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    Substrate cleaning technique employing multi-phase solution
    2.
    发明授权
    Substrate cleaning technique employing multi-phase solution 失效
    使用多相溶液的基板清洗技术

    公开(公告)号：US08388762B2

    公开(公告)日：2013-03-05

    申请号：US11743283

    申请日：2007-05-02

    申请人： Erik M. Freer ,  John M. deLarios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    发明人： Erik M. Freer ,  John M. deLarios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    IPC分类号： B08B3/04

    CPC分类号： H01L21/02057 ,  H01L21/02052 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67751

    摘要： A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.

    摘要翻译： 一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。 该方法包括产生流体和衬底之间的相对运动。 相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。 每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。 流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。 以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

    Substrate cleaning technique employing multi-phase solution
    3.
    发明申请
    Substrate cleaning technique employing multi-phase solution 失效
    使用多相溶液的基板清洗技术

    公开(公告)号：US20080271749A1

    公开(公告)日：2008-11-06

    申请号：US11743283

    申请日：2007-05-02

    申请人： Erik M. Freer ,  John M. deLarios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    发明人： Erik M. Freer ,  John M. deLarios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    IPC分类号： C25F3/30 ,  B08B3/00 ,  B08B3/10

    CPC分类号： H01L21/02057 ,  H01L21/02052 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67751

    摘要： A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.

    摘要翻译： 一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。 该方法包括产生流体和衬底之间的相对运动。 相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。 每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。 流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。 以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

    Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution
    5.
    发明申请
    Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution 审中-公开
    通过向清洗溶液施加周期性剪切应力来清洁半导体晶片表面的方法

    公开(公告)号：US20080245390A1

    公开(公告)日：2008-10-09

    申请号：US11732603

    申请日：2007-04-03

    申请人： Erik M. Freer ,  John M. de Larios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    发明人： Erik M. Freer ,  John M. de Larios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    IPC分类号： B08B3/12

    CPC分类号： B08B3/12 ,  H01L21/67051 ,  H01L21/67057

    摘要： Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.

    摘要翻译： 提供了清洁附着在晶片表面上的颗粒污染物的系统和方法。 包括悬浮在清洁介质内的分散的耦合元件的清洁介质被施加在晶片表面上。 外部能量被施加到清洁介质以在介质内产生周期性剪切应力。 周期性剪切应力赋予耦合元件上的动量和/或阻力，导致耦合元件与颗粒污染物相互作用以从晶片表面去除颗粒污染物。

    SUBSTRATE CLEANING TECHNIQUE EMPLOYING MULTI-PHASE SOLUTION
    6.
    发明申请
    SUBSTRATE CLEANING TECHNIQUE EMPLOYING MULTI-PHASE SOLUTION 审中-公开
    基板清洗技术采用多相解决方案

    公开(公告)号：US20130206182A1

    公开(公告)日：2013-08-15

    申请号：US13750226

    申请日：2013-01-25

    申请人： Erik M. Freer ,  John M. de Larios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    发明人： Erik M. Freer ,  John M. de Larios ,  Michael Ravkin ,  Mikhail Korolik ,  Fritz C. Redeker

    IPC分类号： H01L21/02

    CPC分类号： H01L21/02057 ,  H01L21/02052 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67751

    摘要： Apparatus, methods, and computer programs for cleaning opposed surfaces of a semiconductor wafer are presented. One apparatus includes first, second, and third valves, and one or more second drains. The first valves are coupled to a supply of rinsing solution and to first throughways that are coupled to an immersion tank above a region in the immersion tank, the region being defined by an area occupied by the substrate when the substrate is disposed vertically on a support within the immersion tank. The second valves are coupled to first drains and to second throughways that are coupled to the immersion tank below the region, and the third valves are coupled to a supply of cleaning solution and to third throughways that are coupled to the immersion tank below the region. Further, the second drains are coupled to fourth throughways that are coupled to the immersion tank above the region.

    摘要翻译： 提出了用于清洁半导体晶片的相对表面的装置，方法和计算机程序。 一个装置包括第一，第二和第三阀，以及一个或多个第二排水管。 第一阀被连接到冲洗溶液的供应和第一通道，其连接到浸没池中的浸没池上方的区域上，该区域由衬底占据的区域限定，当衬底垂直地布置在支撑件上时 在沉浸池内。 第二阀联接到第一通道和第二通道，第二通道连接到位于该区域下方的浸入式水箱，并且第三阀被联接到清洁溶液的供应和连接到该区域下方的浸没罐的第三通道。 此外，第二排水管连接到连接到该区域上方的浸没罐的第四通道。