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    Circular groove pressing mechanism and method for sputtering target manufacturing
    1.
    发明授权
    Circular groove pressing mechanism and method for sputtering target manufacturing 失效
    圆形槽压制机构及其制造方法

    公开(公告)号：US08453487B2

    公开(公告)日：2013-06-04

    申请号：US12998328

    申请日：2009-10-09

    申请人： Eugene Y. Ivanov ,  Erich Theado ,  David B. Smathers

    发明人： Eugene Y. Ivanov ,  Erich Theado ,  David B. Smathers

    IPC分类号： B21D37/00 ,  B21D31/00

    CPC分类号： B21D17/02 ,  B21D13/02 ,  B21D22/02 ,  C23C14/3407

    摘要： A method of making metal target blank using circular groove pressing includes pressing a metal or metal alloy target blank in a first circular grooved pressing die set into a first concentric corrugated shape while maintaining an original diameter of the target blank to create concentric rings of shear deformation in the target blank. Forces are then applied to the concentric corrugated target blank sufficient to substantially flatten the target blank with a flat die set while maintaining the original diameter of the target blank to restore the target blank to a substantially flat condition. The target blank is pressed in a second circular grooved die set into a second concentric corrugated shape while maintaining the original diameter of the target blank, wherein the second die set has a groove pattern offset from a groove pattern of the first die set so as to create concentric rings of shear deformation in areas of the target blank which were not previously deformed. Forces are again applied to the concentric corrugated target blank sufficient to substantially flatten the target blank with a flat die set while maintaining the original diameter of the target blank to restore the target blank to a substantially flat condition.

    摘要翻译： 使用圆形凹槽压制制造金属靶坯的方法包括将金属或金属合金靶材坯料压在设置成第一同心波纹形状的第一圆形沟槽压模中，同时保持目标坯料的原始直径以产生剪切变形的同心环 在目标空白。 然后将力施加到同心的波纹状目标坯料上，足以在保持目标坯料的原始直径以将目标坯料恢复到基本平坦的状态的同时用平坦的模具组件基本上平坦化目标坯料。 目标坯料被压在第二圆形槽模具中，同时保持目标坯料的原始直径，其中第二模具组具有从第一模具组的凹槽图案偏移的凹槽图案，以便于 在目标坯料的以前没有变形的区域中产生剪切变形的同心环。 力再次施加到同心的波纹状目标坯料上，足以使平板模具基本上平坦化目标坯料，同时保持目标坯料的原始直径以将目标坯料恢复到基本平坦的状态。

    SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY
    2.
    发明申请
    SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY 审中-公开
    目标和背板组件的系统和方法

    公开(公告)号：US20120267243A1

    公开(公告)日：2012-10-25

    申请号：US13541327

    申请日：2012-07-03

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： B23K20/22 ,  B23K20/24 ,  C23C14/34

    CPC分类号： C23C14/3407

    摘要： A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

    摘要翻译： 目标和背板组件及其制造方法。 除了在包括靶材和背板之间的不同材料之间的扩散结合之外，靶材和背板组件还提供靶材和背板之间的机械互锁。 也可以在靶材和背板之间使用中间层。 目标板和背板之一上的多个脊或其他突出的表面特征被连接到目标和背板的另一个上的对应的构件或通道。 目标和背板的不同材料填充由多个脊形成的负角度空腔以及目标和背板的相应通道或构件，以适应扩散接合的不同材料。 具有增加强度的目标和背板组件结果。

    Systems and methods for a target and backing plate assembly
    4.
    发明申请
    Systems and methods for a target and backing plate assembly 审中-公开
    目标和背板组件的系统和方法

    公开(公告)号：US20100038241A1

    公开(公告)日：2010-02-18

    申请号：US12586319

    申请日：2009-09-21

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： C23C14/16 ,  B23K20/00

    CPC分类号： C23C14/3407

    摘要： A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

    摘要翻译： 目标和背板组件及其制造方法。 除了在包括靶材和背板之间的不同材料之间的扩散结合之外，靶材和背板组件还提供靶材和背板之间的机械互锁。 也可以在靶材和背板之间使用中间层。 目标板和背板之一上的多个脊或其他突出的表面特征被连接到目标和背板的另一个上的对应的构件或通道。 目标和背板的不同材料填充由多个脊形成的负角度空腔以及目标和背板的相应通道或构件，以适应扩散接合的不同材料。 具有增加强度的目标和背板组件结果。

    Low temperature sputter target bonding method and target assemblies produced thereby
    5.
    发明授权
    Low temperature sputter target bonding method and target assemblies produced thereby 有权
    由此制造低温溅射靶接合方法和目标组件

    公开(公告)号：US06749103B1

    公开(公告)日：2004-06-15

    申请号：US09720347

    申请日：2000-12-21

    申请人： Eugene Y. Ivanov ,  Harry W. Conard

    发明人： Eugene Y. Ivanov ,  Harry W. Conard

    IPC分类号： B23K3102

    CPC分类号： C23C14/3407 ,  B23K31/02

    摘要： A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assembly is then pressure consolidated at low temperature so that the projections, circumscribed by the bonded zone, penetrate into the softer member promoting the formation of metal to metal cold diffusion type bonds.

