公开(公告)号：US11098414B2

公开(公告)日：2021-08-24

申请号：US16664599

申请日：2019-10-25

Applicant: EBARA CORPORATION

Inventor： Takashi Mitsuya ,  Ryuya Koizumi ,  Toshio Yokoyama ,  Masashi Shimoyama ,  Kunio Oishi

IPC: C25D17/00 ,  H01L21/67 ,  H01L21/66 ,  C25D21/12 ,  H01L21/768 ,  H01L23/00 ,  C25D17/06 ,  H01L21/288

Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

公开(公告)号：US11177147B2

公开(公告)日：2021-11-16

申请号：US16245448

申请日：2019-01-11

Applicant: EBARA CORPORATION

Inventor： Takashi Mitsuya

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate treatment apparatus includes a plurality of treatment chambers performing different treatment types on a substrate; a transfer device; and a controller that controls the transfer of the substrate and the substrate treatment. The controller enables fixation of a time for pulling up the substrate for each treatment chambers/treatment type and creation of a transfer schedule for transferring the substrate among the plurality of treatment chambers/treatment types and treating the substrate so as to maximize throughput, and enables correction of the transfer schedule to extend, based on a waiting time of the transfer device after storage of the substrate into a treatment chamber of one treatment type and a waiting time of the treatment chamber after treatment of the substrate, a time required for pulling up the substrate from a treatment chamber of an immediately previous treatment type in transfer order of the substrate.

公开(公告)号：US10141211B2

公开(公告)日：2018-11-27

申请号：US15690025

申请日：2017-08-29

Applicant: EBARA CORPORATION

Inventor： Toshio Yokoyama ,  Masahiko Sekimoto ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Takashi Mitsuya ,  Keiichi Kurashina

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

公开(公告)号：US20210402548A1

公开(公告)日：2021-12-30

申请号：US17355525

申请日：2021-06-23

Applicant: EBARA CORPORATION

Inventor： Takashi Mitsuya ,  Asagi Matsugu ,  Ayumu Saito

IPC: B24B37/005 ,  H01L21/306 ,  H01L21/66

Abstract: Accuracy of detection of a fly out of a substrate from a polishing head is improved. A substrate processing apparatus includes a polishing table 350 to which a polishing pad 352 for polishing the substrate is attachable, a polishing head 302 for holding and pressing the substrate against the polishing pad 352, a retainer member disposed surrounding the polishing head 302, a retainer member pressurization chamber disposed adjacent to the retainer member, an arm 360 for holding and turning the polishing head 302, and a slip out detector 910 for detecting a fly out of the substrate from the polishing head 302 based on a turning torque of the arm 360 or based on a flow rate of a fluid supplied to the retainer member pressurization chamber.

公开(公告)号：US11099546B2

公开(公告)日：2021-08-24

申请号：US17036189

申请日：2020-09-29

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: H01L21/677 ,  G05B19/418 ,  G05B19/4155 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US10824135B2

公开(公告)日：2020-11-03

申请号：US15868753

申请日：2018-01-11

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US20220005716A1

公开(公告)日：2022-01-06

申请号：US17258916

申请日：2019-07-09

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Takashi Koba ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Fong-Jie Du ,  Makoto Kashiwagi ,  Asagi Matsugu ,  Takahiro Nanjo ,  Hideharu Aoyama ,  Takashi Mitsuya ,  Tetsuji Togawa

IPC: H01L21/677 ,  B24B37/14 ,  B24B37/26 ,  H01L21/304 ,  B24B37/30 ,  B65G13/02

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

公开(公告)号：US20210011462A1

公开(公告)日：2021-01-14

申请号：US17036189

申请日：2020-09-29

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US09786532B2

公开(公告)日：2017-10-10

申请号：US14666196

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Toshio Yokoyama ,  Masahiko Sekimoto ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Takashi Mitsuya ,  Keiichi Kurashina

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67718 ,  H01L21/67086 ,  H01L21/67751 ,  H01L21/68707

Abstract: A substrate processing apparatus is described herein. The substrate processing apparatus comprises a transferring device including: a grasping section configured to grasp a substrate holder, a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

公开(公告)号：US12237194B2

公开(公告)日：2025-02-25

申请号：US17258916

申请日：2019-07-09

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Takashi Koba ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Fong-Jie Du ,  Makoto Kashiwagi ,  Asagi Matsugu ,  Takahiro Nanjo ,  Hideharu Aoyama ,  Takashi Mitsuya ,  Tetsuji Togawa

IPC: B24B37/14 ,  B24B37/26 ,  B24B37/30 ,  B65G13/02 ,  H01L21/304 ,  H01L21/677 ,  B24B41/06 ,  B24B57/02 ,  B65G39/04 ,  H01L21/67

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.