公开(公告)号：US20160297985A1

公开(公告)日：2016-10-13

申请号：US15055987

申请日：2016-02-29

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Zhifeng BAI ,  Michael K. GALLAGHER ,  Zidong WANG ,  Christopher J. TUCKER ,  Matthew T. BISHOP ,  Elissei IAGODKINE ,  Mark S. OLIVER

IPC分类号： C09D143/04 ,  C09D7/12 ,  B05D3/00 ,  C09D5/00

CPC分类号： C09D143/04 ,  B05D3/007 ,  B05D3/10 ,  C08G61/02 ,  C08G61/12 ,  C08G2261/3424 ,  C08G2261/344 ,  C08G2261/65 ,  C08L25/10 ,  C08L25/16 ,  C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L51/08 ,  C08L63/00 ,  C08L71/02 ,  C09D5/00 ,  C09D7/65 ,  C09J165/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H05K3/285 ,  C08L65/00

摘要： Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

摘要翻译： 提供具有改善的韧性的芳族环烯烃聚合物。 还提供了具有改善的韧性的用于涂覆芳基环丁烯聚合物的组合物和方法。

公开(公告)号：US20160122601A1

公开(公告)日：2016-05-05

申请号：US14992251

申请日：2016-01-11

申请人： Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

发明人： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC分类号： C09J143/04 ,  B32B7/12 ,  H01L21/683 ,  B32B7/06 ,  C09J171/02 ,  C08K5/06

CPC分类号： C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

摘要： Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

公开(公告)号：US20190062626A1

公开(公告)日：2019-02-28

申请号：US16070300

申请日：2017-02-20

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Jessica Ye Huang ,  Zhifeng BAI ,  Liang Chen ,  Jake Joo ,  Ing-Feng Hu ,  James C. Taylor

IPC分类号： C09K11/02 ,  C08F222/10 ,  C08K3/013

摘要： A polymer composite comprising quantum dots; said polymer composite comprising: (a) quantum dots; (b) polymerized units of a first compound having at least one readily polymerizable vinyl group, a molecular weight from 300 to 20,000 and at least one continuous acyclic hydrocarbyl chain of at least five carbon atoms; and (c) polymerized units of a second compound having at least one readily polymerizable vinyl group and a molecular weight from 100 to 750; wherein a readily polymerizable vinyl group is part of a (meth)acrylate ester group or is attached directly to an aromatic ring, and the molecular weight of the first compound minus the molecular weight of the second compound is at least 100.

公开(公告)号：US20160257861A1

公开(公告)日：2016-09-08

申请号：US14636981

申请日：2015-03-03

申请人： Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

发明人： Mark S. OLIVER ,  Zhifeng BAI ,  Michael K. GALLAGHER

IPC分类号： C09J11/06 ,  H01L21/683 ,  H01L23/00 ,  C09J4/00

CPC分类号： C09J11/06 ,  C09J4/00 ,  H01L21/6835 ,  H01L24/10 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13147 ,  H01L2224/13647

摘要： Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

摘要翻译： 含有粘合剂材料，脱模添加剂和铜钝化剂的组合物适用于临时粘合两个表面，例如半导体衬底活性侧和载体衬底。 这些组合物可用于制造电子器件，其中期望将组分临时粘合到具有铜表面的基底上。

公开(公告)号：US20150118488A1

公开(公告)日：2015-04-30

申请号：US14069348

申请日：2013-10-31

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC分类号： H01L21/683 ,  C09J143/04

CPC分类号： C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

摘要： Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

摘要翻译： 含有粘合剂材料，脱模添加剂和增容剂的组合物适用于临时粘接两个表面，如晶片活性侧和基材。 这些组合物可用于制造其中期望将组分临时粘合到基底上的电子器件。

公开(公告)号：US20220363945A1

公开(公告)日：2022-11-17

申请号：US17624318

申请日：2020-07-01

申请人： DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION ,  ROHM AND HAAS COMPANY

发明人： Michael P. TATE ,  Zhifeng BAI ,  Jodi M. MECCA ,  Tirtha CHATTERJEE ,  Yiyong HE ,  Michael BRASSEUR ,  Sudhakar BALIJEPALLI ,  John J. RABASCO

IPC分类号： C09D183/06 ,  C09D5/02 ,  C09D7/61

摘要： A liquid applied, silicone-based air and water barrier coating composition and its use as a silicone-based air and water barrier is provided. The barrier is generally vapour permeable and suitable for the construction industry. The liquid coating composition generally has a shelf-life of at least 9 months. The liquid coating composition comprises: (i) a crosslinked polysiloxane dispersion comprising (c) a surfactant and (d) water; (ii) a combination of rheology modifiers and at least one of the following ingredients: (iii) one or more fillers and/or (iv) one or more stabilizers.