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公开(公告)号:US10454148B2
公开(公告)日:2019-10-22
申请号:US15917120
申请日:2018-03-09
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
IPC分类号: H01P1/203 , H01P3/08 , H03H7/01 , H03H9/64 , H01P1/207 , H03H9/145 , H03H9/13 , H03H9/05 , H03H9/54 , H01P1/208 , H01P5/02
摘要: A compact band pass filter (BPF), including a first transmission line electromagnetically coupled to a second transmission line; and an isolating surface positioned between the first transmission line and the second transmission line, wherein the isolating surface includes at least one aperture designed to produce a desired electromagnetic coupling between the first transmission line and the second transmission line wherein the coupling produces a passband such that certain frequencies within an input transmission signal are filtered out.
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公开(公告)号:US20140334120A1
公开(公告)日:2014-11-13
申请号:US14339477
申请日:2014-07-24
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
CPC分类号: H05K1/183 , H01C17/22 , H01L22/14 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L23/66 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L25/105 , H01L2223/6655 , H01L2224/16225 , H01L2224/81439 , H01L2224/81447 , H01L2224/8149 , H01L2224/81493 , H01L2225/1023 , H01L2225/1047 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H05K3/32 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/4913 , Y10T29/53022 , Y10T29/53174 , H01L2924/00
摘要: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.
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公开(公告)号:US20140218883A1
公开(公告)日:2014-08-07
申请号:US14251606
申请日:2014-04-13
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
CPC分类号: H05K1/0284 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2924/1461 , H01L2924/15156 , H01L2924/15311 , H01L2924/1627 , H05K1/144 , H05K1/183 , H05K3/306 , H05K3/32 , H05K3/36 , H05K3/4697 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/53022 , H01L2924/00
摘要: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.
摘要翻译: 电子模块包括基板,其包括具有多个侧面的电介质材料,所述电介质材料包括第一侧面和第二侧面,以及分别在所述第一侧面和所述第二侧面中的第一和第二空腔。 第一和第二空腔内的第一和第二导电触点构造成与分别安装在第一和第二腔中的至少第一和第二电子部件接触。 衬底内的导电迹线与第一和第二导电触点电连通。
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公开(公告)号:US09155198B2
公开(公告)日:2015-10-06
申请号:US14339477
申请日:2014-07-24
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
IPC分类号: H05K1/18 , H05K3/32 , H05K1/11 , H01L23/13 , H01L21/66 , H01L23/04 , H01L23/15 , H01L23/538 , H01L25/065 , H01L25/10 , H01C17/22 , H01L23/66 , H01L23/00
CPC分类号: H05K1/183 , H01C17/22 , H01L22/14 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L23/66 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L25/105 , H01L2223/6655 , H01L2224/16225 , H01L2224/81439 , H01L2224/81447 , H01L2224/8149 , H01L2224/81493 , H01L2225/1023 , H01L2225/1047 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H05K3/32 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/4913 , Y10T29/53022 , Y10T29/53174 , H01L2924/00
摘要: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.
摘要翻译: 电子模块包括基板,其包括具有多个侧面的电介质材料,所述电介质材料包括第一侧面和第二侧面,以及分别在所述第一侧面和所述第二侧面中的第一和第二空腔。 第一和第二空腔内的第一和第二导电触点构造成与分别安装在第一和第二腔中的至少第一和第二电子部件接触。 衬底内的导电迹线与第一和第二导电触点电连通。
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公开(公告)号:US20150131248A1
公开(公告)日:2015-05-14
申请号:US14397903
申请日:2013-05-09
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
CPC分类号: H05K1/0284 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2924/1461 , H01L2924/15156 , H01L2924/15311 , H01L2924/1627 , H05K1/144 , H05K1/183 , H05K3/306 , H05K3/32 , H05K3/36 , H05K3/4697 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/53022 , H01L2924/00
摘要: An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted in the cavity. Second conductive contacts (44) on a surface of the substrate that surrounds the cavity are configured for contact with at least a second electronic component (28, 30) that is mounted over the cavity. Conductive traces (36, 48) within the substrate are in electrical communication with the first and second conductive contacts.
