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    Polishing apparatus and method of controlling inclination of stationary ring
    1.
    发明授权
    Polishing apparatus and method of controlling inclination of stationary ring 有权

    公开(公告)号：US11745306B2

    公开(公告)日：2023-09-05

    申请号：US16724504

    申请日：2019-12-23

    Applicant: Ebara Corporation

    Inventor： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

    IPC: B24B49/04 ,  B24B41/047

    CPC classification number: B24B49/045 ,  B24B41/047

    Abstract: A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

    POLISHING RECIPE DETERMINATION DEVICE
    2.
    发明申请
    POLISHING RECIPE DETERMINATION DEVICE 有权

    公开(公告)号：US20220168864A1

    公开(公告)日：2022-06-02

    申请号：US17419029

    申请日：2019-10-16

    Applicant: EBARA CORPORATION

    Inventor： Yoshikazu Kato ,  Makoto Fukushima ,  Keisuke Namiki ,  Shingo Togashi

    IPC: B24B37/005 ,  G06N20/20 ,  G06K9/62

    Abstract: An information processing apparatus is an information processing apparatus that determines a polishing recipe based on area response data acquired by changing a pressure for each area in a polishing head, the apparatus including an irregularity-presence-or-absence estimation unit that estimates and outputs whether an irregularity is present using new area response data as an input, a screening unit estimates and outputs, when the irregularity-presence-or-absence estimation unit estimates that an irregularity is present, area response data after the removal of the irregularity using area response data estimated that an irregularity is present as an input, and a simulation unit that determines a polishing recipe by simulation based on area response data estimated by the irregularity-presence-or-absence estimation unit that no irregularity is present or a response for each area after the removal of the irregularity estimated by the screening unit.

    POLISHING APPARATUS AND METHOD OF CONTROLLING INCLINATION OF STATIONARY RING
    4.
    发明申请
    POLISHING APPARATUS AND METHOD OF CONTROLLING INCLINATION OF STATIONARY RING 审中-公开

    公开(公告)号：US20200206868A1

    公开(公告)日：2020-07-02

    申请号：US16724504

    申请日：2019-12-23

    Applicant: Ebara Corporation

    Inventor： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

    IPC: B24B49/04 ,  B24B41/047

    Abstract: A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

    POLISHING APPARATUS AND POLISHING METHOD
    7.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开
    抛光装置和抛光方法

    公开(公告)号：US20170057049A1

    公开(公告)日：2017-03-02

    申请号：US15248112

    申请日：2016-08-26

    Applicant: Ebara Corporation

    Inventor： Makoto Fukushima ,  Hozumi Yasuda ,  Shingo Togashi

    IPC: B24B37/005

    Abstract: A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.

    Abstract translation: 抛光装置包括用于支撑抛光垫的抛光台和用于将基板压靠在抛光垫上的基板保持装置。 基板保持装置包括形成多个压力室以按压基板的弹性膜，以及控制压力室压力的压力控制单元。 压力控制单元包括连接到第一压力室的第一流路，以及第一和第二压力调节机构。 当第一压力室内的设定压力达到第一阈值时，压力控制单元执行从第一压力调节机构到第二压力调节机构的切换控制。 然后，当第一压力室内的设定压力达到低于第一阈值的第二阈值时，压力控制单元进行从第二压力调节机构到第一压力调节机构的切换控制。

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