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    Micromechanical device fabrication
    3.
    发明授权
    Micromechanical device fabrication 有权
    微机械装置制造

    公开(公告)号：US07651734B2

    公开(公告)日：2010-01-26

    申请号：US10935949

    申请日：2004-09-07

    Applicant: Simon Joshua Jacobs

    Inventor： Simon Joshua Jacobs

    IPC: C23C16/50

    CPC classification number: B81C1/00896 ,  G02B26/0841

    Abstract: A method of fabricating a micromechanical device. Several of the micromechanical devices are fabricated 20 on a common wafer. After the devices are fabricated, the sacrificial layers are removed 22 leaving open spaces where the sacrificial layers once were. These open spaces allow for movement of the components of the micromechanical device. The devices optionally are passivated 24, which may include the application of a lubricant. After the devices have been passivated, they are tested 26 in wafer form. After testing 26, any surface treatments that are not compatible with the remainder of the processing steps are removed 28. The substrate wafer containing the completed devices receives a conformal overcoat 30. The overcoat layer is thick enough to project the micromechanical structures, but thin and light enough to prevent deforming the underlying micromechanical structures. Once the devices on the wafer are overcoated, the wafer is separated 32, and the known good devices are cleaned 34 to remove debris left by the dicing process. Once the devices are separated and cleaned, the overcoat may be removed, however, the overcoat typically is left in place to protect the device during the initial stages of the packaging process. Typically the devices are mounted 36 in the package substrate, the overcoat removed 38 from the devices, and the package containing the micromechanical device finished by sealing the package to enclose the device.

    Abstract translation: 一种制造微机械装置的方法。 几个微机械器件在公共晶片上制造20。 在器件制造之后，去除牺牲层22，留下牺牲层一次的开放空间。 这些开放空间允许微机械装置的部件移动。 所述装置可选地被钝化24，其可以包括施加润滑剂。 在器件被钝化之后，它们以晶片形式被测试26。 在测试26之后，除去与其余处理步骤不相容的任何表面处理。含有完成的器件的衬底晶片接收共形外涂层30.该外涂层足够厚以使微机械结构突出，但是薄和 光足以防止底层微机械结构变形。 一旦晶片上的器件被覆盖，晶片被分离32，并且已知的良好器件被清洁34以去除由切割工艺留下的残留物。 一旦设备被分离和清洁，可以去除外涂层，然而，外包层通常留在适当位置以在包装过程的初始阶段保护装置。 通常，将器件安装在封装衬底36中，从器件移除外涂层38，并且将包含微机械器件的封装通过密封封装封闭器件而完成。

    SOLID-STATE OPTICAL MODULATOR
    4.
    发明申请
    SOLID-STATE OPTICAL MODULATOR 有权
    固态光电调制器

    公开(公告)号：US20090168136A1

    公开(公告)日：2009-07-02

    申请号：US11966314

    申请日：2007-12-28

    Applicant: Simon Joshua Jacobs

    Inventor： Simon Joshua Jacobs

    IPC: G02F1/01 ,  H01L21/02

    CPC classification number: G02F1/0136 ,  G02F1/03 ,  G02F1/13718 ,  G02F2201/343

    Abstract: A spatial light modulator comprises a solid-state chiral material disposed between electrodes such that the polarization direction of the polarized light incident thereto can be controlled through an electrical field established between the electrodes.

    Abstract translation: 空间光调制器包括设置在电极之间的固态手性材料，使得可以通过在电极之间建立的电场来控制入射到其上的偏振光的偏振方向。

    MEMS passivation with phosphonate surfactants
    6.
    发明授权
    MEMS passivation with phosphonate surfactants 有权
    具有膦酸盐表面活性剂的MEMS钝化

    公开(公告)号：US07410820B2

    公开(公告)日：2008-08-12

    申请号：US11031655

    申请日：2005-01-05

    Applicant: Simon Joshua Jacobs ,  Seth Adrian Miller

    Inventor： Simon Joshua Jacobs ,  Seth Adrian Miller

    IPC: H01L21/00

    CPC classification number: B81B3/0005 ,  B81B2201/042 ,  B81C2201/112 ,  B82Y30/00

    Abstract: Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled monolayers at the device surface. The higher binding energy of the phosphonate end groups (as compared to carboxylate surfactants) improves the thermal stability of the resulting layer.

