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公开(公告)号：US20150219689A1
公开(公告)日：2015-08-06
申请号：US14687490
申请日：2015-04-15
Applicant: Everspin Technologies, Inc.
Inventor： Lianjun LIU , Phillip MATHER
CPC classification number: G01R1/07307 , G01R33/0035 , G01R33/09 , G01R35/00
Abstract: A probe card and method are provided for testing magnetic sensors at the wafer level. The probe card has one or more probe tips having a first pair of solenoid coils in parallel configuration on first opposed sides of each probe tip to supply a magnetic field in a first (X) direction, a second pair of solenoid coils in parallel configuration on second opposed sides of each probe tip to supply a magnetic field in a second (Y) direction orthogonal to the first direction, and an optional third solenoid coil enclosing or inscribing the first and second pair to supply a magnetic field in a third direction (Z) orthogonal to both the first and second directions. The first pair, second pair, and third coil are each symmetrical with a point on the probe tip array, the point being aligned with and positioned close to a magnetic sensor during test.
Abstract translation: 提供探针卡和方法来测试晶片级的磁性传感器。 探针卡具有一个或多个探针尖端，其具有在每个探针尖端的第一相对侧上并联配置的第一对螺线管线圈，以在第一（X）方向上提供磁场，第二对螺线管线圈以 每个探针尖端的第二相对侧在与第一方向正交的第二（Y）方向上提供磁场，以及可选的第三电磁线圈，其包围或刻写第一和第二对以在第三方向（Z ）与第一和第二方向正交。 第一对，第二对和第三线圈各自与探针尖端阵列上的点对称，在测试期间该点与磁性传感器对准并靠近磁性传感器。
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公开(公告)号：US20240090335A1
公开(公告)日：2024-03-14
申请号：US18307633
申请日：2023-04-26
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H10N50/01 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H10B61/00 , H10N50/10 , H10N50/80 , H10N59/00
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US20210265563A1
公开(公告)日：2021-08-26
申请号：US17245882
申请日：2021-04-30
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US20170117461A1
公开(公告)日：2017-04-27
申请号：US15388650
申请日：2016-12-22
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US20190221737A1
公开(公告)日：2019-07-18
申请号：US16360099
申请日：2019-03-21
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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Patent Agency Ranking
公开(公告)号：US20160163962A1
公开(公告)日：2016-06-09
申请号：US15041178
申请日：2016-02-11
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Phillip MATHER , Jon SLAUGHTER , Nicholas RIZZO
IPC: H01L43/02
CPC classification number: H01L43/02 , G01R33/098 , H01L27/22 , H01L43/08 , H01L43/12
Abstract: A magnetic sensor includes a plurality of groups, each group comprising a plurality of magnetic tunnel junction (MTJ) devices having a plurality of conductors configured to couple the MTJ devices within one group in parallel and the groups in series enabling independent optimization of the material resistance area (RA) of the MTJ and setting total device resistance so that the total bridge resistance is not so high that Johnson noise becomes a signal limiting concern, and yet not so low that CMOS elements may diminish the read signal. Alternatively, the magnetic tunnel junction devices within each of at least two groups in series and the at least two groups in parallel resulting in the individual configuration of the electrical connection path and the magnetic reference direction of the reference layer, leading to independent optimization of both functions, and more freedom in device design and layout. The X and Y pitch of the sense elements are arranged such that the line segment that stabilizes, for example, the right side of one sense element; also stabilizes the left side of the adjacent sense element.
Abstract translation: 磁传感器包括多个组，每个组包括多个磁隧道结（MTJ）装置，其具有多个导体，其被配置成并联连接一组内的MTJ装置，并且该组可串联实现材料电阻的独立优化 面积（RA），并设置总的器件电阻，使得总的桥接电阻不是很高，以至于Johnson噪声成为限制信号的关键，而不是那么低，使得CMOS元件可能会削弱读取信号。 或者，串联的至少两组中的每一个中的磁隧道结装置和并联的至少两个组，导致电连接路径的单独配置和参考层的磁参考方向，导致两者的独立优化 功能，以及更多设备设计和布局自由。 感测元件的X和Y间距被布置成使得例如稳定一个感测元件的右侧的线段; 也稳定了相邻感测元件的左侧。
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公开(公告)号：US20160260894A1
公开(公告)日：2016-09-08
申请号：US15142721
申请日：2016-04-29
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US20160104835A1
公开(公告)日：2016-04-14
申请号：US14954075
申请日：2015-11-30
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Abstract translation: 半导体工艺集成了三个桥接电路，每个电路包括在单个芯片上作为惠斯登电桥耦合的磁阻传感器，以在三个正交方向上感测磁场。 该过程包括形成磁阻传感器的各种沉积和蚀刻步骤以及在三个桥接电路中的一个上的多个通量引导器，用于将“Z”轴磁场传送到在XY平面中定向的传感器上。
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公开(公告)号：US20160260895A1
公开(公告)日：2016-09-08
申请号：US15145515
申请日：2016-05-03
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Renu WHIG , Phillip MATHER , Kenneth SMITH , Sanjeev AGGARWAL , Jon SLAUGHTER , Nicholas RIZZO
CPC classification number: H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
Abstract: A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Abstract translation: 半导体工艺集成了三个桥接电路，每个电路包括在单个芯片上作为惠斯登电桥耦合的磁阻传感器，以在三个正交方向上感测磁场。 该过程包括形成磁阻传感器的各种沉积和蚀刻步骤以及在三个桥接电路中的一个上的多个通量引导器，用于将“Z”轴磁场传送到在XY平面中定向的传感器上。
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公开(公告)号：US20160084920A1
公开(公告)日：2016-03-24
申请号：US14953572
申请日：2015-11-30
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Lianjun LIU , Phillip MATHER , Jon SLAUGHTER
CPC classification number: G01R33/0029 , G01R33/0041 , G01R33/04 , G01R33/098
Abstract: A magnitude and direction of at least one of a reset current and a second stabilization current (that produces a reset field and a second stabilization field, respectively) is determined that, when applied to an array of magnetic sense elements, minimizes the total required stabilization field and reset field during the operation of the magnetic sensor and the measurement of the external field. Therefore, the low field sensor operates optimally (with the highest sensitivity and the lowest power consumption) around the fixed external field operating point. The fixed external field is created by other components in the sensor device housing (such as speaker magnets) which have a high but static field with respect to the low (earth's) magnetic field that describes orientation information.
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