公开(公告)号：US20180236630A1

公开(公告)日：2018-08-23

申请号：US15900140

申请日：2018-02-20

申请人： Ebara Corporation

发明人： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Nobuyuki TAKADA

IPC分类号： B24B37/013 ,  B24B37/10 ,  B24B53/017

CPC分类号： B24B37/013 ,  B24B21/12 ,  B24B27/0084 ,  B24B37/105 ,  B24B37/107 ,  B24B53/017

摘要： A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher.

公开(公告)号：US20170352573A1

公开(公告)日：2017-12-07

申请号：US15615475

申请日：2017-06-06

申请人： EBARA CORPORATION

发明人： Zhongxin WEN ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Itsuki KOBATA ,  Tomohiko TAKEUCHI

IPC分类号： H01L21/687 ,  G03F7/20 ,  B24B41/06 ,  H01L21/683 ,  B24B37/04

CPC分类号： H01L21/68757 ,  B24B37/04 ,  B24B41/068 ,  G03F7/70691 ,  H01L21/67248 ,  H01L21/6838 ,  H01L21/68714

摘要： It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.

公开(公告)号：US20170092519A1

公开(公告)日：2017-03-30

申请号：US15311638

申请日：2015-04-06

申请人： EBARA CORPORATION

发明人： Suguru SAKUGAWA ,  Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L21/677 ,  H01L21/687 ,  B24B37/30 ,  H01L21/306

CPC分类号： H01L21/67253 ,  B24B37/005 ,  B24B37/30 ,  B24B49/08 ,  B24B49/16 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68764

摘要： The invention simplifies airbag calibration.A pressure calibration jig calibrates pressure to be applied to a plurality of airbags disposed inside a top ring for holding and pressing a wafer against a polishing pad. The pressure calibration jig includes a plurality of first passages capable of communicating with the plurality of airbags, respectively; a second passage which combines and connects the plurality of first passages to a pressure calibration sensor; and a flow control portion configured to allow a fluid to flow through the first passage of the plurality of first passages, which first passage corresponds to an airbag selected for pressure calibration, in a direction from the selected airbag toward the second passage, and also configured to prevent the fluid from flowing through the first passages other than the first passage corresponding to the selected airbag in a direction from the second passage toward the airbags.

公开(公告)号：US20200269383A1

公开(公告)日：2020-08-27

申请号：US16495010

申请日：2018-01-10

申请人： Ebara Corporation

发明人： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA

IPC分类号： B24B53/017 ,  B24B37/005 ,  B24B53/12

摘要： Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which comes into contact with the substrate and which is smaller than the substrate, a conditioning member for performing conditioning on the polishing member, a first pressing mechanism for pressing the conditioning member against the polishing member in polishing the substrate, and a control unit for controlling an operation of the polishing device. The control unit is configured to control the first pressing mechanism when the substrate is partially polished by the polishing member.

公开(公告)号：US20180304434A1

公开(公告)日：2018-10-25

申请号：US15951745

申请日：2018-04-12

申请人： Ebara Corporation

发明人： Suguru SAKUGAWA ,  Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC分类号： B24B37/005 ,  B24B49/10 ,  H01L21/67 ,  H01L21/683

CPC分类号： B24B37/005 ,  B24B37/10 ,  B24B37/32 ,  B24B49/00 ,  B24B49/08 ,  B24B49/10 ,  G01M3/26 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6838

摘要： A leak checking method which is capable of detecting a leak of compressed gas supplied to a polishing head without removing the polishing head from a polishing apparatus is disclosed. The leak checking method includes: supplying a compressed gas into a pressure chamber, which is formed by a membrane of a polishing head, with the membrane placed in contact with a stationary surface; measuring a flow rate of the compressed gas during supplying of the compressed gas into the pressure chamber, while regulating a pressure of the compressed gas by use of a pressure regulator; deciding whether or not the flow rate measured when a variation in the pressure of the compressed gas is within an allowable range of variation, is within a reference range; and generating a leak-detection signal when the flow rate is outside of the reference range.

公开(公告)号：US20180001438A1

公开(公告)日：2018-01-04

申请号：US15636343

申请日：2017-06-28

申请人： EBARA CORPORATION

发明人： Suguru SAKUGAWA ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI ,  Zhongxin WEN ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Itsuki KOBATA ,  Tomohiko TAKEUCHI

IPC分类号： B24B37/005 ,  H01L21/306 ,  B24B37/10

CPC分类号： B24B37/005 ,  B24B37/10 ,  H01L21/30625

摘要： According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.

公开(公告)号：US20150224620A1

公开(公告)日：2015-08-13

申请号：US14590620

申请日：2015-01-06

申请人： EBARA CORPORATION

发明人： Nobuyuki TAKAHASHI ,  Toru MARUYAMA ,  Suguru SAKUGAWA

IPC分类号： B24B37/005 ,  B24B7/22

CPC分类号： B24B37/005 ,  B24B7/228 ,  B24B37/30 ,  B24B49/08 ,  Y10T137/7761

摘要： A pressure regulator capable of improving both stability of pressure and responsiveness to an input signal is disclosed. A PID controller is configured to stop producing a corrective command value from a point in time when a pressure command value has changed until a PID control starting point and to produce the corrective command value after the PID control starting point. A regulator controller is configured to control operation of a pressure regulation valve so as to eliminate a difference between the pressure command value and a first pressure value from the point in time when the pressure command value has changed until the PID control starting point, and to control the operation of the pressure regulation valve so as to eliminate a difference between the corrective command value and the first pressure value after the PID control starting point.

摘要翻译： 公开了能够提高压力稳定性和对输入信号的响应性的压力调节器。 PID控制器被配置为从压力指令值改变直到PID控制起始点的时间点停止产生校正指令值，并且在PID控制起点之后产生校正指令值。 调节器控制器被配置为控制压力调节阀的操作，以便从压力指令值已经改变到PID控制起始点的时间点消除压力指令值与第一压力值之间的差值，并且 控制压力调节阀的运行，以消除PID控制起点后的校正指令值与第一压力值之间的差异。