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公开(公告)号：US12020954B2
公开(公告)日：2024-06-25
申请号：US17269807
申请日：2019-08-20
Applicant: EBARA CORPORATION
Inventor： Hirotaka Ohashi , Toshio Yokoyama , Mizuki Nagai , Ryu Miyamoto
IPC: H01L21/67 , H01L21/677 , H01L21/687
CPC classification number: H01L21/67057 , H01L21/6708 , H01L21/67742 , H01L21/68707 , H01L21/68742 , H01L21/6875
Abstract: The present invention relates to a substrate processing apparatus for processing a substrate with a processing liquid. The substrate processing apparatus according to one embodiment includes: a support portion having a placement surface on which a substrate is placed in a horizontal posture; a processing tank configured to supply a processing liquid to the substrate and process the substrate; an elevating portion configured to raise and lower the support portion in order to lower the substrate into the processing tank and raise the substrate from the processing tank; a gripping portion configured to grip a periphery of the substrate supported by the support portion above the processing tank, and receive the substrate from the support portion; and a first nozzle configured to emit a gas onto the substrate, gripped by the gripping portion, to dry the substrate.
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公开(公告)号：US11230780B2
公开(公告)日：2022-01-25
申请号：US17268036
申请日：2019-07-30
Applicant: EBARA CORPORATION
Inventor： Junitsu Yamakawa , Chunhui Dou , Risa Kimura , Toshio Yokoyama
Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
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公开(公告)号：US20210210368A1
公开(公告)日：2021-07-08
申请号：US17140780
申请日：2021-01-04
Applicant: EBARA CORPORATION
Inventor： Toshio Yokoyama , Tomonori Hirao , Takuya Tsushima , Hirotaka Ohashi
IPC: H01L21/68 , H01L21/677
Abstract: An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.
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公开(公告)号：US12027402B2
公开(公告)日：2024-07-02
申请号：US17140780
申请日：2021-01-04
Applicant: EBARA CORPORATION
Inventor： Toshio Yokoyama , Tomonori Hirao , Takuya Tsushima , Hirotaka Ohashi
IPC: G05B15/02 , B25J9/16 , H01L21/67 , H01L21/677 , H01L21/68
CPC classification number: H01L21/681 , B25J9/1697 , G05B15/02 , H01L21/67259 , H01L21/67748 , H01L21/68 , G05B2219/37555
Abstract: An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.
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公开(公告)号：US20220074064A1
公开(公告)日：2022-03-10
申请号：US17529769
申请日：2021-11-18
Applicant: EBARA CORPORATION
Inventor： Junitsu Yamakawa , Chunhui Dou , Risa Kimura , Toshio Yokoyama
Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
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Patent Agency Ranking
公开(公告)号：US11098414B2
公开(公告)日：2021-08-24
申请号：US16664599
申请日：2019-10-25
Applicant: EBARA CORPORATION
Inventor： Takashi Mitsuya , Ryuya Koizumi , Toshio Yokoyama , Masashi Shimoyama , Kunio Oishi
IPC: C25D17/00 , H01L21/67 , H01L21/66 , C25D21/12 , H01L21/768 , H01L23/00 , C25D17/06 , H01L21/288
Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.
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公开(公告)号：US10654017B2
公开(公告)日：2020-05-19
申请号：US16069862
申请日：2017-01-13
Applicant: EBARA CORPORATION
Inventor： Suguru Ozawa , Yoichi Nakagawa , Muneto Takahashi , Tao Xu , Toshio Yokoyama
Abstract: Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point.A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the (flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.
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公开(公告)号：US11434580B2
公开(公告)日：2022-09-06
申请号：US16796782
申请日：2020-02-20
Applicant: EBARA CORPORATION
Inventor： Tomonori Hirao , Gaku Yamasaki , Takahiro Abe , Toshio Yokoyama
Abstract: To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.
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公开(公告)号：US20210180202A1
公开(公告)日：2021-06-17
申请号：US17268036
申请日：2019-07-30
Applicant: EBARA CORPORATION
Inventor： Junitsu Yamakawa , Chunhui Dou , Risa Kimura , Toshio Yokoyama
Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
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公开(公告)号：US20200277709A1
公开(公告)日：2020-09-03
申请号：US16796782
申请日：2020-02-20
Applicant: EBARA CORPORATION
Inventor： Tomonori Hirao , Gaku Yamasaki , Takahiro Abe , Toshio Yokoyama
Abstract: To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.
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