利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.035 秒)

    PLATING METHOD, PLATING APPARATUS, ANODE HOLDER
    1.
    发明申请
    PLATING METHOD, PLATING APPARATUS, ANODE HOLDER 有权

    公开(公告)号：US20210071312A1

    公开(公告)日：2021-03-11

    申请号：US17012018

    申请日：2020-09-03

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/10 ,  H01L21/288 ,  C25D7/12 ,  C25D17/00 ,  C25D17/08

    摘要： Provided is a plating method for improving in-plane uniformity of various square-shaped substrates without changing an inter-electrode distance. A plating method according to an aspect in which an anode holder (44) adapted to hold a square-shaped anode (62) and a substrate holder (24) adapted to hold a square-shaped substrate (W) are disposed to face each other and plating processing is performed on the substrate (W), the anode holder (44) includes a holder main body (80) having a square-shaped opening and adapted to hold the anode (62) with a surface of the anode (62) exposed from the opening, and a mask (88) adapted to cover a part of the anode (62) inside the opening, and a position covered with the mask (88) is changed in accordance with the substrate (W).

    Plating apparatus
    2.
    发明授权
    Plating apparatus 有权

    公开(公告)号：US11725297B2

    公开(公告)日：2023-08-15

    申请号：US17504127

    申请日：2021-10-18

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/00 ,  C25D17/10 ,  C25D17/02

    CPC分类号： C25D17/10 ,  C25D17/007 ,  C25D17/02

    摘要： A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

    REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
    3.
    发明申请
    REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER 有权

    公开(公告)号：US20220154363A1

    公开(公告)日：2022-05-19

    申请号：US17590140

    申请日：2022-02-01

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/00 ,  C25D17/06 ,  H01L21/288

    摘要： To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.

    PLATING APPARATUS
    5.
    发明申请
    PLATING APPARATUS 有权

    公开(公告)号：US20220119981A1

    公开(公告)日：2022-04-21

    申请号：US17504127

    申请日：2021-10-18

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/10 ,  C25D17/02 ,  C25D17/00

    摘要： A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

    Substrate holder and plating device
    6.
    发明授权
    Substrate holder and plating device 有权

    公开(公告)号：US11280020B2

    公开(公告)日：2022-03-22

    申请号：US16920452

    申请日：2020-07-03

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/08 ,  C25D17/00 ,  H01L21/687 ,  C25D7/12

    摘要： According to an embodiment, a substrate holder holds a rectangular substrate and performs electrolytic plating on the substrate. The substrate holder includes a first holding member and a second holding member clamping the substrate between the first holding member and it and having a contact which contacts a peripheral part of the substrate and supplies an electric current to the substrate. The second holding member includes an opening defining a region where an electric field is formed and, at a position farther from the substrate than the opening, a shielding part protruding closer to an inner side than the opening and shielding the peripheral part of a surface of the substrate. The shielding part has a frame shape having a predetermined shielding width in the peripheral part of the substrate, and has, at a corner part thereof, a discontinuous part having a smaller shielding width than surroundings.

    PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS
    8.
    发明申请
    PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS 有权

    公开(公告)号：US20220228285A1

    公开(公告)日：2022-07-21

    申请号：US17608363

    申请日：2020-05-13

    申请人： EBARA CORPORATION

    发明人： Hiroyuki Kanda ,  Naoki Shimomura ,  Mizuki Nagai ,  Shingo Yasuda ,  Akira Owatari

    IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12

    摘要： Provided are a plating method, an insoluble anode and a plating apparatus capable of reducing consumption of an additive in a plating solution, when plating a substrate including a via or a hole for forming a through electrode. The plating method includes the steps of preparing a substrate including a via or a hole for forming a through electrode, preparing a plating solution tank that is divided, by a diaphragm, into an anode tank in which an insoluble anode is disposed and a cathode tank in which the substrate is disposed, and electroplating the substrate with an anode current density when plating the substrate in the plating solution tank being equal to or more than 0.4 ASD and equal to or less than 1.4 ASD.

    Regulation plate, anode holder, and substrate holder
    9.
    发明授权
    Regulation plate, anode holder, and substrate holder 有权

    公开(公告)号：US11268207B2

    公开(公告)日：2022-03-08

    申请号：US16630369

    申请日：2018-07-06

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： H01L21/288 ,  C25D17/06 ,  C25D17/00

    摘要： To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.

    Plating apparatus and plating method
    10.
    发明授权
    Plating apparatus and plating method 有权

    公开(公告)号：US11066755B2

    公开(公告)日：2021-07-20

    申请号：US16434874

    申请日：2019-06-07

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D17/06 ,  H01L21/768 ,  C25D3/38 ,  C25D5/02 ,  H01L21/288 ,  C25D21/10 ,  C25D21/12

    摘要： A substrate holder holds a polygonal substrate Wf. A plating bath accommodates the anode holder and the substrate holder. The anode and the substrate are immersed in a plating solution in the plating bath. A control device controls a current flowing between the anode and the substrate. The substrate holder has power feed members placed along respective sides of the polygonal substrate, and there are a plurality of groups of the sides, each group including at least one side, at least one side being different between the groups. The control device can control, on a group-by-group basis, a current to be supplied to the power feed members.