公开(公告)号：US20200048463A9

公开(公告)日：2020-02-13

申请号：US15769335

申请日：2016-10-12

申请人： Dow Corning Toray Co., Ltd.

发明人： Ryota DOGEN ,  Haruna YAMAZAKI ,  Shin YOSHIDA ,  Makoto YOSHITAKE

IPC分类号： C08L83/08 ,  C08J5/18 ,  B29C43/30 ,  B29C35/08

摘要： Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

公开(公告)号：US20190112430A1

公开(公告)日：2019-04-18

申请号：US16082669

申请日：2017-03-07

申请人： Dow Silicones Corporation ,  Dow Corning Toray Co., Ltd.

发明人： Ju Young YOOK ,  Makoto YOSHITAKE

IPC分类号： C08G77/20 ,  C08K5/101 ,  C08K5/13 ,  C08K5/37 ,  C08K5/5313

摘要： A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having from 2 to 12 carbons, R2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1≤(a+b)≤2.5 and 0.001≤a/(a+b)≤0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.

公开(公告)号：US20180305547A1

公开(公告)日：2018-10-25

申请号：US15769335

申请日：2016-10-12

申请人： Dow Corning Toray Co., Ltd.

发明人： Ryota DOGEN ,  Haruna YAMAZAKI ,  Shin YOSHIDA ,  Makoto YOSHITAKE

IPC分类号： C08L83/08 ,  C08J5/18 ,  B29C43/30 ,  B29C35/08

CPC分类号： C08L83/08 ,  B29C35/0805 ,  B29C43/30 ,  B29C43/305 ,  B29C2035/0827 ,  B29K2083/00 ,  B29K2105/0097 ,  C08G75/045 ,  C08G77/16 ,  C08G77/20 ,  C08G77/28 ,  C08G81/00 ,  C08J5/18 ,  C08J2383/04 ,  C08J2483/08 ,  C08K5/0025 ,  C08L83/00 ,  C09J183/04

摘要： Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

公开(公告)号：US20170253700A1

公开(公告)日：2017-09-07

申请号：US15506834

申请日：2015-08-26

申请人： Dow Corning Toray Co., Ltd.

发明人： Ryota DOGEN ,  Haruna YAMAZAKI ,  Makoto YOSHITAKE

IPC分类号： C08G77/04 ,  H01L33/56

CPC分类号： C08G77/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08L83/04 ,  C09D183/04 ,  H01L23/29 ,  H01L23/31 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00 ,  C08L83/00 ,  C08K5/56

摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.

公开(公告)号：US20170166701A1

公开(公告)日：2017-06-15

申请号：US15115923

申请日：2015-02-16

申请人： Dow Corning Corporation ,  Dow Corning Toray Co., Ltd.

发明人： Gunn JO ,  Haruna YAMAZAKI ,  Ju Young YOOK ,  Makoto YOSHITAKE

IPC分类号： C08G77/18 ,  C08G77/08 ,  C09J183/06

CPC分类号： C08G77/38 ,  C08G77/08 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  C08G2170/20 ,  C08K3/22 ,  C08K5/56 ,  C08K2201/00 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L23/296

摘要： This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.