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公开(公告)号：US4215098A
公开(公告)日：1980-07-29
申请号：US899896
申请日：1978-04-26
CPC分类号： C01B25/234 , B01D1/00 , C01B25/2346 , C01B25/24 , C01B25/26 , C01B25/38 , Y10S159/01
摘要： Wet process phosphoric acid is heated, preferably in carbon apparatus, by passing alternating current through the acid, to concentrations above 80% P.sub.2 O.sub.5 and preferably temperatures above 500.degree. C. to remove sulphate and fluoride and convert organic and basic impurities into a filterable precipitate: the acid is separated from the precipitate to provide a high purity crystallizable product.
摘要翻译： 通过使交流电流通过酸，将湿法磷酸加热至高于80％P 2 O 5的浓度，优选高于500℃的温度以除去硫酸盐和氟化物，并将有机和碱性杂质转化成可过滤的沉淀物： 将酸与沉淀物分离，得到高纯度的可结晶产物。
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公开(公告)号：US4296082A
公开(公告)日：1981-10-20
申请号：US028680
申请日：1979-04-10
CPC分类号： B01D1/0017 , B01D1/00 , C01B25/234 , C01B25/2346 , C01B25/24 , C01B25/26 , C01B25/38
摘要： Wet process phosphoric acid is heated by passing alternating current through the acid, preferably in carbon apparatus to concentrations above 76% P.sub.2 O.sub.5 and preferably temperatures above 500.degree. C. to remove sulphate and fluoride and convert organic and basic impurities into a filterable precipitate; the acid is separated from the precipitate preferably after dilution with water to provide a high purity crystallizable product.
摘要翻译： 通过使交流电流通过酸，优选在碳装置中将浓度过高的磷酸加热至浓度高于76％的P2O5，优选温度高于500℃以除去硫酸盐和氟化物，并将有机和碱性杂质转化成可过滤的沉淀物; 优选在用水稀释后将酸从沉淀物中分离出来，得到高纯度可结晶产物。
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3.发明授权公开(公告)号：US06329722B1
公开(公告)日：2001-12-11
申请号：US09346636
申请日：1999-07-01
申请人： Wei-Yan Shih , Arthur Wilson , Willmar Subido
发明人： Wei-Yan Shih , Arthur Wilson , Willmar Subido
IPC分类号： H05K332
CPC分类号： H01L24/05 , H01L23/53228 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05001 , H01L2224/05073 , H01L2224/05554 , H01L2224/05611 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48463 , H01L2224/48611 , H01L2224/48624 , H01L2224/48811 , H01L2224/85011 , H01L2224/85099 , H01L2224/85205 , H01L2224/85375 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/01082 , H01L2924/00 , H01L2224/48824 , H01L2924/2075
摘要： A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.
摘要翻译： 在具有铜金属化的集成电路的接合焊盘上设置具有薄金属涂层的装置，例如与铜形成强键的锡， 涂层的表面氧化是自限制的并且易于除去氧化物，此外，涂覆的焊盘在低温下形成金属间化合物，使其可焊接并且与引线键合相容。 通过无电镀提供形成镀锡铜焊盘的低成本工艺。
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公开(公告)号：USD433845S
公开(公告)日：2000-11-21
申请号：US102279
申请日：1999-03-22
申请人： Arthur Wilson , Peter Moon
设计人： Arthur Wilson , Peter Moon
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公开(公告)号：USD433249S
公开(公告)日：2000-11-07
申请号：US102280
申请日：1999-03-22
申请人： Arthur Wilson , Peter Moon
设计人： Arthur Wilson , Peter Moon
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