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    Proximity head with angled vacuum conduit system, apparatus and method
    2.
    发明授权
    Proximity head with angled vacuum conduit system, apparatus and method 有权
    接近头带有倾斜的真空管道系统，设备和方法

    公开(公告)号：US07975708B2

    公开(公告)日：2011-07-12

    申请号：US11731532

    申请日：2007-03-30

    申请人： Michael Ravkin ,  John M. de Larios ,  Fred C. Redeker ,  Mikhail Korolik ,  Erik M. Freer

    发明人： Michael Ravkin ,  John M. de Larios ,  Fred C. Redeker ,  Mikhail Korolik ,  Erik M. Freer

    IPC分类号： B08B3/00

    CPC分类号： H01L21/67051

    摘要： A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.

    摘要翻译： 包括头表面的接近头。 头表面包括第一平坦区域和多个第一管道。 多个第一导管中的每一个由多个第一离散孔中的对应的一个限定。 多个第一离散孔位于头表面并延伸穿过第一平坦区域。 头表面还包括第二平坦区域和多个第二管道。 多个第二导管由位于头表面中并延伸穿过第二平坦区域的相应多个第二离散孔限定。 头表面还包括设置在第一平坦区域和第二平坦区域之间并与之相邻的第三平坦区域和多个第三导管。 多个第三导管由位于头表面中并延伸穿过第三平坦区域的对应的多个第三离散孔限定。 第三导管相对于第三平坦区域以第一角度形成。 第一个角度在30到60度之间。 还描述了用于处理具有邻近头的衬底的系统和方法。

    Apparatus and system for cleaning a substrate
    6.
    发明授权
    Apparatus and system for cleaning a substrate 有权
    用于清洁衬底的装置和系统

    公开(公告)号：US08522799B2

    公开(公告)日：2013-09-03

    申请号：US11532493

    申请日：2006-09-15

    申请人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker ,  Clint Thomas ,  John Parks

    发明人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker ,  Clint Thomas ,  John Parks

    IPC分类号： B08B3/00

    CPC分类号： H01L21/67051 ,  B08B3/003 ,  B08B3/02

    摘要： An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

    摘要翻译： 公开了一种用于清洁衬底的设备。 该装置具有第一头单元和第二头单元。 第一头单元定位成接近基底的表面，并且具有限定在构造成向基底的表面提供泡沫的第一排通道。 第二头单元被定位成基本上与第一头单元相邻并且靠近衬底的表面。 第二和第三行通道被限定在第二头单元内。 第二排通道被配置成向衬底的表面提供流体。 第三排通道被配置为向基板的表面施加真空。