-
公开(公告)号：US09842732B2
公开(公告)日：2017-12-12
申请号：US15616582
申请日：2017-06-07
申请人： EBARA CORPORATION
发明人： Koji Maeda , Soichi Isobe , Hiroshi Shimomoto , Hideaki Tanaka
CPC分类号： H01L21/02057 , H01L21/67046
摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.
-
公开(公告)号：US11495475B2
公开(公告)日：2022-11-08
申请号：US16780049
申请日：2020-02-03
申请人： EBARA CORPORATION
IPC分类号： H01L21/302 , H01L21/67 , B24B37/34 , B24B37/04
摘要： Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.
-
公开(公告)号：US20170372893A1
公开(公告)日：2017-12-28
申请号：US15631149
申请日：2017-06-23
申请人： Ebara Corporation
发明人： Koji Maeda , Hiroshi Shimomoto , Kuniaki Yamaguchi , Hiroshi Aono , Tetsuya Yashima , Hidetatsu Isokawa , Kenji Shinkai , Mitsuhiko Inaba , Koichi Hashimoto , Junji Kunisawa , Mitsuru Miyazaki , Fujihiko Toyomasu
IPC分类号： H01L21/02
摘要： The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.
-
公开(公告)号：US09704728B2
公开(公告)日：2017-07-11
申请号：US14061686
申请日：2013-10-23
申请人： EBARA CORPORATION
发明人： Koji Maeda , Soichi Isobe , Hiroshi Shimomoto , Hideaki Tanaka
CPC分类号： H01L21/02057 , H01L21/67046
摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.
-
公开(公告)号：US10573509B2
公开(公告)日：2020-02-25
申请号：US15631149
申请日：2017-06-23
申请人： Ebara Corporation
发明人： Koji Maeda , Hiroshi Shimomoto , Kuniaki Yamaguchi , Hiroshi Aono , Tetsuya Yashima , Hidetatsu Isokawa , Kenji Shinkai , Mitsuhiko Inaba , Koichi Hashimoto , Junji Kunisawa , Mitsuru Miyazaki , Fujihiko Toyomasu
IPC分类号： H01L21/02
摘要： The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.
-
公开(公告)号：US20140190633A1
公开(公告)日：2014-07-10
申请号：US14043379
申请日：2013-10-01
申请人： EBARA CORPORATION
IPC分类号： H01L21/67
CPC分类号： H01L21/67092 , B24B37/04 , B24B37/34 , H01L21/67051 , H01L21/67219
摘要： A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.
摘要翻译： 提供能够有效地清洗诸如晶片的基板的基板清洗装置。 基板清洗装置包括：用于保持和旋转基板的基板保持件; 用于将化学液体供给到所述基板上的化学液体喷嘴; 用于将二流体射流供应到衬底上的双流体喷嘴; 以及用于将药液喷嘴和双流体喷嘴从基板的中心移动到周边的移动机构。 化学液体喷嘴和双流体喷嘴彼此相邻地间隔预定距离，并且化学液体喷嘴相对于化学液体喷嘴的移动方向位于双流体喷嘴的前方， 流体喷嘴。
-
公开(公告)号：US20140190530A1
公开(公告)日：2014-07-10
申请号：US14043419
申请日：2013-10-01
申请人： EBARA CORPORATION
发明人： Koji Maeda , Hiroshi Shimomoto , Hisajiro Nakano
IPC分类号： A47L15/42
CPC分类号： H01L21/67051
摘要： A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.
摘要翻译： 提供了一种能够以低价格的材料构成清洗容器时能够防止清洗容器被化学液体腐蚀的基板清洗装置。 基板清洗装置包括：用于在其中保持基板的清洗容器; 布置在所述清洁容器中的基板保持器; 用于将化学液体供给到由所述基板保持器保持的所述基板上的化学液体喷嘴; 以及用于将清洁液体供应到清洁容器的内表面上的多个清洗液喷嘴。 清洁容器的内表面已进行亲水化处理。
-
公开(公告)号：US11541502B2
公开(公告)日：2023-01-03
申请号：US17041734
申请日：2020-03-04
申请人： EBARA CORPORATION
发明人： Kuniaki Yamaguchi , Hiroshi Shimomoto , Soichi Isobe , Koji Maeda , Kenji Shinkai , Hidetatsu Isokawa , Dai Yoshinari , Masayuki Tamura , Haiyang Xu , Shun Ehara , Kentaro Asano
IPC分类号： B24B49/00 , B24B37/015 , B24B53/00 , B24B57/02 , B24B53/017
摘要： A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.
-
公开(公告)号：US10688622B2
公开(公告)日：2020-06-23
申请号：US15615375
申请日：2017-06-06
申请人： Ebara Corporation
发明人： Hiroshi Aono , Kuniaki Yamaguchi , Hiroshi Shimomoto , Koji Maeda , Tetsuya Yashima , Kenji Shinkai , Koichi Hashimoto , Mitsuhiko Inaba , Hidetatsu Isokawa , Hidetaka Nakao , Soichi Isobe
摘要： A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
-
公开(公告)号：US10096492B2
公开(公告)日：2018-10-09
申请号：US14043419
申请日：2013-10-01
申请人： EBARA CORPORATION
发明人： Koji Maeda , Hiroshi Shimomoto , Hisajiro Nakano
摘要： A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.014 秒)
