Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor
    1.
    发明授权
    Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor 有权
    薄膜晶体管包括选择性结晶的沟道层和制造薄膜晶体管的方法

    公开(公告)号:US08618543B2

    公开(公告)日:2013-12-31

    申请号:US11978581

    申请日:2007-10-30

    IPC分类号: H01L29/04

    摘要: Provided are a thin film transistor (TFT) including a selectively crystallized channel layer, and a method of manufacturing the TFT. The TFT includes a gate, the channel layer, a source, and a drain. The channel layer is formed of an oxide semiconductor, and at least a portion of the channel layer contacting the source and the drain is crystallized. In the method of manufacturing the TFT, the channel layer is formed of an oxide semiconductor, and a metal component is injected into the channel layer so as to crystallize at least a portion of the channel layer contacting the source and the drain. The metal component can be injected into the channel layer by depositing and heat-treating a metal layer or by ion-implantation.

    摘要翻译: 提供了包括选择性晶化的沟道层的薄膜晶体管(TFT)和制造TFT的方法。 TFT包括栅极,沟道层,源极和漏极。 沟道层由氧化物半导体形成,并且与源极和漏极接触的沟道层的至少一部分结晶。 在制造TFT的方法中,沟道层由氧化物半导体形成,并且将金属成分注入到沟道层中,以便使与沟道层和漏极接触的沟道层的至少一部分结晶。 可以通过沉积和热处理金属层或通过离子注入将金属成分注入到沟道层中。

    Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor
    2.
    发明申请
    Thin film transistor including selectively crystallized channel layer and method of manufacturing the thin film transistor 有权
    薄膜晶体管包括选择性结晶的沟道层和制造薄膜晶体管的方法

    公开(公告)号:US20080258140A1

    公开(公告)日:2008-10-23

    申请号:US11978581

    申请日:2007-10-30

    IPC分类号: H01L29/04 H01L21/34

    摘要: Provided are a thin film transistor (TFT) including a selectively crystallized channel layer, and a method of manufacturing the TFT. The TFT includes a gate, the channel layer, a source, and a drain. The channel layer is formed of an oxide semiconductor, and at least a portion of the channel layer contacting the source and the drain is crystallized. In the method of manufacturing the TFT, the channel layer is formed of an oxide semiconductor, and a metal component is injected into the channel layer so as to crystallize at least a portion of the channel layer contacting the source and the drain. The metal component can be injected into the channel layer by depositing and heat-treating a metal layer or by ion-implantation.

    摘要翻译: 提供了包括选择性晶化的沟道层的薄膜晶体管(TFT)和制造TFT的方法。 TFT包括栅极,沟道层,源极和漏极。 沟道层由氧化物半导体形成,并且与源极和漏极接触的沟道层的至少一部分结晶。 在制造TFT的方法中,沟道层由氧化物半导体形成,并且将金属成分注入到沟道层中,以便使与沟道层和漏极接触的沟道层的至少一部分结晶。 可以通过沉积和热处理金属层或通过离子注入将金属成分注入到沟道层中。

    ZnO based semiconductor devices and methods of manufacturing the same
    5.
    发明授权
    ZnO based semiconductor devices and methods of manufacturing the same 有权
    基于ZnO的半导体器件及其制造方法

    公开(公告)号:US07893431B2

    公开(公告)日:2011-02-22

    申请号:US11785269

    申请日:2007-04-17

    IPC分类号: H01L29/12

    CPC分类号: H01L29/7869

    摘要: A semiconductor device may include a composite represented by Formula 1 below as an active layer. x(Ga2O3)·y(In2O3)·z(ZnO)  Formula 1 wherein, about 0.75≦x/z≦ about 3.15, and about 0.55≦y/z≦ about 1.70. Switching characteristics of displays and driving characteristics of driving transistors may be improved by adjusting the amounts of a gallium (Ga) oxide and an indium (In) oxide mixed with a zinc (Zn) oxide and improving optical sensitivity.

