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公开(公告)号：US09691550B2
公开(公告)日：2017-06-27
申请号：US14441467
申请日：2013-10-07
Applicant: EPCOS AG
Inventor： Michael Schossmann , Günter Engel , Stefan Obermair , Bernhard Döllgast , Markus Koini , Jürgen Konrad
CPC classification number: H01G4/30 , B32B7/045 , B32B15/04 , B32B37/0076 , B32B37/18 , B32B2307/202 , B32B2307/204 , B32B2311/00 , B32B2311/14 , B32B2311/18 , B32B2457/16 , H01G4/005 , H01G4/1218 , H01G4/1245 , H01G4/385
Abstract: A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor.
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2.发明申请公开(公告)号：US20150194264A1
公开(公告)日：2015-07-09
申请号：US14415548
申请日：2013-06-19
Applicant: EPCOS AG
Inventor： Günter Engel , Michael Schossmann , Markus Koini , Jürgen Konrad , Stefan Obermair
CPC classification number: H01G4/228 , H01G2/02 , H01G4/005 , H01G4/1209 , H01G4/1218 , H01G4/2325 , H01G4/30
Abstract: An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.
Abstract translation: 公开了电气部件。 在一个实施例中，所述部件包括部件主体和至少一个具有塑料体的连接元件，其中所述至少一个连接元件经由金属层连接到所述部件主体。
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公开(公告)号：US11342126B2
公开(公告)日：2022-05-24
申请号：US15553430
申请日：2015-12-21
Applicant: Epcos AG
Inventor： Markus Koini , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Georg Kügerl , Thomas Wippel
Abstract: An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.
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公开(公告)号：US10943740B2
公开(公告)日：2021-03-09
申请号：US16447639
申请日：2019-06-20
Applicant: Epcos AG
Inventor： Markus Koini , Christoph Auer , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Thomas Wippel
Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.
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5.发明申请公开(公告)号：US20190304702A1
公开(公告)日：2019-10-03
申请号：US16447639
申请日：2019-06-20
Applicant: Epcos AG
Inventor： Markus Koini , Christoph Auer , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Thomas Wippel
IPC: H01G4/38 , H01R43/26 , H01G4/248 , H05K1/18 , H01G4/232 , H05K3/34 , H01G4/228 , H01G2/06 , H01G4/30
Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.
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Patent Agency Ranking
公开(公告)号：US09865394B2
公开(公告)日：2018-01-09
申请号：US14415548
申请日：2013-06-19
Applicant: EPCOS AG
Inventor： Günter Engel , Michael Schossmann , Markus Koini , Jürgen Konrad , Stefan Obermair
CPC classification number: H01G4/228 , H01G2/02 , H01G4/005 , H01G4/1209 , H01G4/1218 , H01G4/2325 , H01G4/30
Abstract: An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.
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公开(公告)号：US10395843B2
公开(公告)日：2019-08-27
申请号：US15550672
申请日：2016-02-25
Applicant: Epcos AG
Inventor： Markus Koini , Christoph Auer , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Thomas Wippel
IPC: H01G4/228 , H01G4/232 , H01G2/06 , H01G4/38 , H05K3/34 , H01G4/30 , H05K1/18 , H01G4/248 , H01R43/26
Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.
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公开(公告)号：US20190116687A1
公开(公告)日：2019-04-18
申请号：US16090747
申请日：2017-04-05
Applicant: EPCOS AG
Inventor： Markus Koini , Jürgen Konrad , Georg Kügerl
IPC: H05K7/20 , H01L23/373 , H01L23/00 , H01L49/02 , H01G4/12 , H01G4/30 , H01G4/008 , H01L25/16 , H01G4/228 , H01G4/40 , H01G4/38 , C04B37/02 , C04B35/493
Abstract: The present invention relates to a module (1) which comprises a power semiconductor device (2) and a ceramic capacitor (3) which is configured for cooling the power semiconductor device (2).
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公开(公告)号：US20180247768A1
公开(公告)日：2018-08-30
申请号：US15553430
申请日：2015-12-21
Applicant: Epcos AG
Inventor： Markus Koini , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Georg Kügerl , Thomas Wippel
CPC classification number: H01G4/38 , H01G2/06 , H01G4/228 , H01G4/232 , H01G4/2325 , H01G4/248 , H01G4/30 , H01R43/26 , H05K1/181 , H05K3/3426 , H05K2201/10015 , H05K2201/10757 , H05K2201/10818 , H05K2201/10909 , Y02P70/613
Abstract: The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).
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10.发明申请公开(公告)号：US20180047507A1
公开(公告)日：2018-02-15
申请号：US15550672
申请日：2016-02-25
Applicant: Epcos AG
Inventor： Markus Koini , Christoph Auer , Jürgen Konrad , Franz Rinner , Markus Puff , Monika Stadlober , Thomas Wippel
CPC classification number: H01G4/38 , H01G2/06 , H01G4/228 , H01G4/232 , H01G4/2325 , H01G4/248 , H01G4/30 , H01R43/26 , H05K1/181 , H05K3/3426 , H05K2201/10015 , H05K2201/10757 , H05K2201/10818 , H05K2201/10909 , Y02P70/613
Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.
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