公开(公告)号：US11951588B2

公开(公告)日：2024-04-09

申请号：US17478608

申请日：2021-09-17

Applicant: EBARA CORPORATION

Inventor： Masaki Kinoshita ,  Toshifumi Kimba ,  Yoshikazu Kato ,  Yoichi Shiokawa

IPC: B24B37/013 ,  G01N21/55

CPC classification number: B24B37/013 ,  G01N21/55

Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

公开(公告)号：US10663287B2

公开(公告)日：2020-05-26

申请号：US16248599

申请日：2019-01-15

Applicant: EBARA CORPORATION

Inventor： Toshifumi Kimba ,  Nobuyuki Takahashi ,  Masaki Kinoshita

IPC: G01B11/06 ,  B24B37/005 ,  B24B49/12 ,  H01L21/67 ,  B24B37/34 ,  G02B6/26 ,  G02B6/35

Abstract: A polishing apparatus capable of accurately measuring a film thickness by regulating a quantity of light illuminating a wafer is disclosed. The polishing apparatus includes: a light source; an illuminating fiber having distal ends arranged at different locations in the polishing table; and a light-receiving fiber having distal ends arranged at the different locations in the polishing table. The illuminating fiber includes a first illuminating fiber and a second illuminating fiber. A first dimmer is attached to the first illuminating fiber and the second illuminating fiber, and a second dimmer is attached to at least one of the first illuminating fiber and the second illuminating fiber.

公开(公告)号：US20220105601A1

公开(公告)日：2022-04-07

申请号：US17478608

申请日：2021-09-17

Applicant: EBARA CORPORATION

Inventor： Masaki Kinoshita ,  Toshifumi Kimba ,  Yoshikazu Kato ,  Yoichi Shiokawa

IPC: B24B37/013 ,  G01N21/55

Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

公开(公告)号：US11413720B2

公开(公告)日：2022-08-16

申请号：US16162063

申请日：2018-10-16

Applicant: EBARA CORPORATION

Inventor： Nobuyuki Takahashi ,  Toshifumi Kimba ,  Masaki Kinoshita

IPC: B24B37/10 ,  B24B37/013 ,  G01J3/10 ,  G01J3/42 ,  B24B49/12 ,  G01N21/95 ,  B24B37/20 ,  G01J3/02

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.

公开(公告)号：US20210354262A1

公开(公告)日：2021-11-18

申请号：US17319559

申请日：2021-05-13

Applicant: EBARA CORPORATION

Inventor： Hirotaka Satori ,  Yu Ishii ,  Toshifumi Kimba ,  Masaki Kinoshita

IPC: B24B37/005 ,  B24B37/34 ,  B24B37/04

Abstract: Provided is a technique capable of suppressing a shortage of a light amount of a reflected light from wiring patterns even when a film thickness of a film is thick. A film thickness measurement apparatus 30 is applicable to a polishing apparatus 10 for polishing a film 202 of a substrate 200. The film 202 includes a plurality of wiring patterns. The film thickness measurement apparatus 30 includes a light emitter 43 configured to project an emitted light L1 during polishing of the film by the polishing apparatus, an optical condenser 44 configured to condense the emitted light projected from the light emitter to provide a predetermined spot size D and project the light onto the film, and a light receiver 45 configured to receive a reflected light L2 reflected from the film. The predetermined spot size is smaller than a minimum width of respective wiring patterns constituting the plurality of wiring patterns.

公开(公告)号：US11045921B2

公开(公告)日：2021-06-29

申请号：US15979180

申请日：2018-05-14

Applicant: EBARA CORPORATION

Inventor： Toshifumi Kimba ,  Masaki Kinoshita

IPC: B24B37/005 ,  B24B49/12 ,  B24B37/04 ,  B24B37/20 ,  B24B37/013

Abstract: A polishing apparatus capable of accurately determining a service life of a light source, and further capable of accurately measuring a film thickness of a substrate, such as a wafer, without calibrating an optical film-thickness measuring device, is disclosed. The polishing apparatus includes a spectrometer configured to decompose reflected light from a substrate in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths a film thickness of the substrate is determined based on a spectral waveform indicating a relationship between the intensity of the reflected light and wavelength. An optical-path selecting mechanism is configured to selectively couple either a light-receiving fiber or an internal optical fiber to the spectrometer.

公开(公告)号：US09969048B2

公开(公告)日：2018-05-15

申请号：US14808252

申请日：2015-07-24

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/10 ,  B24B37/26 ,  H01L21/67 ,  H01L21/687 ,  B24B37/04 ,  B24B37/005 ,  H01L21/3105 ,  H01L21/66

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

公开(公告)号：USD731448S1

公开(公告)日：2015-06-09

申请号：US29489180

申请日：2014-04-28

Applicant: EBARA CORPORATION

Designer： Masaki Kinoshita ,  Toshifumi Kimba

公开(公告)号：US11642753B2

公开(公告)日：2023-05-09

申请号：US16426398

申请日：2019-05-30

Applicant: EBARA CORPORATION

Inventor： Toshikazu Nomura ,  Masaki Kinoshita ,  Nobuyuki Takahashi ,  Suguru Sakugawa ,  Takashi Kishi

IPC: B24B47/22 ,  B24B37/005 ,  B24B37/34 ,  B24B37/26

CPC classification number: B24B47/22 ,  B24B37/005 ,  B24B37/26 ,  B24B37/345

Abstract: A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

公开(公告)号：US09999955B2

公开(公告)日：2018-06-19

申请号：US14327522

申请日：2014-07-09

Applicant: EBARA CORPORATION

Inventor： Yoichi Kobayashi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Keita Yagi ,  Masaki Kinoshita

IPC: B24B37/013 ,  G01B11/06

CPC classification number: B24B37/013 ,  G01B11/0625 ,  G01B11/0683 ,  G01B11/0691

Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.