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公开(公告)号：US6043557A
公开(公告)日：2000-03-28
申请号：US138961
申请日：1998-08-24
IPC分类号： H01L21/60 , H01L23/13 , H01L23/495 , H01L25/16
CPC分类号： H01L24/32 , H01L23/13 , H01L23/4951 , H01L23/49531 , H01L24/06 , H01L24/49 , H01L25/16 , H01L2224/04042 , H01L2224/05554 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/4911 , H01L2224/49175 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/351
摘要： A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base may be formed of metal, stamped in a continuous strip consisting of many individual platform segments, the individual segments being excised during assembly.
摘要翻译： 平台携带用于通过引线接合操作进行处理和对准的集成电路（IC）（20），提供互连，并且以均匀的受控粘合剂厚度支撑屏蔽IC。 平台基座（10）具有平坦部分，该平坦部分可以具有通过引线接合焊盘（140）延伸芯片的长度的槽（30）。 IC使用铸造或包含的粘合剂，环氧树脂或胶带（50）安装到平台底座上，其提供至少一个粘合剂表面。 对于几排导线焊盘，可能有几个插槽。 如果平台承载多于一个芯片，则平台基座可以具有每个芯片一个或多个插槽（30,40）。 平台可以承载其他组件（110,120）。 电路（90）可以打印在平台基座的一侧或两侧，具有中等电阻，以阻尼噪声信号的振铃。 引线通过插槽（30）制成，将IC焊盘与电路连接起来。 平台基座可以在一侧或两侧具有导电区域（90），以提供通过引线键连接的屏蔽或母线。 导电总线元件（60和70）可以附带带（80）。 平台可以具有用于与在IC上延伸的更高级别的电路和/或窄引线（1220）互连的端子（100）。 平台基座可以由金属制成，冲压在由许多单独的平台段组成的连续条中，在组装期间将各个段切除。
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公开(公告)号：US5889320A
公开(公告)日：1999-03-30
申请号：US843779
申请日：1997-04-21
IPC分类号： H01L21/60 , H01L23/13 , H01L23/495 , H01L25/16 , H01L23/04
CPC分类号： H01L24/32 , H01L23/13 , H01L23/4951 , H01L23/49531 , H01L24/06 , H01L24/49 , H01L25/16 , H01L2224/04042 , H01L2224/05554 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/4911 , H01L2224/49175 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/351
摘要： A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base is preferably made from epoxy-glass laminate with conductive layers of a clad composite with preferred resistivity and preferred thermal expansion. Platform bases may be composite metal, stamped in a continuous strip, with platform segments excised during assembly. Another embodiment provides a lead paddle assembly in which two tape application platforms hold an IC in a rigid assembly.
摘要翻译： 平台携带用于通过引线接合或TAB操作进行处理和对准的集成电路（IC）（20），提供互连，并且以均匀的受控粘合剂厚度支撑屏蔽IC。 平台基座（10）具有平坦部分，该平坦部分可以具有通过引线接合焊盘（140）延伸芯片的长度的槽（30）。 IC使用铸造或包含的粘合剂，环氧树脂或胶带（50）安装到平台底座上，其提供至少一个粘合剂表面。 对于几排导线焊盘，可能有几个插槽。 如果平台承载多于一个芯片，则平台基座可以具有每个芯片一个或多个插槽（30,40）。 平台可以承载其他组件（110,120）。 电路（90）可以打印在平台基座的一侧或两侧，具有中等电阻，以阻尼噪声信号的振铃。 引线通过插槽（30）制成，将IC焊盘与电路连接起来。 平台基座可以在一侧或两侧具有导电区域（90），以提供通过引线键连接的屏蔽或母线。 导电总线元件（60和70）可以附带带（80）。 平台可以具有用于与在IC上延伸的更高级别的电路和/或窄引线（1220）互连的端子（100）。 平台基部优选由具有优选电阻率和优选热膨胀的包层复合材料的导电层的环氧玻璃层压体制成。 平台底座可以是复合金属，冲压成连续条带，在组装过程中切除平台段。 另一实施例提供了一种引线板组件，其中两个带应用平台将IC保持在刚性组件中。
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公开(公告)号：US5696032A
公开(公告)日：1997-12-09
申请号：US774540
申请日：1996-12-30
IPC分类号： H01L21/60 , H01L23/13 , H01L23/495 , H01L25/16
CPC分类号： H01L24/32 , H01L23/13 , H01L23/4951 , H01L23/49531 , H01L24/06 , H01L24/49 , H01L25/16 , H01L2224/04042 , H01L2224/05554 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/4911 , H01L2224/49175 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/351
摘要： An integrated-circuit manufacturing process uses a platform to carry an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, to provide interconnections, and to support the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base is preferably made from epoxy-glass laminate with conductive layers of a clad composite with preferred resistivity and preferred thermal expansion. Platform bases may be composite metal, stamped in a continuous strip, with platform segments excised during assembly. Another embodiment provides a lead paddle assembly in which two tape application platforms hold an IC in a rigid assembly.
