公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20150050863A1

公开(公告)日：2015-02-19

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。