    摘要翻译： 低温目标和背板接合工艺和由此制成的组件。 在组件的较硬构件中形成多个突起。 组件通过常规技术围绕外围组件边界进行粘合。 然后将组件在低温下进行压力固化，使得由接合区域限定的突起穿透进入较软的构件，促进金属与金属的冷扩散型键的形成。

    Method of assembling target and backing plates
    6.
    发明授权
    Method of assembling target and backing plates 有权
    目标和背板组装方法

    公开(公告)号：US06725522B1

    公开(公告)日：2004-04-27

    申请号：US10030996

    申请日：2002-01-09

    申请人： Eugene Y. Ivanov ,  Harry W. Conard

    发明人： Eugene Y. Ivanov ,  Harry W. Conard

    IPC分类号： B23P1100

    CPC分类号： B21K25/00 ,  C23C14/3407 ,  Y10T29/49945 ,  Y10T29/49968

    摘要： A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of male projections (8) are formed in one member (2) of the assembly with a plurality of corresponding female recesses (9) formed in the other member (4). The assembly is bonded by conventional techniques around the peripheral boundary (25) that surrounds the male and female portions (8,9). The assembly is then pressure consolidated at low temperature so that the projections (8), circumscribed by the bonded zone, are force fit into the female recesses (9).

    摘要翻译： 低温目标和背板接合工艺和由此制成的组件。 多个阳突起（8）形成在组件的一个构件（2）中，在另一个构件（4）中形成有多个相应的阴凹槽（9）。 组件通过围绕阳和阴部分（8,9）的外围边界（25）的常规技术结合。 然后将组件在低温下进行压力固化，使得由接合区限定的突起（8）被力配合到阴凹部（9）中。

    SPUTTERING TARGET WITH AN INSULATING RING AND A GAP BETWEEN THE RING AND THE TARGET
    9.
    发明申请
    SPUTTERING TARGET WITH AN INSULATING RING AND A GAP BETWEEN THE RING AND THE TARGET 审中-公开
    具有绝缘环的喷射目标和环与目标之间的差距

    公开(公告)号：US20110139614A1

    公开(公告)日：2011-06-16

    申请号：US13031459

    申请日：2011-02-21

    申请人： Eugene Y. Ivanov ,  Erich Theado ,  Harry W. Conard ,  John E. Poole

    发明人： Eugene Y. Ivanov ,  Erich Theado ,  Harry W. Conard ,  John E. Poole

    IPC分类号： C23C14/34

    CPC分类号： H01J37/34 ,  H01J37/3414

    摘要： A sputtering plasma reactors for plasma vapor deposition (PVD) having an improved interface between a PVD target, a ceramic ring and a PVD chamber wall. The reactor includes a PVD chamber wall and a PVD target, wherein the target in conjunction with the PVD chamber wall form a vacuum chamber and wherein at least the portion of the target facing the vacuum chamber is composed of material to be sputtered. The reactor also includes an insulating ceramic ring positioned between the target and the PVD chamber wall. A first O-ring is provided to establish a vacuum seal between the target and the insulating ring and a second O-ring is provided to establish a vacuum seal between the insulating ring and the PVD chamber wall. At least one spacer is positioned between the target and insulating ring to maintain a gap G between the insulating ring and the target. The spacer is made of a suitable low coefficient of friction material and inhibits black marking, scratching or the like that may otherwise occur along the interface between the ceramic ring and the target.

    摘要翻译： 用于等离子体气相沉积（PVD）的溅射等离子体反应器，其具有PVD靶，陶瓷环和PVD室壁之间改进的界面。 反应器包括PVD室壁和PVD靶，其中与PVD室壁结合的目标物形成真空室，并且其中至少面对真空室的靶的部分由待溅射的材料组成。 反应器还包括定位在靶和PVD室壁之间的绝缘陶瓷环。 设置第一O形环以在靶和绝缘环之间建立真空密封，并且提供第二O形环以在绝缘环和PVD室壁之间建立真空密封。 至少一个间隔件定位在目标和绝缘环之间以保持绝缘环和靶之间的间隙G. 间隔件由合适的低摩擦系数材料制成，并且可以抑制否则沿陶瓷环和靶之间的界面发生的黑色标记，划痕等。

    Method of manufacturing sputter targets with internal cooling channels
    10.
    发明授权
    Method of manufacturing sputter targets with internal cooling channels 有权
    使用内部冷却通道制造溅射靶的方法

    公开(公告)号：US06840427B2

    公开(公告)日：2005-01-11

    申请号：US10344782

    申请日：2001-09-11

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： B21K25/00 ,  B23K20/02 ,  C23C14/34 ,  H01J37/34 ,  B23K20/12 ,  B23K31/02

    CPC分类号： H01J37/3497 ,  B21K25/00 ,  B23K20/02 ,  B23K20/023 ,  C23C14/3407 ,  H01J37/3435 ,  Y10T428/24298 ,  Y10T428/24744 ,  Y10T428/24996 ,  Y10T428/249974 ,  Y10T428/249981

    摘要： The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter target assemblies (5) in accordance with the present invention are preferably comprised of target materials (10) and backing plate materials (15) having dissimilar thermal expansion coefficients and incorporate internal cooling channels (20). In the preferred embodiment, the resulting bond and the formation of the cooling channels (20) are cooperative.

    摘要翻译： 本发明涉及低温压力固结方法，其提供了能够承受高溅射速率施加的应力的目标材料（10）与背板材料（15）的结合。 根据本发明的溅射靶组件（5）优选地由具有不同热膨胀系数的目标材料（10）和背板材料（15）组成并且包括内部冷却通道（20）。 在优选实施例中，所得到的结合和冷却通道（20）的形成是协同的。