公开(公告)号：US09131607B2

公开(公告)日：2015-09-08

申请号：US13777477

申请日：2013-02-26

申请人： ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

发明人： Rong-Tao Wang ,  Tse-An Lee ,  Yi-Jen Chen ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng Lu

IPC分类号： C08L63/00 ,  H05K1/03 ,  B32B15/14 ,  B32B15/20

CPC分类号： H05K1/0353 ,  B32B15/14 ,  B32B15/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/621 ,  C08L25/08 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L79/085 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L61/06

摘要： A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

摘要翻译： 无卤树脂组合物包含（A）100重量份的萘环氧树脂; （B）10〜100重量份苯乙烯马来酸酐共聚物; 和（C）30〜70重量份含DOPO的双酚F酚醛清漆树脂。 无卤素树脂组合物包括特定成分，其特征在于其特定比例，从而获得低介电常数，低介电损耗因数，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US09650512B2

公开(公告)日：2017-05-16

申请号：US13964070

申请日：2013-08-10

申请人： ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

发明人： Rong-Tao Wang ,  Li-Chih Yu ,  Yu-Te Lin ,  Yi-Jen Chen ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng Lu

IPC分类号： B32B27/38 ,  C08L63/04 ,  C08G59/40 ,  C08G59/62 ,  C08K5/00 ,  H05K1/03 ,  H05K3/02

CPC分类号： C08L63/04 ,  C08G59/4064 ,  C08G59/621 ,  C08K5/0066 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00

摘要： A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

公开(公告)号：US09288904B2

公开(公告)日：2016-03-15

申请号：US13739666

申请日：2013-01-11

申请人： ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.

发明人： Rong-Tao Wang ,  Li-Ming Chou ,  Li-Chih Yu ,  Yu-Te Lin

IPC分类号： B32B27/38 ,  H05K1/03 ,  C08L63/00 ,  C08G59/50 ,  C08J5/24

CPC分类号： H05K1/0353 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/31529

摘要： A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

摘要翻译： 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯并恶嗪树脂; （C）5〜50重量份的二烯丙基双酚A树脂; 和（D）0.05〜20重量份的胺固化剂。 无卤树脂组合物包括具有低介电常数（Dk），低耗散因数（Df），高耐热性和高阻燃性的特定成分和比例。 无卤素树脂组合物适用于制备预浸料或树脂膜，因此适用于覆铜层压板和印刷电路板。