公开(公告)号：US20190013120A1

公开(公告)日：2019-01-10

申请号：US16061801

申请日：2016-10-18

Applicant: EPCOS AG

Inventor： Christian Faistauer ,  Klaus-Dieter Aichholzer ,  Sebastian Brunner ,  Edmund Payr ,  Günter Pudmich

IPC: H01C7/12 ,  H01C1/14 ,  H01C1/034 ,  H01C7/102 ,  H01L23/60

Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.

公开(公告)号：US20190019604A1

公开(公告)日：2019-01-17

申请号：US16064809

申请日：2017-01-10

Applicant: EPCOS AG

Inventor： Sebastian Brunner ,  Christian Faistauer ,  Günter Pudmich ,  Edmund Payr ,  Kurt Wiesbauer

IPC: H01C7/10 ,  H01C1/144 ,  H01C17/065 ,  H01C17/28 ,  H01C7/102

Abstract: A green film composed of varistor material is laminated on a ceramic main body (GK), which is provided with metallizations (EP1, AF) on both sides, and is sintered to form a varistor layer (VS). A terminating electrode pair (EP1, EP2) completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair (EP2) can serve directly as a terminal contact for mounting an electrical component.

公开(公告)号：US11239010B2

公开(公告)日：2022-02-01

申请号：US16061801

申请日：2016-10-18

Applicant: EPCOS AG

Inventor： Christian Faistauer ,  Klaus-Dieter Aichholzer ,  Sebastian Brunner ,  Edmund Payr ,  Günter Pudmich

IPC: B23P19/00 ,  H01C7/12 ,  H01C1/034 ,  H01C1/14 ,  H01C7/102 ,  H01L23/60

Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.

公开(公告)号：US10818641B2

公开(公告)日：2020-10-27

申请号：US16086567

申请日：2017-03-21

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Stephan Steinhauser ,  Günter Pudmich ,  Edmund Payr ,  Sebastian Brunner

IPC: H01L23/48 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L33/50 ,  H01L27/02 ,  H01L33/64 ,  H01L33/00

Abstract: A multi-LED system is disclosed. In an embodiment a multi-LED system includes a ceramic multilayer substrate in which at least two ESD protection structures are integrated, at least two light-emitting diodes arranged on the substrate and at least two capping layers covering one of the light-emitting diodes.

公开(公告)号：US20190103384A1

公开(公告)日：2019-04-04

申请号：US16086567

申请日：2017-03-21

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Stephan Steinhauser ,  Günter Pudmich ,  Edmund Payr ,  Sebastian Brunner

IPC: H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/50 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/504 ,  H01L33/641

Abstract: A multi-LED system is disclosed. In an embodiment a multi-LED system includes a ceramic multilayer substrate in which at least two ESD protection structures are integrated, at least two light-emitting diodes arranged on the substrate and at least two capping layers covering one of the light-emitting diodes.