公开(公告)号：US12068189B2

公开(公告)日：2024-08-20

申请号：US17371518

申请日：2021-07-09

申请人： EBARA CORPORATION

发明人： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada ,  Yoshikazu Kato

IPC分类号： H01L21/687 ,  B24B7/04 ,  B24B37/10 ,  B24B37/30

CPC分类号： H01L21/68707 ,  B24B7/04 ,  B24B37/107 ,  B24B37/30

摘要： An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US11088011B2

公开(公告)日：2021-08-10

申请号：US15950989

申请日：2018-04-11

申请人： EBARA CORPORATION

发明人： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada ,  Yoshikazu Kato

IPC分类号： H01L21/687 ,  B24B7/04 ,  B24B37/10 ,  B24B37/30

摘要： An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US11958163B2

公开(公告)日：2024-04-16

申请号：US17511340

申请日：2021-10-26

申请人： EBARA CORPORATION

发明人： Osamu Nabeya ,  Makoto Fukushima ,  Keisuke Namiki ,  Shingo Togashi ,  Satoru Yamaki ,  Masahiko Kishimoto ,  Tomoko Owada

IPC分类号： B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/687

CPC分类号： B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/68721

摘要： A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：USD1021832S1

公开(公告)日：2024-04-09

申请号：US29874375

申请日：2023-04-19

申请人： EBARA CORPORATION

设计人： Kenichi Akazawa ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Tomoko Owada ,  Cheng Cheng ,  Yuichi Kato

摘要： FIG. 1 is a top perspective view of an elastic membrane showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross sectional view taken along section line 7-7 in FIG. 3; and,
FIG. 8 is an enlarged portion view taken along line 8-8 in FIG. 7.
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.

公开(公告)号：USD859332S1

公开(公告)日：2019-09-10

申请号：US29630484

申请日：2017-12-21

申请人： EBARA CORPORATION

设计人： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada

公开(公告)号：USD839224S1

公开(公告)日：2019-01-29

申请号：US29606998

申请日：2017-06-09

申请人： EBARA CORPORATION

设计人： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada ,  Masahiko Kishimoto

公开(公告)号：US11745306B2

公开(公告)日：2023-09-05

申请号：US16724504

申请日：2019-12-23

申请人： Ebara Corporation

发明人： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

IPC分类号： B24B49/04 ,  B24B41/047

CPC分类号： B24B49/045 ,  B24B41/047

摘要： A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

公开(公告)号：USD981969S1

公开(公告)日：2023-03-28

申请号：US29794758

申请日：2021-06-15

申请人： EBARA CORPORATION

设计人： Kenichi Akazawa ,  Tomoko Owada ,  Osamu Nabeya ,  Makoto Fukushima ,  Yuichi Kato

公开(公告)号：US20210335650A1

公开(公告)日：2021-10-28

申请号：US17371518

申请日：2021-07-09

申请人： EBARA CORPORATION

发明人： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada ,  Yoshikazu Kato

IPC分类号： H01L21/687 ,  B24B37/30 ,  B24B37/10 ,  B24B7/04

摘要： An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US20200206868A1

公开(公告)日：2020-07-02

申请号：US16724504

申请日：2019-12-23

申请人： Ebara Corporation

发明人： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

IPC分类号： B24B49/04 ,  B24B41/047

摘要： A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.