008-02-07

申请号：US11873146

申请日：2007-10-16

申请人： William Murphy ,  Ryan Riegle ,  Richard Shields ,  David Vos

发明人： William Murphy ,  Ryan Riegle ,  Richard Shields ,  David Vos

IPC分类号： H01L21/768

CPC分类号： H05K1/0209 ,  B23K1/0016 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/0401

摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

摘要翻译： 公开了一种用印刷线路板封装半导体部件的方法。 该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在 将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

公开(公告)号：US20070249311A1

公开(公告)日：2007-10-25

申请号：US11406538

申请日：2006-04-19

申请人： William Murphy

发明人： William Murphy

IPC分类号： H04B1/06

CPC分类号： H03H7/255

摘要： Disclosed herein is a system for the variable attenuation of broadband differential signals. An exemplary system of variable attenuation of broadband differential signals includes attenuation devices arranged such that an attenuation device on the positive side of the differential signal has a corresponding attenuation device on the negative side of the differential signal with both of the corresponding attenuation devices on the same semiconductor die.

摘要翻译： 这里公开了一种用于宽带差分信号的可变衰减的系统。 宽带差分信号的可变衰减的示例性系统包括衰减器件，其布置成使得差分信号的正侧上的衰减器件在差分信号的负侧具有相应的衰减器件，同时两个相应的衰减器件相同 半导体芯片。

公开(公告)号：US20070140948A1

公开(公告)日：2007-06-21

申请号：US11303510

申请日：2005-12-16

申请人： Thomas Palmer ,  William Murphy

发明人： Thomas Palmer ,  William Murphy

IPC分类号： C01B15/00

CPC分类号： C10G27/04 ,  C10G27/12 ,  C10G53/14

摘要： This invention relates to a method for generating peroxides in petroleum streams. More particularly, peroxides may be generated in-situ by combining the petroleum stream with a high neutralization number (HNN) crude and adding an oxygen-containing stream. HNN crudes contain molecules sufficient for peroxide generation. Peroxides may also be added directly to the petroleum stream without the need for addition of a HNN crude. Oil soluble metal catalysts are added to aid in peroxide formation.

摘要翻译： 本发明涉及在石油流中产生过氧化物的方法。 更具体地，过氧化物可以通过将石油流与高中和数（HNN）原油组合并加入含氧流而原地产生。 HNN原油含有足够的过氧化物产生的分子。 过氧化物也可以直接加入到石油流中，而不需要添加HNN原油。 添加油溶性金属催化剂以帮助形成过氧化物。