    摘要翻译: 半导体器件可以包括由下面的式1表示的复合物作为有源层。 x(Ga 2 O 3)·y(In 2 O 3)·z(ZnO)式1其中约0.75< 1E; x / z& 约3.15,约0.55≦̸ y / z≦̸ 约1.70。 可以通过调节与锌(Zn)氧化物混合的镓(Ga)氧化物和铟(In))的量来提高驱动晶体管的开关特性并提高光学灵敏度。

    Thin film transistor and method of manufacturing the same
    7.
    发明申请
    Thin film transistor and method of manufacturing the same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20080203387A1

    公开(公告)日:2008-08-28

    申请号:US12007038

    申请日:2008-01-04

    IPC分类号: H01L29/221 H01L21/441

    CPC分类号: H01L29/7869

    摘要: Provided are a thin film transistor and a method of manufacturing the same. The thin film transistor may include a gate; a channel layer; a source and a drain, the source and the drain being formed of metal; and a metal oxide layer, the metal oxide layer being formed between the channel layer and the source and the drain. The metal oxide layer may have a gradually changing metal content between the channel layer and the source and the drain.

    摘要翻译: 提供一种薄膜晶体管及其制造方法。 薄膜晶体管可以包括栅极; 一个通道层; 源极和漏极,源极和漏极由金属形成; 和金属氧化物层,金属氧化物层形成在沟道层与源极和漏极之间。 金属氧化物层可以在沟道层和源极和漏极之间具有逐渐变化的金属含量。

    ZnO thin film transistor and method of forming the same
    8.
    发明申请
    ZnO thin film transistor and method of forming the same 审中-公开
    ZnO薄膜晶体管及其形成方法

    公开(公告)号:US20070272922A1

    公开(公告)日:2007-11-29

    申请号:US11702222

    申请日:2007-02-05

    IPC分类号: H01L29/12 H01L21/00

    摘要: A zinc oxide (ZnO) thin film transistor (TFT) and method of forming the same are provided. The ZnO may include a ZnO semiconductor channel, a conductive ZnO gate forming an electric field around the ZnO semiconductor channel, an ZnO gate insulator interposed between the conductive ZnO gate and the ZnO semiconductor channel and an insulating ZnO passivation layer on the ZnO semiconductor channel, the conductive ZnO gate and the ZnO gate insulator to protect the ZnO semiconductor channel, the conductive ZnO gate, and the ZnO gate insulator. A thin film transistor (TFT) may be formed by forming a semiconductor channel, forming a conductive gate having an electric field around the semiconductor channel, forming a gate insulator between the conductive gate and the semiconductor channel, and forming an insulating passivation layer on the semiconductor channel, the conductive gate and the gate insulator.

    摘要翻译: 提供了一种氧化锌(ZnO)薄膜晶体管(TFT)及其形成方法。 ZnO可以包括ZnO半导体沟道,在ZnO半导体沟道周围形成电场的导电ZnO栅极,介于导电ZnO栅极和ZnO半导体沟道之间的ZnO栅极绝缘体和ZnO半导体沟道上的绝缘ZnO钝化层, 导电ZnO栅极和ZnO栅极绝缘体,以保护ZnO半导体通道,导电ZnO栅极和ZnO栅极绝缘体。 可以通过形成半导体沟道来形成薄膜晶体管(TFT),在半导体沟道周围形成具有电场的导电栅极,在导电栅极和半导体沟道之间形成栅极绝缘体,并在其上形成绝缘钝化层 半导体通道,导电栅极和栅极绝缘体。

    ZnO based semiconductor devices and methods of manufacturing the same
    9.
    发明授权
    ZnO based semiconductor devices and methods of manufacturing the same 有权
    基于ZnO的半导体器件及其制造方法

    公开(公告)号:US08735882B2

    公开(公告)日:2014-05-27

    申请号:US12929323

    申请日:2011-01-14

    IPC分类号: H01L29/12

    CPC分类号: H01L29/7869

    摘要: A semiconductor device may include a composite represented by Formula 1 below as an active layer. x(Ga2O3).y(In2O3).z(ZnO)  Formula 1 wherein, about 0.75≦x/z≦about 3.15, and about 0.55≦y/z≦ about 1.70. Switching characteristics of displays and driving characteristics of driving transistors may be improved by adjusting the amounts of a gallium (Ga) oxide and an indium (In) oxide mixed with a zinc (Zn) oxide and improving optical sensitivity.

    摘要翻译: 半导体器件可以包括由下面的式1表示的复合物作为有源层。 x(Ga 2 O 3)y(In 2 O 3)z(ZnO)式1其中约0.75< lE; x / z和nlE;约3.15和约0.55≤n1E; y / z& 约1.70。 可以通过调节与锌(Zn)氧化物混合的镓(Ga)氧化物和铟(In))的量来提高驱动晶体管的开关特性并提高光学灵敏度。