公开(公告)号：US20200259054A1

公开(公告)日：2020-08-13

申请号：US16863107

申请日：2020-04-30

申请人： EPISTAR CORPORATION

发明人： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Wei-Kang CHENG

IPC分类号： H01L33/60 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62

摘要： The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

公开(公告)号：US20170345983A1

公开(公告)日：2017-11-30

申请号：US15165943

申请日：2016-05-26

申请人： EPISTAR CORPORATION

发明人： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Wei-Kang CHENG

IPC分类号： H01L33/60 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0091

摘要： The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

公开(公告)号：US20190157529A1

公开(公告)日：2019-05-23

申请号：US16240362

申请日：2019-01-04

申请人： EPISTAR CORPORATION

发明人： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Wei-Kang CHENG

IPC分类号： H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62

摘要： The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

公开(公告)号：US20170325303A1

公开(公告)日：2017-11-09

申请号：US15601616

申请日：2017-05-22

申请人： EPISTAR CORPORATION

发明人： Chih-Shu HUANG ,  Chun-Ju TUN ,  Shyi-Ming PAN ,  Wei-Kang CHENG ,  Keng-Ying LIAO

IPC分类号： H05B33/08 ,  H01L33/00 ,  H01L29/872 ,  H01L27/15 ,  H05B37/02 ,  H01L27/06

CPC分类号： H05B33/0815 ,  H01L27/0629 ,  H01L27/15 ,  H01L29/872 ,  H01L33/0025 ,  H05B33/0824 ,  H05B37/02 ,  Y02B20/348

摘要： A semiconductor component including a Wheatstone bridge rectifying circuit and a transistor is provided, wherein the Wheatstone bridge rectifying circuit and the transistor are formed on a same growth substrate, and wherein the Wheatstone bridge rectifying circuit includes a first rectifying diode; a second rectifying diode electrically connected to the first rectifying diode; a third rectifying diode electrically connected to the second rectifying diode; and a fourth rectifying diode electrically connected to the third rectifying diode.