利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.021 秒)

    Polishing-amount simulation method for buffing, and buffing apparatus
    1.
    发明授权
    Polishing-amount simulation method for buffing, and buffing apparatus 有权

    公开(公告)号：US10792782B2

    公开(公告)日：2020-10-06

    申请号：US15514785

    申请日：2016-01-18

    申请人： EBARA CORPORATION

    发明人： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno

    IPC分类号： B24B37/005 ,  B24B37/10 ,  B24B49/16 ,  B24B37/34 ,  H01L21/306 ,  H01L21/66

    摘要： The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

    Polishing method and polishing apparatus
    5.
    发明授权
    Polishing method and polishing apparatus 有权

    公开(公告)号：US11192216B2

    公开(公告)日：2021-12-07

    申请号：US15898028

    申请日：2018-02-15

    申请人： EBARA CORPORATION

    发明人： Hiromitsu Watanabe ,  Kuniaki Yamaguchi ,  Itsuki Kobata ,  Yutaka Wada

    IPC分类号： B24B57/00 ,  B24B37/04 ,  B24B37/34

    摘要： A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

    Buffing apparatus, and substrate processing apparatus
    7.
    发明授权
    Buffing apparatus, and substrate processing apparatus 有权

    公开(公告)号：US10183374B2

    公开(公告)日：2019-01-22

    申请号：US14834195

    申请日：2015-08-24

    申请人： EBARA CORPORATION

    发明人： Kuniaki Yamaguchi ,  Toshio Mizuno ,  Itsuki Kobata

    IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B41/00

    摘要： A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

    Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus
    9.
    发明授权
    Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus 有权
    获得研磨部件上的修整器的滑动距离分布的方法，获得研磨部件上的修整器的滑动矢量分布的方法，以及研磨装置

    公开(公告)号：US09108292B2

    公开(公告)日：2015-08-18

    申请号：US14184655

    申请日：2014-02-19

    申请人： EBARA CORPORATION

    发明人： Takahiro Shimano ,  Mutsumi Tanikawa ,  Hisanori Matsuo ,  Kuniaki Yamaguchi ,  Katsuhide Watanabe

    IPC分类号： B24B53/017 ,  B24B53/02 ,  B24B53/00

    CPC分类号： B24B53/005 ,  B24B53/017 ,  B24B53/02

    摘要： The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point. The unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to reflect a difference between an amount of scraped material of the polishing member in its raised portion and an amount of scraped material of the polishing member in its recess portion.

    摘要翻译： 该方法包括：通过将修整器和抛光构件之间的相对速度乘以它们之间的接触时间来计算修整器的滑动距离的增量; 通过将计算出的滑动距离的增加乘以至少一个校正系数来校正滑动距离的增量; 通过根据时间经过反复地将滑动距离的校正增量反复地添加到滑动距离来计算滑动距离; 并且从获得的滑动距离和滑动距离计算点的位置产生修整器的滑动距离分布。 所述至少一个校正系数包括为所述滑动距离计算点提供的不均匀性校正系数。 不均匀性校正系数是使研磨部件的轮廓反映研磨部件的凸起部分的刮削材料量与其凹部中研磨部件的刮削材料量之间的差异的校正系数。