摘要翻译: 电子模块(20,39,60,80,120,140,144)包括衬底(21),其包括形成在其中的空腔(40,42,134,142)的电介质材料。 空腔内的第一导电触点(44)构造成与安装在空腔中的至少一个第一电子部件(32)接触。 围绕空腔的基板的表面上的第二导电触点(44)构造成与安装在空腔上的至少第二电子部件(28,30)接触。 衬底内的导电迹线(36,48)与第一和第二导电触点电连通。
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公开(公告)号:US10211502B2
公开(公告)日:2019-02-19
申请号:US16100911
申请日:2018-08-10
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
摘要: A wide band radio frequency (RF) circulator is provided. The circulator includes a first stage having four ports; and a second stage having four ports, wherein the first stage and the second stage are connected via a pair of reciprocal delay lines, and wherein each of the first stage and the second stage includes a pair of couplers.
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公开(公告)号:US10141956B2
公开(公告)日:2018-11-27
申请号:US14970652
申请日:2015-12-16
申请人: EAGANTU LTD.
发明人: Michael Dakhiya , Eran Shaked
摘要: A duplexing system including: a duplexer; an antenna capable of transmitting and receiving electromagnetic signals; a transmitter adapted to couple electromagnetic signals to said antenna for transmission; a receiver capable of receiving electromagnetic signals; wherein the duplexer includes a first transmission line and a second transmission line, wherein a portion of said first transmission line is placed in proximity to a portion of said second transmission line, wherein one end of said first transmission line is connected to a first duplexer port coupled to said antenna and the second end of said first transmission line is connected to a second duplexer port coupled to said transmitter; and wherein one end of said second transmission line is connected to a third duplexer port coupled to said receiver and the second end of said second transmission line is coupled to ground or to a fourth duplexer port coupled to ground.
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公开(公告)号:US10340577B2
公开(公告)日:2019-07-02
申请号:US15434800
申请日:2017-02-16
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked , Oleg Dounaevsky
摘要: A wide band directional coupler is disclosed. The coupler includes a main transmission line connected between an input port and an output port; and a coupling transmission line having a first length and connected between a coupling port and an isolation port, wherein the coupling transmission line is coupled to the main transmission line through a coupling capacitive connection and a mutual inductive connection, wherein at least a distance between the main transmission line and the coupling transmission line varies along the first length of the coupling transmission line such that any one of a capacitance value of the capacitive connection and an inductance value of the inductive connection is characterized by a relatively low value, wherein a coupling factor of the wide band directional couple remains substantially constant throughout an operating frequency band of the wide band directional coupler.
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公开(公告)号:US10050324B2
公开(公告)日:2018-08-14
申请号:US15876648
申请日:2018-01-22
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
摘要: A wide band radio frequency (RF) circulator is presented. The RF circulator includes at least one stage having four ports configured to circulate an input RF signal from a first port to a second port while isolating a third port, from the second port to the third port while isolating the first port, and from the third port to the first port while isolating the first port, wherein the fourth port is grounded; and wherein the at least one stage includes at least a pair of couplers connected via a delay line, wherein each coupler includes a main transmission line and a coupling transmission line disposed on distinct dielectric layers.
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公开(公告)号:US09912028B2
公开(公告)日:2018-03-06
申请号:US15481257
申请日:2017-04-06
申请人: Eagantu Ltd.
发明人: Michael Dakhiya , Eran Shaked
摘要: A wide band radio frequency (RF) circulator is presented. The RF circulator includes at least one stage having four ports, a first end, and a second end, wherein a first port and a third port are connected at the first end of the at least one stage, wherein a second port and a fourth port are connected at the second end of the at least one stage, wherein each of the at least one stage includes a pair of couplers connected through a first delay line and a second delay line, thereby forming a network of couplers in the at least one stage.
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