公开(公告)号：US09144881B2

公开(公告)日：2015-09-29

申请号：US14187778

申请日：2014-02-24

申请人： EBARA CORPORATION

发明人： Hidetaka Nakao ,  Soichi Isobe ,  Seiji Katsuoka ,  Naoki Matsuda

IPC分类号： B24B37/34 ,  H01L21/67 ,  B24B9/06

CPC分类号： B24B37/345 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

摘要： A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

摘要翻译： 抛光装置包括：周边部分抛光单元，被配置为抛光基板的周边部分; CMP单元，被配置为抛光基板W的平坦表面;清洁单元，被配置为清洁抛光的基板;传送系统， 底物。 运送系统将在周边部分抛光单元和CMP单元之一中抛光的基板传送到清洁单元，并将清洁单元中已经清洁的基板输送到周边部分抛光单元中的另一个 和CMP单元。

公开(公告)号：US09555517B2

公开(公告)日：2017-01-31

申请号：US14832618

申请日：2015-08-21

申请人： EBARA CORPORATION

发明人： Taro Takahashi ,  Hidetaka Nakao ,  Akira Nakamura

IPC分类号： B24B37/00 ,  B24B37/005 ,  H01L21/66 ,  B24B49/00

CPC分类号： B24B37/005 ,  B24B49/00 ,  H01L22/14 ,  H01L22/20

摘要： The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236.

摘要翻译： 本发明提高了膜厚检测的精度。 膜厚信号处理装置230设置有接收单元232，用于接收从涡流传感器210输出的膜厚度数据，用于沿着待抛光的表面检测抛光对象102的膜厚度; 识别单元236，用于基于由接收单元232接收的胶片厚度数据来识别胶片厚度数据的有效范围; 以及用于校正由识别单元236识别的有效范围内的膜厚度数据的校正单元238。

公开(公告)号：US10688622B2

公开(公告)日：2020-06-23

申请号：US15615375

申请日：2017-06-06

申请人： Ebara Corporation

发明人： Hiroshi Aono ,  Kuniaki Yamaguchi ,  Hiroshi Shimomoto ,  Koji Maeda ,  Tetsuya Yashima ,  Kenji Shinkai ,  Koichi Hashimoto ,  Mitsuhiko Inaba ,  Hidetatsu Isokawa ,  Hidetaka Nakao ,  Soichi Isobe

IPC分类号： B24B49/10 ,  B24B37/34 ,  B08B1/00 ,  B08B1/04 ,  B08B3/12 ,  B24B37/10 ,  H01L21/67 ,  H01L21/687

摘要： A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：US20140242885A1

公开(公告)日：2014-08-28

申请号：US14187778

申请日：2014-02-24

申请人： EBARA CORPORATION

发明人： Hidetaka Nakao ,  Soichi Isobe ,  Seiji Katsuoka ,  Naoki Matsuda

IPC分类号： B24B27/00 ,  H01L21/02

CPC分类号： B24B37/345 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

摘要： A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

摘要翻译： 抛光装置包括：周边部分抛光单元，被配置为抛光基板的周边部分; CMP单元，被配置为抛光基板W的平坦表面;清洁单元，被配置为清洁抛光的基板;传送系统， 底物。 运送系统将在周边部分抛光单元和CMP单元之一中抛光的基板传送到清洁单元，并将清洁单元中已经清洁的基板输送到周边部分抛光单元中的另一个 和CMP单元。