Methods of fabricating flash memory devices having self-aligned floating gate electrodes and related devices
    2.
    发明申请
    Methods of fabricating flash memory devices having self-aligned floating gate electrodes and related devices 审中-公开
    制造具有自对准浮栅的闪存器件和相关器件的方法

    公开(公告)号:US20060124988A1

    公开(公告)日:2006-06-15

    申请号:US11291142

    申请日:2005-11-30

    IPC分类号: H01L21/82 H01L21/8238

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A semiconductor memory device is fabricated by forming an active region protruding from a semiconductor substrate, forming an isolation layer on the substrate adjacent opposing sidewalls of the active region, and forming a floating gate electrode on a surface of the active region between the opposing sidewalls thereof. The floating gate electrode is formed to extend beyond edges of the surface of the active region onto the isolation layer. A surface of the floating gate electrode adjacent the active region defines a plane, and the isolation layer is confined between the plane and the substrate. A control gate electrode is formed on a surface of the floating gate electrode opposite the active region. The control gate electrode may be formed to extend along sidewalls of the floating gate electrode towards the substrate beyond the plane defined by the surface of the floating gate electrode adjacent the active region. Related devices are also discussed.

    摘要翻译: 半导体存储器件通过形成从半导体衬底突出的有源区域形成,在邻近有源区域的相对侧壁的衬底上形成隔离层,以及在其相对侧壁之间的有源区域的表面上形成浮栅电极 。 浮栅电极被形成为延伸超过有源区表面的边缘到隔离层上。 邻近有源区的浮栅电极的表面限定了一个平面,隔离层被限制在平面和衬底之间。 控制栅电极形成在浮动栅电极的与有源区相对的表面上。 控制栅电极可以被形成为沿着浮置栅电极的侧壁朝着衬底延伸超过由邻近有源区的浮栅的表面限定的平面。 还讨论了相关设备。

    Semiconductor memory devices having dummy active regions
    4.
    发明授权
    Semiconductor memory devices having dummy active regions 有权
    半导体存储器件具有虚拟有源区

    公开(公告)号:US06828637B2

    公开(公告)日:2004-12-07

    申请号:US10794533

    申请日:2004-03-05

    IPC分类号: H01L2976

    摘要: A semiconductor memory device having a dummy active region is provided, which includes a plurality of parallel main active regions and a dummy active region coupled to ends of the main active regions. The main preferably active regions are arranged in a main memory cell array region and extend to or through a dummy cell array region surrounding the main memory cell array region. Further, the dummy active region is perpendicular to the main active regions. A redundancy cell array region may intervene between the main memory cell array region and the dummy cell array region. In this case, the main active regions are extended to the dummy cell array region through the redundancy cell array region.

    摘要翻译: 提供了具有虚设有源区的半导体存储器件,其包括多个平行的主有效区和与主有效区的端部耦合的虚拟有源区。 主要优选的有源区域被布置在主存储单元阵列区域中并且延伸到或通过围绕主存储单元阵列区域的虚设单元阵列区域。 此外,虚拟有源区域垂直于主要有源区域。 冗余单元阵列区域可以介于主存储单元阵列区域和虚设单元阵列区域之间。 在这种情况下,主要有源区域通过冗余单元阵列区域扩展到虚拟单元阵列区域。

    Semiconductor memory devices having dummy active regions

    公开(公告)号:US06806518B2

    公开(公告)日:2004-10-19

    申请号:US10794508

    申请日:2004-03-05

    IPC分类号: H01L2710

    摘要: A semiconductor memory device having a dummy active region is provided, which includes a plurality of parallel main active regions and a dummy active region coupled to ends of the main active regions. The main preferably active regions are arranged in a main memory cell array region and extend to or through a dummy cell array region surrounding the main memory cell array region. Further, the dummy active region is perpendicular to the main active regions. A redundancy cell array region may intervene between the main memory cell array region and the dummy cell array region. In this case, the main active regions are extended to the dummy cell array region through the redundancy cell array region.

    Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby
    7.
    发明授权
    Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby 有权
    制造具有多栅极绝缘层的半导体器件和由此制造的半导体器件的方法

    公开(公告)号:US07508048B2

    公开(公告)日:2009-03-24

    申请号:US10758802

    申请日:2004-01-15

    IPC分类号: H01L29/00

    摘要: Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby are provided. The method includes forming a pad insulation layer and an initial high voltage gate insulation layer on a first region and a second region of a semiconductor substrate respectively. The initial high voltage gate insulation layer is formed to be thicker than the pad insulation layer. A first isolation layer that penetrates the pad insulation layer and is buried in the semiconductor substrate is formed to define a first active region in the first region, and a second isolation layer that penetrates the initial high voltage gate insulation layer and is buried in the semiconductor substrate is formed to define a second active region in the second region. The pad insulation layer is then removed to expose the first active region. A low voltage gate insulation layer is formed on the exposed first active region. Accordingly, it can minimize a depth of recessed regions (dent regions) to be formed at edge regions of the first isolation layer during removal of the pad insulation layer, and it can prevent dent regions from being formed at edge regions of the second isolation layer.

    摘要翻译: 提供了制造具有多栅极绝缘层的半导体器件和由此制造的半导体器件的方法。 该方法包括分别在半导体衬底的第一区域和第二区域上形成衬垫绝缘层和初始高电压栅极绝缘层。 初始高压栅绝缘层形成为比焊垫绝缘层厚。 形成穿过焊盘绝缘层并被埋在半导体衬底中的第一隔离层,以限定第一区域中的第一有源区和穿过初始高电压栅极绝缘层并被埋在半导体中的第二隔离层 形成衬底以限定第二区域中的第二有源区。 然后去除焊盘绝缘层以露出第一有源区。 在暴露的第一有源区上形成低压栅极绝缘层。 因此,能够最大限度地减少在去除焊盘绝缘层期间在第一隔离层的边缘区域形成的凹陷区域(凹陷区域)的深度,并且可以防止凹陷区域形成在第二隔离层的边缘区域 。

    Semiconductor memory devices having dummy active regions

    公开(公告)号:US06740940B2

    公开(公告)日:2004-05-25

    申请号:US10135947

    申请日:2002-04-29

    IPC分类号: H01L2976

    摘要: A semiconductor memory device having a dummy active region is provided, which includes a plurality of parallel main active regions and a dummy active region coupled to ends of the main active regions. The main preferably active regions are arranged in a main memory cell array region and extend to or through a dummy cell array region surrounding the main memory cell array region. Further, the dummy active region is perpendicular to the main active regions. A redundancy cell array region may intervene between the main memory cell array region and the dummy cell array region. In this case, the main active regions are extended to the dummy cell array region through the redundancy cell array region.

    VARIABLE RESISTANCE MEMORY DEVICES
    9.
    发明申请
    VARIABLE RESISTANCE MEMORY DEVICES 有权
    可变电阻存储器件

    公开(公告)号:US20150214478A1

    公开(公告)日:2015-07-30

    申请号:US14457439

    申请日:2014-08-12

    IPC分类号: H01L45/00 H01L27/24

    摘要: A variable resistance memory device includes a plurality of first conductive lines, a plurality of second conductive lines, a plurality of memory cells, a plurality of first air gaps and a plurality of second air gaps. The first conductive line extends in a first direction. The second conductive line is over the first conductive line and extends in a second direction crossing the first direction. The memory cell includes a variable resistance device. The memory cell is located at an intersection region of the first conductive line and the second conductive line. The first air gap extends in the first direction between the memory cells. The second air gap extends in the second direction between the memory cells.

    摘要翻译: 可变电阻存储器件包括多个第一导线,多个第二导线,多个存储单元,多个第一气隙和多个第二气隙。 第一导线沿第一方向延伸。 第二导线在第一导线上方并且沿与第一方向交叉的第二方向延伸。 存储单元包括可变电阻器件。 存储单元位于第一导线和第二导线的交叉区域。 第一气隙在存储单元之间沿第一方向延伸。 第二气隙沿第二方向在存储单元之间延伸。

    Nonvolatile memory devices
    10.
    发明授权
    Nonvolatile memory devices 有权
    非易失性存储器件

    公开(公告)号:US08629489B2

    公开(公告)日:2014-01-14

    申请号:US13357350

    申请日:2012-01-24

    IPC分类号: H01L29/76

    摘要: A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.

    摘要翻译: 非易失性存储器件包括串选择晶体管,多个存储单元晶体管和与串选择晶体管和多个存储单元晶体管串联电连接的接地选择晶体管。 在存储单元晶体管的沟道和源极/漏极区的边界处形成第一杂质层。 相对于存储单元晶体管的源/漏区,第一杂质层掺杂有相反导电类型的杂质。 第二杂质层形成在串选择晶体管的沟道和漏极区之间的边界处,并且在地选择晶体管的沟道和源极区之间形成。 第二杂质层掺杂有与第一杂质层相同的导电类型杂质,并且具有比第一杂质层更高的杂质浓度。