公开(公告)号：US12043721B2

公开(公告)日：2024-07-23

申请号：US17192491

申请日：2021-03-04

Applicant: Ascend Performance Materials Operations LLC

Inventor： Vikram Gopal ,  Wai-shing Yung ,  Albert Ortega

IPC: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/11 ,  B29C48/00 ,  B29K77/00 ,  B29K105/00 ,  C08K3/02 ,  C08L77/06 ,  D01F6/60 ,  D02G3/04 ,  D02G3/44

CPC classification number: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/1192 ,  B29C48/022 ,  C08L77/06 ,  D01F6/60 ,  D02G3/047 ,  D02G3/448 ,  D02G3/449 ,  B29K2077/00 ,  B29K2105/0011 ,  B29K2995/0077 ,  B29K2995/0092 ,  C08K2003/026 ,  C08K2003/0893 ,  C08K2201/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/12 ,  D10B2331/021 ,  D10B2401/02 ,  D10B2401/13

Abstract: A polymer composition having antimicrobial properties, the composition comprising from 50 wt % to 99.99 wt % of a polymer, from 10 wppm to 900 wppm of zinc, less than 1000 wppm of phosphorus, and less than 10 wppm coupling agent and/or surfactant, wherein zinc is dispersed within the polymer; and wherein fibers formed from the polymer composition demonstrate a Klebsiella pneumonia log reduction greater than 0.90, as determined via ISO20743:2013 and/or an Escherichia coli log reduction greater than 1.5, as determined via ASTM E3160 (2018).

公开(公告)号：US20230340214A1

公开(公告)日：2023-10-26

申请号：US18133206

申请日：2023-04-11

Applicant: Duravit Aktiengesellschaft

Inventor： Thomas STAMMEL

IPC: C08J5/04 ,  C08J7/04 ,  C08K3/013

CPC classification number: C08J5/043 ,  C08J7/04 ,  C08K3/013 ,  C08J2363/00 ,  C08J2497/02 ,  C08K2201/00

Abstract: A sanitaryware article having a support formed from a cured resin having embedded reinforcing fibers, which defines the shape of the sanitaryware article and which at least on a facing side bears a cured gelcoat layer.

公开(公告)号：US09751988B2

公开(公告)日：2017-09-05

申请号：US15115923

申请日：2015-02-16

Applicant: Dow Corning Corporation ,  Dow Corning Toray Co., Ltd.

Inventor： Gunn Jo ,  Haruna Yamazaki ,  Ju Young Yook ,  Makoto Yoshitake

IPC: C08G77/38 ,  H01L23/29 ,  C08G77/20 ,  C08L83/04 ,  C08G77/08

CPC classification number: C08G77/38 ,  C08G77/08 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  C08G2170/20 ,  C08K3/22 ,  C08K5/56 ,  C08K2201/00 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L23/296

Abstract: This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

公开(公告)号：US20140142571A1

公开(公告)日：2014-05-22

申请号：US14082394

申请日：2013-11-18

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  James P. Shepherd

IPC: A61L29/06 ,  A61B18/14 ,  H05K1/09 ,  C08K3/22

CPC classification number: A61L29/06 ,  A61B18/1492 ,  C08K3/22 ,  C08K3/34 ,  C08K2201/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/31 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/09118 ,  H05K2203/107 ,  Y10T428/139 ,  C08K3/08 ,  C08L67/00 ,  C08L67/03

Abstract: A polymer composition that can be readily melt-extruded into a shaped three-dimensional substrate (e.g., tube) and also applied with a conductive element using a laser direct structuring (“LDS”) process. In this regard, the composition contains a thermotropic liquid crystalline polymer and a laser activatable additive. The specific nature of the polymer and relative concentration of the polymer and additive are selectively controlled so that the resulting composition can possess both a relatively high melt viscosity and melt strength.

Abstract translation: 可以容易地熔融挤出成型的三维基板（例如管）并且还使用激光直接结构化（“LDS”）工艺施加导电元件的聚合物组合物。 在这方面，组合物含有热致液晶聚合物和激光可激活添加剂。 选择性地控制聚合物的具体性质和聚合物和添加剂的相对浓度，使得所得组合物具有相对高的熔体粘度和熔体强度。

公开(公告)号：US20180009984A1

公开(公告)日：2018-01-11

申请号：US15608151

申请日：2017-05-30

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Tomoyuki MIZUNASHI ,  Yuusuke TAKAMIZAWA

IPC: C08L83/06 ,  C08G77/42 ,  C08G77/14 ,  C09K11/59 ,  C08G77/06

CPC classification number: C08L83/06 ,  C08G77/06 ,  C08G77/14 ,  C08G77/18 ,  C08G77/42 ,  C08K5/17 ,  C08K2201/00 ,  C08L83/04 ,  C08L83/16 ,  C09K11/02 ,  C09K11/59 ,  C08L83/00

Abstract: A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

公开(公告)号：US09187665B2

公开(公告)日：2015-11-17

申请号：US13577980

申请日：2010-03-15

Applicant: Sundar Vasudevan ,  Richard J Mcmanus ,  Palitha Wickramanayake

Inventor： Sundar Vasudevan ,  Richard J Mcmanus ,  Palitha Wickramanayake

IPC: C08G18/08 ,  C08G18/80 ,  C08G73/10 ,  C08K3/20 ,  C08K5/06 ,  C08K5/34 ,  C08K5/48 ,  C08L75/00 ,  C09D5/00 ,  C09D11/00 ,  C09D11/10 ,  C09D11/38 ,  C08K5/09 ,  C09D11/324

CPC classification number: C09D11/38 ,  C08K5/09 ,  C08K2201/00 ,  C09D11/324

Abstract: An ink composition for inkjet printing is disclosed herein. The ink composition includes a self-dispersed carbon black pigment with alkali metal counter ions, polyurethane, and an aqueous carrier. The aqueous carrier includes water, at least one water-soluble organic solvent, and at least one surfactant. In one embodiment, the aqueous carrier further includes an additive having a polar head group and a C8-C18 hydrocarbon tail.

