公开(公告)号：US10217566B2

公开(公告)日：2019-02-26

申请号：US15056156

申请日：2016-02-29

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: C04B35/472 ,  H01G4/12 ,  H01G4/30 ,  C04B35/491 ,  C04B35/493 ,  C04B35/626 ,  C04B35/50 ,  H01G4/008 ,  H01G4/012

Abstract: A ceramic material for capacitors using multilayer technology of formula (I): Pb(1−1.5a)AaBb(Zr1−xTix)(1−c−d−e−f)CeSicO3+y·PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; C is selected from the group consisting of Ni and Cu; and 0

公开(公告)号：US20150131200A1

公开(公告)日：2015-05-14

申请号：US14391323

申请日：2013-02-18

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/12 ,  C04B35/50 ,  H01G4/008 ,  H01G4/30 ,  H01G4/012

CPC classification number: H01G4/30 ,  C04B35/491 ,  C04B35/493 ,  C04B35/50 ,  C04B35/62655 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3291 ,  C04B2235/3296 ,  C04B2235/3418 ,  C04B2235/441 ,  C04B2235/449 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1245

Abstract: A ceramic material for capacitors uses multilayer technology of the general formula: Pb1−1.5a−0.5b+1.5d+e+0.5f)AaBb(Zr1−xTix)(1−c−d−e−f)LidCeFefSicO3+y.PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; B is selected from the group consisting of Na, K and Ag; C is selected from the group consisting of Ni, Cu, Co and Mn; and 0 0.

Abstract translation: 用于电容器的陶瓷材料使用以下通式的多层技术：Pb1-1.5a-0.5b + 1.5d + e + 0.5f）AaBb（Zr1-xTix）（1-c-d-e-f）LidCeFefSicO3 + y。 PBO，其中A选自La，Nd，Y，Eu，Gd，Tb，Dy，Ho，Er和Yb; B选自Na，K和Ag; C选自Ni，Cu，Co和Mn; 和0 0。

公开(公告)号：US10748711B2

公开(公告)日：2020-08-18

申请号：US16090200

申请日：2017-02-23

Applicant: EPCOS AG

Inventor： Juergen Konrad ,  Markus Koini ,  Franz Rinner

IPC: H01G4/30 ,  H01G2/06 ,  H05K1/14 ,  H01G4/12 ,  H01G4/38 ,  H01G4/232

Abstract: The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).

公开(公告)号：US20190115156A1

公开(公告)日：2019-04-18

申请号：US16090200

申请日：2017-02-23

Applicant: EPCOS AG

Inventor： Juergen Konrad ,  Markus Koini ,  Franz Rinner

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12 ,  H01G4/38 ,  H05K1/14

Abstract: The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).

公开(公告)号：US20180158613A1

公开(公告)日：2018-06-07

申请号：US15866385

申请日：2018-01-09

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/2325 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30

Abstract: A capacitor arrangement is disclosed. In an embodiment the arrangement includes a ceramic multilayer capacitor including a main body comprising ceramic layers, first electrode layers and second electrode layers arranged there between and a first external contact and a second external contact on mutually opposite side surfaces, wherein the first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers.

公开(公告)号：US09875851B2

公开(公告)日：2018-01-23

申请号：US15451120

申请日：2017-03-06

Applicant: EPCOS AG

Inventor： Guenter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12 ,  H01G4/008 ,  H01G4/232 ,  C04B35/493 ,  B32B18/00

CPC classification number: H01G4/30 ,  B32B18/00 ,  B32B2457/00 ,  C04B35/493 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3234 ,  C04B2235/3249 ,  C04B2235/3262 ,  C04B2235/3274 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3291 ,  C04B2235/3296 ,  C04B2235/3427 ,  C04B2235/768 ,  C04B2235/79 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/704 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1218 ,  H01G4/1236 ,  H01G4/1245 ,  H01G4/232 ,  H01G4/248

Abstract: A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface of the main body. The second side surface is situated opposite the first side surface and is electrically conductively connected to the second electrode layers.

公开(公告)号：US09691550B2

公开(公告)日：2017-06-27

申请号：US14441467

申请日：2013-10-07

Applicant: EPCOS AG

Inventor： Michael Schossmann ,  Günter Engel ,  Stefan Obermair ,  Bernhard Döllgast ,  Markus Koini ,  Jürgen Konrad

IPC: H01G4/30 ,  H01G4/38 ,  B32B7/04 ,  B32B15/04 ,  B32B37/00 ,  B32B37/18 ,  H01G4/005 ,  H01G4/12

CPC classification number: H01G4/30 ,  B32B7/045 ,  B32B15/04 ,  B32B37/0076 ,  B32B37/18 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2311/00 ,  B32B2311/14 ,  B32B2311/18 ,  B32B2457/16 ,  H01G4/005 ,  H01G4/1218 ,  H01G4/1245 ,  H01G4/385

Abstract: A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor.

公开(公告)号：US20150371778A1

公开(公告)日：2015-12-24

申请号：US14767015

申请日：2014-02-10

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/232 ,  H01G4/224 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G4/2325 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30

Abstract: A capacitor arrangement includes at least one ceramic multilayer capacitor with a main body having ceramic layers and first and second electrode layers arranged therebetween. The capacitor also has a first external contact and a second external contact on mutually opposite side surfaces. The first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers. A contact arrangement includes two metallic contact plates, between which the at least one ceramic multilayer capacitor is arranged. The first and second external contacts are electrically conductively connected in each case to one of the metallic contact plates.

Abstract translation: 电容器装置包括至少一个陶瓷层叠电容器，其中主体具有陶瓷层，并且其间布置有第一和第二电极层。 电容器还具有在相互相对的侧表面上的第一外部触点和第二外部触点。 第一外部接触件导电地连接到第一电极层，并且第二外部接触件导电地连接到第二电极层。 接触装置包括两个金属接触板，其间布置有至少一个陶瓷层叠电容器。 第一和第二外部触点在每种情况下导电地连接到金属接触板之一。

公开(公告)号：US20150194264A1

公开(公告)日：2015-07-09

申请号：US14415548

申请日：2013-06-19

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Jürgen Konrad ,  Stefan Obermair

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/005 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G2/02 ,  H01G4/005 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/2325 ,  H01G4/30

Abstract: An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.

Abstract translation: 公开了电气部件。 在一个实施例中，所述部件包括部件主体和至少一个具有塑料体的连接元件，其中所述至少一个连接元件经由金属层连接到所述部件主体。

公开(公告)号：US11212947B2

公开(公告)日：2021-12-28

申请号：US16090747

申请日：2017-04-05

Applicant: EPCOS AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Georg Kügerl

IPC: H05K7/20 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H01G4/12 ,  C04B35/493 ,  H01G4/008 ,  C04B37/00 ,  C04B37/02 ,  H01G4/228 ,  H01L23/373 ,  H01L23/00 ,  H01L25/16 ,  H01L49/02 ,  H01G2/08

Abstract: A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.