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    Two-stage adiabatically coupled photonic systems
    1.
    发明授权
    Two-stage adiabatically coupled photonic systems 有权

    公开(公告)号：US10656333B2

    公开(公告)日：2020-05-19

    申请号：US16386171

    申请日：2019-04-16

    申请人： FINISAR CORPORATION

    发明人： Daniel Mahgerefteh ,  Bryan Park ,  Jianxiao Chen ,  Xiaojie Xu ,  Gilles P. Denoyer ,  Bernd Huebner

    IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  G02B6/124 ,  G02B6/126 ,  G02B6/27 ,  G02B6/125 ,  G02B6/30 ,  G02B6/42

    摘要： In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

    Lens-less laser micro-package assembly
    4.
    发明授权
    Lens-less laser micro-package assembly 有权

    公开(公告)号：US11086088B2

    公开(公告)日：2021-08-10

    申请号：US16555701

    申请日：2019-08-29

    申请人： Finisar Corporation

    发明人： Bernd Huebner ,  Tsurugi Sudo ,  Shiyun Lin

    IPC分类号： G02B6/42 ,  G02B6/26

    摘要： An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

    DELAY LINE INTERFEROMETER MULTIPLEXER
    6.
    发明申请
    DELAY LINE INTERFEROMETER MULTIPLEXER 有权
    延迟线干涉仪多路复用器

    公开(公告)号：US20160018600A1

    公开(公告)日：2016-01-21

    申请号：US14709050

    申请日：2015-05-11

    申请人： FINISAR CORPORATION

    发明人： Yasuhiro Matsui ,  Bernd Huebner ,  Charles B. Roxlo

    IPC分类号： G02B6/293

    CPC分类号： G02B6/29355 ,  G02B6/2938 ,  H04J14/02

    摘要： In an embodiment, a delay line interferometer (DLI) multiplexer (MUX) includes a first stage and a second stage. The first stage includes a first DLI and a second DLI. The first DLI includes a first left input, a first right input, and a first output and has a free spectral range (FSR) that is about four times a nominal channel spacing. The second DLI includes a second left input, a second right input, and a second output and has an FSR that is about four times the nominal channel spacing. The second stage is coupled to the first stage and includes a third DLI. The third DLI includes a third left input optically coupled to the first output, a third right input optically coupled to the second output, and a third output. An FSR of the third DLI is about two times the nominal channel spacing.

    摘要翻译： 在一个实施例中，延迟线干涉仪（DLI）多路复用器（MUX）包括第一级和第二级。 第一阶段包括第一DLI和第二DLI。 第一DLI包括第一左输入，第一右输入和第一输出，并且具有约为标称通道间隔的四倍的自由光谱范围（FSR）。 第二DLI包括第二左输入，第二右输入和第二输出，并具有约为标称通道间隔的四倍的FSR。 第二阶段耦合到第一阶段并且包括第三DLI。 第三DLI包括光耦合到第一输出的第三左输入，光耦合到第二输出的第三右输入和第三输出。 第三个DLI的FSR约为标称信道间隔的两倍。

    Adiabatically coupled photonic systems with vertically tapered waveguides
    7.
    发明授权
    Adiabatically coupled photonic systems with vertically tapered waveguides 有权

    公开(公告)号：US10802214B2

    公开(公告)日：2020-10-13

    申请号：US16212355

    申请日：2018-12-06

    申请人： Finisar Corporation

    发明人： Daniel Mahgerefteh ,  Jin-Hyoung Lee ,  Bernd Huebner

    IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/30

    摘要： In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.

    LENS-LESS LASER MICRO-PACKAGE ASSEMBLY
    8.
    发明申请
    LENS-LESS LASER MICRO-PACKAGE ASSEMBLY 审中-公开

    公开(公告)号：US20200073065A1

    公开(公告)日：2020-03-05

    申请号：US16555701

    申请日：2019-08-29

    申请人： Finisar Corporation

    发明人： Bernd Huebner ,  Tsurugi Sudo ,  Shiyun Lin

    IPC分类号： G02B6/42

    摘要： An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

    Two-stage adiabatically coupled photonic systems
    10.
    发明授权
    Two-stage adiabatically coupled photonic systems 有权

    公开(公告)号：US10261251B2

    公开(公告)日：2019-04-16

    申请号：US15692793

    申请日：2017-08-31

    申请人： FINISAR CORPORATION

    发明人： Daniel Mahgerefteh ,  Bryan Park ,  Jianxiao Chen ,  Xiaojie Xu ,  Gilles P. Denoyer ,  Bernd Huebner

    IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  G02B6/124 ,  G02B6/126 ,  G02B6/27 ,  G02B6/125 ,  G02B6/30 ,  G02B6/42

    摘要： In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.