Method and apparatus for adjusting a multi-substrate probe structure
    1.
    发明授权
    Method and apparatus for adjusting a multi-substrate probe structure 失效
    用于调整多基板探针结构的方法和装置

    公开(公告)号:US07845072B2

    公开(公告)日:2010-12-07

    申请号:US12343260

    申请日:2008-12-23

    IPC分类号: H05K3/30

    摘要: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

    摘要翻译: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针,并且每个探针衬底上的探针组合在一起组成一组探针,用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”,“y”和/或“z”方向,并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此,探针可以相对于要测试的装置上的触点对准和/或平坦化。

    Apparatus and method for adjusting an orientation of probes
    2.
    发明授权
    Apparatus and method for adjusting an orientation of probes 失效
    用于调整探针取向的装置和方法

    公开(公告)号:US07671614B2

    公开(公告)日:2010-03-02

    申请号:US11164737

    申请日:2005-12-02

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R31/31905

    摘要: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

    摘要翻译: 可以相对于探针卡组件的元件调整探针卡组件的探针,探针卡组件可以是探针卡组件的元件,其有助于将探针卡组件安装到测试装置。 然后可以将探针卡组件安装在测试装置中,并且可以相对于测试装置(例如测试装置的结构部分或连接到测试装置的结构元件)来调整探针卡组件的取向。

    Adjustment mechanism
    3.
    发明授权
    Adjustment mechanism 失效
    调整机制

    公开(公告)号:US07368930B2

    公开(公告)日:2008-05-06

    申请号:US11464593

    申请日:2006-08-15

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R31/31905

    摘要: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

    摘要翻译: 探针卡组件可以包括支撑结构,多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器,其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时,可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而,当锁定时,柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

    Method and apparatus for indirect planarization
    4.
    发明授权
    Method and apparatus for indirect planarization 失效
    用于间接平面化的方法和装置

    公开(公告)号:US07746089B2

    公开(公告)日:2010-06-29

    申请号:US11537164

    申请日:2006-09-29

    IPC分类号: G01R31/02

    CPC分类号: G01R1/07364

    摘要: Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.

    摘要翻译: 本文提供了用于衬底的间接平面化的方法和装置。 在一个实施例中,用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部,其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

    Probe card assembly with a mechanically decoupled wiring substrate
    5.
    发明授权
    Probe card assembly with a mechanically decoupled wiring substrate 有权
    具有机械去耦接线基板的探头卡组件

    公开(公告)号:US07622935B2

    公开(公告)日:2009-11-24

    申请号:US11551545

    申请日:2006-10-20

    IPC分类号: G01R31/02 G01R31/28

    CPC分类号: G01R31/2893

    摘要: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

    摘要翻译: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针,其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线,并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

    Method and apparatus for adjusting a multi-substrate probe structure
    6.
    发明授权
    Method and apparatus for adjusting a multi-substrate probe structure 失效
    用于调整多基板探针结构的方法和装置

    公开(公告)号:US07471094B2

    公开(公告)日:2008-12-30

    申请号:US11165833

    申请日:2005-06-24

    IPC分类号: G01R31/02

    摘要: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

    摘要翻译: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针,并且每个探针衬底上的探针组合在一起组成一组探针,用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”,“y”和/或“z”方向,并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此,探针可以相对于要测试的装置上的触点对准和/或平坦化。

    ADJUSTMENT MECHANISM
    7.
    发明申请
    ADJUSTMENT MECHANISM 审中-公开
    调整机制

    公开(公告)号:US20080203268A1

    公开(公告)日:2008-08-28

    申请号:US12116032

    申请日:2008-05-06

    IPC分类号: G01R31/02 F16M13/00

    CPC分类号: G01R31/2891 G01R31/31905

    摘要: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

    摘要翻译: 探针卡组件可以包括支撑结构,多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器,其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时,可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而,当锁定时,柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

    TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES
    8.
    发明申请
    TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 有权
    用于测试电子设备的测试系统和方法

    公开(公告)号:US20110156734A1

    公开(公告)日:2011-06-30

    申请号:US12979159

    申请日:2010-12-27

    IPC分类号: G01R31/00

    CPC分类号: G01R31/2891

    摘要: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

    摘要翻译: 被测设备(DUT)可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置,DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中,其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件,使得DUT可以在对准器中对准,而在测试单元中测试已经与对准器中的载体对准的其它DUT。

    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    9.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US20100000080A1

    公开(公告)日:2010-01-07

    申请号:US12477748

    申请日:2009-06-03

    IPC分类号: H05K13/04

    摘要: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    摘要翻译: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。

    Apparatus and method for managing thermally induced motion of a probe card assembly
    10.
    发明授权
    Apparatus and method for managing thermally induced motion of a probe card assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US07285968B2

    公开(公告)日:2007-10-23

    申请号:US11306515

    申请日:2005-12-30

    IPC分类号: G01R31/02

    摘要: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    摘要翻译: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。