Abstract translation: 本文公开了一种用于喷墨印刷的油墨组合物。 油墨组合物包括具有碱金属抗衡离子的自分散炭黑颜料，聚氨酯和水性载体。 水性载体包括水，至少一种水溶性有机溶剂和至少一种表面活性剂。 在一个实施方案中，水性载体还包括具有极性头基和C8-C18烃尾的添加剂。

公开(公告)号：US20150315427A1

公开(公告)日：2015-11-05

申请号：US14654084

申请日：2013-12-20

Applicant: DOW CORNING CORPORATION ,  DOW CORNING TORAY CO., LTD.

Inventor： Shin Yoshida ,  Makoto Yoshitake ,  Haruna Yamazaki ,  Masaaki Amako ,  Steven Swier ,  Toshiki Nakata

IPC: C09J143/04 ,  H01L21/56 ,  C08K3/34 ,  B32B3/30 ,  C08K3/22 ,  B32B27/28 ,  B32B27/08 ,  B32B7/02 ,  H01L23/10 ,  C08K3/36

CPC classification number: H01L23/296 ,  B32B3/30 ,  B32B7/02 ,  B32B27/08 ,  B32B27/283 ,  B32B2250/24 ,  B32B2264/104 ,  B32B2307/418 ,  B32B2307/536 ,  B32B2457/14 ,  C08G77/50 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/2241 ,  C08K2201/00 ,  C09D183/10 ,  C09J183/10 ,  H01L21/56 ,  H01L24/73 ,  H01L24/97 ,  H01L33/502 ,  H01L33/56 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/31663 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85

Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Abstract translation: 本发明涉及一种用于压缩成型或层压的热熔性可固化硅氧烷组合物和包含该组合物的至少一层的层压板，以及使用它们的半导体器件及其制造方法。 根据本发明，可以有效地制造设置有半球形透镜或圆顶形密封件的半导体器件。 在本发明中，容易控制密封件的形状，并且密封件不含任何气泡。 在本发明中，除了密封之外，还容易控制半导体器件的涂层的厚度。

公开(公告)号：US20130143985A1

公开(公告)日：2013-06-06

申请号：US13705067

申请日：2012-12-04

Applicant: Blacklidge Emulsions, Inc.

Inventor： Roy Brittany Blacklidge ,  Condrin Daranga ,  Scott Watson ,  Sonia Serna ,  Joseph McKay

IPC: C08J3/20

CPC classification number: C08J3/20 ,  C08J3/005 ,  C08J2395/00 ,  C08J2419/00 ,  C08K2201/00 ,  C08L17/00 ,  C08L95/00 ,  E01C7/265

Abstract: We disclose a method of making an asphalt composition containing large quantities of ground tire rubber. Over 20% GTR by weight can be used in the asphalt composition without the GTR settling out. The method comprises a series of heating and blending and using a GTR stabilizer.

Abstract translation: 我们公开了制备含有大量地面轮胎橡胶的沥青组合物的方法。 沥青组合物中可以使用超过20％的GTR，而不需要GTR沉降。 该方法包括一系列加热和混合并使用GTR稳定剂。

公开(公告)号：US20120329921A1

公开(公告)日：2012-12-27

申请号：US13577980

申请日：2010-03-15

Applicant: Sundar Vasudevan ,  Richard J Mcmanus ,  Palitha Wickramanayake

Inventor： Sundar Vasudevan ,  Richard J Mcmanus ,  Palitha Wickramanayake

IPC: C09D11/10

CPC classification number: C09D11/38 ,  C08K5/09 ,  C08K2201/00 ,  C09D11/324

Abstract: An ink composition for inkjet printing is disclosed herein. The ink composition includes a self-dispersed carbon black pigment with alkali metal counter ions, polyurethane, and an aqueous carrier. The aqueous carrier includes water, at least one water-soluble organic solvent, and at least one surfactant. In one embodiment, the aqueous carrier further includes an additive having a polar head group and a C8-C18 hydrocarbon tail.

Abstract translation: 本文公开了一种用于喷墨印刷的油墨组合物。 油墨组合物包括具有碱金属抗衡离子的自分散炭黑颜料，聚氨酯和水性载体。 水性载体包括水，至少一种水溶性有机溶剂和至少一种表面活性剂。 在一个实施方案中，水性载体还包括具有极性头基和C8-C18烃尾的添加剂。

公开(公告)号：US20240327611A1

公开(公告)日：2024-10-03

申请号：US18741386

申请日：2024-06-12

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuko SHIOTANI ,  Mayumi IIDA ,  Marina AIHARA ,  Yoshito TANAKA ,  Masahiro HIGASHI ,  Kanako TAKAHASHI ,  Norimasa UESUGI

IPC: C08K5/20 ,  C08F220/18

CPC classification number: C08K5/20 ,  C08F220/1807 ,  C08K2201/00 ,  C08K2201/005

Abstract: The present disclosure provides organic fine particles and a slip-resistance agent composition which are capable of providing excellent slip-resistance to a base material. Said organic fine particles contain a polymer having a repeating unit formed of: (I) a hydrophobic monomer that has a single ethylenically unsaturated double bond and at least one branched or cyclic hydrocarbon group having 3-40 carbon atoms; and, if necessary, (II) a cross-linking monomer having at least two ethylenically unsaturated double bonds. Said slip-resistance agent composition contains (A) the organic fine particles and (B) an aqueous medium.