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公开(公告)号：US10939544B2
公开(公告)日：2021-03-02
申请号：US15976110
申请日：2018-05-10
申请人： Dura Operating, LLC
摘要： A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.
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2.发明申请公开(公告)号：US20200064544A1
公开(公告)日：2020-02-27
申请号：US16109196
申请日：2018-08-22
申请人： Dura Operating, LLC
摘要： A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material is positioned over the light emitting diodes and the electronic components. The light guide includes: a contact surface directly contacting the first portion of the first face except at locations of the light emitting diodes; a cavity created in the contact surface, the electronics components located within the cavity when the contact surface directly contacts the first portion of the first face; and a through hole extending through a body of the light guide and opening into the cavity.
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公开(公告)号：US10952323B2
公开(公告)日：2021-03-16
申请号：US16455074
申请日：2019-06-27
申请人： Dura Operating, LLC
IPC分类号： H05K1/14 , H05K1/18 , H05K3/36 , F21V7/00 , F21V7/04 , G02F1/133 , G02F1/1333 , G02F1/1335 , H05K1/02 , H05K7/14 , H05K3/28 , B62D25/04 , H05K3/34 , F21Y115/10
摘要： An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.
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公开(公告)号：US10656317B2
公开(公告)日：2020-05-19
申请号：US15852433
申请日：2017-12-22
申请人： Dura Operating, LLC
IPC分类号： F21V8/00 , H05K1/03 , H05K3/28 , G02F1/13357 , G06F3/041
摘要： A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.
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公开(公告)号：US10564341B2
公开(公告)日：2020-02-18
申请号：US15852427
申请日：2017-12-22
申请人： Dura Operating, LLC
发明人： Ron G. Gipson
IPC分类号： G02B6/00 , F21V8/00 , G02F1/1335 , H05K3/28 , G06F3/041
摘要： A light guide assembly includes a metal material printed circuit board. A light emitting diode is mounted on and extends away from a first face of the printed circuit board. A light guide molded from a light transmissive polymeric material is positioned proximate to the light emitting diode and is at least partially received in a concomitantly shaped through bore pre-formed in the printed circuit board. The light guide includes an extended feature co-molded from the same material as the light guide and extending away from the first face of the printed circuit board in an installed position of the light guide. The extended feature includes a first extended feature having a first length and a second extended feature having a second length, the second length greater than the first length.
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公开(公告)号：US10925175B2
公开(公告)日：2021-02-16
申请号：US16455070
申请日：2019-06-27
申请人： Dura Operating, LLC
发明人： Ron G. Gipson
摘要： An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a perimeter; a compression gasket extending around at least a portion of the perimeter of the printed circuit board; and a housing including a first wall and a housing side wall extending from the first wall, the first wall and housing side wall form a cavity, wherein the printed circuit board and the compression gasket are located within the cavity with the compression gasket positioned between the perimeter and the housing side wall.
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公开(公告)号：US10715140B2
公开(公告)日：2020-07-14
申请号：US15827371
申请日：2017-11-30
申请人： Dura Operating, LLC
摘要： A laminated light guide and component carrier includes a light guide of a light transmissive polymeric material. The light guide has a pocket in a first face. First electrical traces are printed on the first face. A light emitting diode is positioned in the pocket and supported on the light guide by attachment legs which extend outward from the pocket electrically connecting the light emitting diode to the first electrical traces. A light reflector is formed as a texturally modified area of the light guide directly aligned with the light emitting diode. A capacitive touch sensor is printed on a light guide second face and connected to second electrical traces defining capacitive touch traces printed on the second face. A window region of the light guide is defined where the capacitive touch sensor is aligned with the light reflector and the light emitting diode.
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公开(公告)号：US20190196085A1
公开(公告)日：2019-06-27
申请号：US15852433
申请日：2017-12-22
申请人： Dura Operating, LLC
IPC分类号： F21V8/00 , H05K1/03 , G02F1/1335 , H05K3/28
CPC分类号： G02B6/0021 , G02B6/0025 , G02B6/0031 , G02B6/0055 , G02B6/006 , G02B6/0065 , G02B6/0073 , G02B6/0091 , G02F1/133605 , G06F3/041 , H05K1/0353 , H05K3/28
摘要： A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.
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公开(公告)号：US20190196084A1
公开(公告)日：2019-06-27
申请号：US15852427
申请日：2017-12-22
申请人： Dura Operating, LLC
发明人： Ron G. Gipson
IPC分类号： F21V8/00 , G02F1/1335 , H05K3/28
摘要： A light guide assembly includes a metal material printed circuit board. A light emitting diode is mounted on and extends away from a first face of the printed circuit board. A light guide molded from a light transmissive polymeric material is positioned proximate to the light emitting diode and is at least partially received in a concomitantly shaped through bore pre-formed in the printed circuit board. The light guide includes an extended feature co-molded from the same material as the light guide and extending away from the first face of the printed circuit board in an installed position of the light guide. The extended feature includes a first extended feature having a first length and a second extended feature having a second length, the second length greater than the first length.
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公开(公告)号：US20190058471A1
公开(公告)日：2019-02-21
申请号：US15679548
申请日：2017-08-17
申请人： Dura Operating, LLC
发明人： Ron G. Gipson
摘要： A printed film with mounted light emitting diodes encapsulated in a light guide includes a printed film assembly. The printed film assembly includes multiple light emitting diodes. A light guide is injection molded onto a first side of the body covering the light emitting diodes. A light transmissive polymeric material coating layer is applied by injection molding to a second side of the body opposite to the first side. An overmolded component has the printed film assembly embedded therein, with the coating layer exposed for visibility of light from the light emitting diodes when at least one of the light emitting diodes is energized.
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