摘要翻译： 集成电路制造工艺使用平台来承载通过引线接合或TAB操作来处理和对准的集成电路（IC）（20），以提供互连，并且以均匀的受控粘合剂厚度来支撑屏蔽IC。 平台基座（10）具有平坦部分，该平坦部分可以具有通过引线接合焊盘（140）延伸芯片的长度的槽（30）。 IC使用铸造或包含的粘合剂，环氧树脂或胶带（50）安装到平台底座上，其提供至少一个粘合剂表面。 对于几排导线焊盘，可能有几个插槽。 如果平台承载多于一个芯片，则平台基座可以具有每个芯片一个或多个插槽（30,40）。 平台可以承载其他组件（110,120）。 电路（90）可以打印在平台基座的一侧或两侧，具有中等电阻，以阻尼噪声信号的振铃。 引线通过插槽（30）制成，将IC焊盘与电路连接起来。 平台基座可以在一侧或两侧具有导电区域（90），以提供通过引线键连接的屏蔽或母线。 导电总线元件（60和70）可以附带带（80）。 平台可以具有用于与在IC上延伸的更高级别的电路和/或窄引线（1220）互连的端子（100）。 平台基部优选由具有优选电阻率和优选热膨胀的包层复合材料的导电层的环氧玻璃层压体制成。 平台底座可以是复合金属，冲压成连续条带，在组装期间切除平台段。 另一实施例提供了一种引线板组件，其中两个带应用平台将IC保持在刚性组件中。
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公开(公告)号：US5661336A
公开(公告)日：1997-08-26
申请号：US237025
申请日：1994-05-03
IPC分类号： H01L21/60 , H01L23/13 , H01L23/495 , H01L25/16
CPC分类号： H01L24/32 , H01L23/13 , H01L23/4951 , H01L23/49531 , H01L24/06 , H01L24/49 , H01L25/16 , H01L2224/04042 , H01L2224/05554 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/4911 , H01L2224/49175 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/351
摘要： A platform serves to carry an integrated circuit chip (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the IC chip in its use environment. The platform base (10) has a flat portion which may have a slot (30) passing through it and extending approximately the length of an IC chip (which has wire-bond pads (140), some of which may be near a chip axis). The IC chip is mounted to the platform base with tape (50), which provides at least one adhesive surface. The tape may be a cast or contained adhesive or epoxy with or without a backing layer, or it may be a thermoplastic or thermo-setting plastic. TAB or wire-bond pads are aligned with respect to the platform slot. If the chip has more than one row of wire-bond pads, the platform may have more than one slot. If more than one chip is mounted to the platform, the platform's base may have one or more slots (30, 40) per chip. Circuitry (90) may be printed on one or both sides of the platform base. The circuitry is preferably made to have a relatively high sheet resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting pads on the IC chip with printed circuitry. The platform base may have an electrically conductive area (90) on one or both sides to provide a shield, ground plane and/or power bus, connected by wire bonds to pads of the IC chip and to a higher level of circuitry. Conductive bus elements (60 and 70) having continuous wire-bond areas may be provided, attached with tape (80). The platform may have terminals (100) for interconnection with a higher level of circuitry and/or narrow leads (1220) extending over the IC chip. Components (110, 120) other than the integrated circuit chip may also be carried on the tape application platform.
摘要翻译： 平台用于承载通过引线接合或TAB操作进行处理和对准的集成电路芯片（20），提供互连，并在其使用环境中支持IC芯片。 平台基座（10）具有平坦部分，该平坦部分可以具有通过其的狭槽（30），并且大致延伸IC芯片的长度（其具有导线接合焊盘（140），其中一些可以接近芯片轴线 ）。 IC芯片通过胶带（50）安装到平台底座上，该胶带提供至少一个胶粘剂表面。 胶带可以是具有或不具有背衬层的铸塑或包含的粘合剂或环氧树脂，或者它可以是热塑性或热固性塑料。 TAB或引线接合焊盘相对于平台槽对准。 如果芯片具有多排导线焊盘，则平台可能有多个插槽。 如果将多于一个芯片安装到平台上，则平台的基座可以具有每个芯片一个或多个插槽（30,40）。 电路（90）可以打印在平台基座的一侧或两侧。 电路优选地具有相对较高的薄层电阻率以阻尼噪声信号的振铃。 引线通过插槽（30），IC芯片上的连接焊盘与印刷电路制成。 平台基座可以在一侧或两侧上具有导电区域（90），以提供屏蔽，接地平面和/或电力总线，其通过引线连接到IC芯片的焊盘和更高级别的电路。 可以提供具有连续导线接合区域的导电总线元件（60和70），其连接带（80）。 平台可以具有用于与在IC芯片上延伸的更高级别的电路和/或窄引线（1220）互连的端子（100）。 除了集成电路芯片之外的组件（110,120）也可以在带应用平台上承载。
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