公开(公告)号：US20210138606A1

公开(公告)日：2021-05-13

申请号：US16980995

申请日：2019-02-20

Applicant: EBARA CORPORATION

Inventor： Keisuke NAMIKI ,  Makoto FUKUSHIMA ,  Osamu NABEYA

IPC: B24B37/32 ,  B24B37/04 ,  B24B37/20 ,  H01L21/304

Abstract: The present invention relates to a substrate holding apparatus used to polish a surface of the substrate by pressing the substrate against a polishing tool, such as a polishing pad. Further, the present invention relates to a method of manufacturing a drive ring used for the substrate holding apparatus. A substrate holding apparatus (1) includes a polishing head body (10), a drive ring (81) disposed below the polishing head body (10), and a retainer ring (40) fixed to the drive ring (81). The drive ring (81) has an annular contact surface (81a) that contacts the retainer ring (40). A flatness in the circumferential direction of the contact surface (81a) is 4.6 μm or less. The flatness represents a difference in a height between the highest position and the lowest position of the contact surface (81a).

公开(公告)号：US20180065228A1

公开(公告)日：2018-03-08

申请号：US15799582

申请日：2017-10-31

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA

IPC: B24B37/32 ,  B24B37/30 ,  B24B41/00 ,  B24B37/10

CPC classification number: B24B37/32 ,  B24B37/107 ,  B24B37/30 ,  B24B41/007

Abstract: A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. The rotary ring has rollers which are in contact with the stationary ring.

公开(公告)号：US20170144267A1

公开(公告)日：2017-05-25

申请号：US15402703

申请日：2017-01-10

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

公开(公告)号：US20150202733A1

公开(公告)日：2015-07-23

申请号：US14599976

申请日：2015-01-19

Applicant: EBARA CORPORATION

Inventor： Hozumi YASUDA ,  Makoto FUKUSHIMA ,  Osamu NABEYA ,  Masahiko KISHIMOTO

IPC: B24B37/32 ,  H01L21/304 ,  B24B37/10

CPC classification number: B24B37/32 ,  B24B37/107

Abstract: A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.

Abstract translation: 公开了一种基板保持装置和抛光装置，其可以通过阻止从保持环传递到顶环体的振动来整体减小顶环的振动。 基板保持装置包括：顶环主体，具有基板保持面，被配置为将基板保持并压靠在研磨面上;保持环，被配置为围绕基板并接触抛光面;以及驱动环，其包括环状构件 将保持环保持在其下表面上，中心构件设置在顶环体的中心部分并由顶环体支撑，以及连接部分，其构造成连接环构件和中心构件。 驱动环包括第一材料和具有小于第一材料的纵向弹性模量的第二材料。

公开(公告)号：US20240351161A1

公开(公告)日：2024-10-24

申请号：US18634631

申请日：2024-04-12

Applicant: EBARA CORPORATION

Inventor： Tomoko OWADA ,  Osamu NABEYA

IPC: B24B37/10 ,  B24B37/005 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/005 ,  B24B57/02

Abstract: A polishing method and a polishing apparatus that can suppress fluid from remaining on an upper surface of a workpiece, and that can apply an appropriate force to the workpiece to polish the workpiece are disclosed. The polishing method includes: pressurizing a first pressure chamber to move fluid present between an upper surface of the workpiece and the first pressure chamber outward; moving the fluid present between the upper surface of the workpiece and a second pressure chamber outward by pressurizing the second pressure chamber to form a second pressure in the second pressure chamber which is lower than a target pressure when a pressure equal to or higher than the target pressure is formed in the first pressure chamber; and polishing the workpiece after causing the fluid to flow out from the workpiece.

公开(公告)号：US20200094372A1

公开(公告)日：2020-03-26

申请号：US16695637

申请日：2019-11-26

Applicant: Ebara Corporation

Inventor： Hiroyuki SHINOZAKI ,  Makoto FUKUSHIMA ,  Osamu NABEYA

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/683 ,  B24B37/11

Abstract: A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20140065934A1

公开(公告)日：2014-03-06

申请号：US14011626

申请日：2013-08-27

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Osamu NABEYA ,  Shingo TOGASHI

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.

Abstract translation: 在用于保持诸如半导体晶片的基板并将基板压靠在抛光表面上的基板保持装置中使用弹性膜。 弹性膜包括多个同心圆周壁，其被配置为限定用于按压基板的多个加压区域。 加压区域包括位于弹性膜的中央部的中央加压区域，位于弹性膜的最外部的环状边缘加压区域和位于中央加压区域与环状边缘之间的多个中间加压区域 加压区域。 至少一个中间加压区域的面积宽度被设定在允许抛光速率响应宽度即使当面积宽度变化时也不变化的范围内。

公开(公告)号：US20130324012A1

公开(公告)日：2013-12-05

申请号：US13905763

申请日：2013-05-30

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/005 ,  B24B7/22 ,  B24B37/04 ,  B24B37/07 ,  B24B37/32

CPC classification number: B24B37/005 ,  B24B7/228 ,  B24B37/042 ,  B24B37/07 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人

公开(公告)号：US20240025007A1

公开(公告)日：2024-01-25

申请号：US18223326

申请日：2023-07-18

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA

IPC: B24B37/04 ,  B24B37/005

CPC classification number: B24B37/042 ,  B24B37/005

Abstract: A polishing method for a wafer using a polishing head having a plurality of pressure chambers formed by an elastic membrane is disclosed. The polishing method includes: forming a positive pressure in a first pressure chamber and forming a negative pressure in a second chamber to move fluid present between an upper surface of the wafer and the first pressure chamber outward; then forming a positive pressure in the second chamber and forming a negative pressure in a third pressure chamber to move the fluid present between the upper surface of the wafer and the second pressure chamber outward; then forming a positive pressure in outermost pressure chamber of the plurality of pressure chambers to move the fluid present between the upper surface of the wafer and the outermost pressure chamber outward to thereby cause the fluid to flow out from the upper surface of the wafer; and then pressing a lower surface of the wafer against a polishing surface with the elastic membrane to polish the lower surface of the wafer.