    Abstract translation: 磷酸盐表面活性剂用于钝化MEMS器件的表面，例如数字微镜器件。 表面活性剂从蒸气或溶液中吸附，在器件表面形成自组装的单层膜。 膦酸酯端基（与羧酸酯表面活性剂相比）的较高的结合能改善了所得层的热稳定性。

    Micromechanical device lubrication
    7.
    发明授权
    Micromechanical device lubrication 有权
    微机械装置润滑

    公开(公告)号：US08436453B2

    公开(公告)日：2013-05-07

    申请号：US11617459

    申请日：2006-12-28

    Applicant: Simon Joshua Jacobs ,  Seth A. Miller

    Inventor： Simon Joshua Jacobs ,  Seth A. Miller

    IPC: H01L23/20

    CPC classification number: B81B3/0005 ,  B81B3/0075 ,  G02B26/0833

    Abstract: The present application is directed to a reservoir for use with a micro-electromechanical device having a first surface area to be lubricant. The reservoir comprises a solid component with a porous structure having a second surface area. The second surface area is greater than the first surface area. The reservoir also comprises a lubricant capable of reversibly reacting with either the solid component or the first surface area of the micro-electromechanical device.

    Abstract translation: 本申请涉及一种与具有第一表面积为润滑剂的微机电装置一起使用的贮存器。 储存器包括具有第二表面积的多孔结构的固体成分。 第二表面积大于第一表面积。 储存器还包括能够与微机电装置的固体组分或第一表面区域可逆地反应的润滑剂。

    DEVICE PACKAGE AND METHOD OF MAKING A DEVICE PACKAGE
    9.
    发明申请
    DEVICE PACKAGE AND METHOD OF MAKING A DEVICE PACKAGE 有权
    装置包装和制造装置包装的方法

    公开(公告)号：US20080160268A1

    公开(公告)日：2008-07-03

    申请号：US11617459

    申请日：2006-12-28

    Applicant: Simon Joshua Jacobs ,  Seth A. Miller

    Inventor： Simon Joshua Jacobs ,  Seth A. Miller

    IPC: B32B7/02 ,  B05D3/00

    CPC classification number: B81B3/0005 ,  B81B3/0075 ,  G02B26/0833

    Abstract: The present application is directed to a reservoir for use with a micro-electromechanical device having a first surface area to be lubricant. The reservoir comprises a solid component with a porous structure having a second surface area. The second surface area is greater than the first surface area. The reservoir also comprises a lubricant capable of reversibly reacting with either the solid component or the first surface area of the micro-electromechanical device.

    Abstract translation: 本申请涉及一种与具有第一表面积为润滑剂的微机电装置一起使用的贮存器。 储存器包括具有第二表面积的多孔结构的固体成分。 第二表面积大于第一表面积。 储存器还包括能够与微机电装置的固体组分或第一表面区域可逆地反应的润滑剂。

    MEMS device with controlled gas space chemistry
    10.
    发明授权
    MEMS device with controlled gas space chemistry 有权
    具有可控气体空间化学的MEMS器件

    公开(公告)号：US06746886B2

    公开(公告)日：2004-06-08

    申请号：US10101669

    申请日：2002-03-18

    Applicant: Walter M. Duncan ,  Simon Joshua Jacobs ,  Michael R. Douglass ,  Richard O. Gale

    Inventor： Walter M. Duncan ,  Simon Joshua Jacobs ,  Michael R. Douglass ,  Richard O. Gale

    IPC: H01L2156

    CPC classification number: G02B1/14 ,  B81B7/0012 ,  B81B2201/042 ,  G02B1/105 ,  G02B26/0833 ,  G03B27/42 ,  G03F7/70291 ,  G03F7/70983

    Abstract: A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

    Abstract translation: 用于保护在紫外线照射应用中使用的MEMS器件的过程不会由于UV通量和封装气体成分之间的光化学活化而损坏，所述UV通量和封装气体成分由放置在器件封装中的各种润滑剂和钝化剂的排出物形成，以防止粘附 MEMS器件的运动部件。 该方法用金属卤化物膜涂覆MEMS器件和封装的光学窗表面的暴露表面以消除该光化学活化，因此显着地延长了MEMS器件的可靠性和使用寿命。

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