公开(公告)号：US10656333B2

公开(公告)日：2020-05-19

申请号：US16386171

申请日：2019-04-16

Applicant: FINISAR CORPORATION

Inventor： Daniel Mahgerefteh ,  Bryan Park ,  Jianxiao Chen ,  Xiaojie Xu ,  Gilles P. Denoyer ,  Bernd Huebner

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  G02B6/124 ,  G02B6/126 ,  G02B6/27 ,  G02B6/125 ,  G02B6/30 ,  G02B6/42

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

公开(公告)号：US20170176700A1

公开(公告)日：2017-06-22

申请号：US15394642

申请日：2016-12-29

Applicant: FINISAR CORPORATION

Inventor： Yan yang Zhao ,  Bernd Huebner ,  Tengda Du ,  Yuheng Lee

IPC: G02B6/42 ,  H05K1/02 ,  G01J1/04 ,  H05K1/11

CPC classification number: G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

公开(公告)号：US20160131837A1

公开(公告)日：2016-05-12

申请号：US14938815

申请日：2015-11-11

Applicant: FINISAR CORPORATION

Inventor： Daniel Mahgerefteh ,  Bryan Park ,  Jianxiao Chen ,  Xiaojie Xu ,  Gilles P. Denoyer ,  Bernd Huebner

IPC: G02B6/122 ,  G02B6/32 ,  G02B6/42 ,  G02B6/12 ,  G02B6/136 ,  G02B6/30 ,  G02B6/14 ,  G02B6/293

CPC classification number: G02B6/1228 ,  G02B6/1221 ,  G02B6/1223 ,  G02B6/124 ,  G02B6/125 ,  G02B6/126 ,  G02B6/136 ,  G02B6/2726 ,  G02B6/2773 ,  G02B6/305 ,  G02B6/4208 ,  G02B6/4215 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12069 ,  G02B2006/12097 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/12147 ,  G02B2006/12157 ,  G02B2006/12164

Abstract: In an example, a coupled system includes a first waveguide, at least one second waveguide, and an interposer. The first waveguide has a first refractive index n1 and a tapered end. The at least one second waveguide each has a second refractive index n2. The interposer includes a third waveguide having a third refractive index n3 and a coupler portion, where n1>n2>n3. The tapered end of the first waveguide is adiabatically coupled to a coupler portion of one of the at least one second waveguide. A tapered end of one of the at least one second waveguide is adiabatically coupled to the coupler portion of the third waveguide of the interposer. The coupled system is configured to adiabatically couple light between the first waveguide and the at least one second waveguide and between the at least one second waveguide and the third waveguide.

Abstract translation: 在一个示例中，耦合系统包括第一波导，至少一个第二波导和插入器。 第一波导具有第一折射率n1和锥形端。 所述至少一个第二波导各自具有第二折射率n2。 插入器包括具有第三折射率n3和耦合器部分的第三波导，其中n1> n2> n3。 第一波导的锥形端绝热地耦合到至少一个第二波导中的一个的耦合器部分。 所述至少一个第二波导中的一个的锥形端绝热地耦合到所述插入器的所述第三波导的耦合器部分。 耦合系统被配置为在第一波导和至少一个第二波导之间以及在至少一个第二波导和第三波导之间绝热耦合光。

公开(公告)号：US11086088B2

公开(公告)日：2021-08-10

申请号：US16555701

申请日：2019-08-29

Applicant: Finisar Corporation

Inventor： Bernd Huebner ,  Tsurugi Sudo ,  Shiyun Lin

IPC: G02B6/42 ,  G02B6/26

Abstract: An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

公开(公告)号：US10826267B2

公开(公告)日：2020-11-03

申请号：US16365624

申请日：2019-03-26

Applicant: FINISAR CORPORATION

Inventor： Daniel Mahgerefteh ,  Jianxiao Chen ,  Bernd Huebner ,  Xiaojie Xu ,  Yasuhiro Matsui ,  David Adams ,  The′ Linh Nguyen

IPC: G02B6/12 ,  H01S5/10 ,  H01S5/026 ,  H01S5/187 ,  G02B6/124 ,  H01S5/00 ,  H01S5/22 ,  H01S5/30 ,  G02B6/122 ,  G02B6/30 ,  G02B6/27 ,  H01S5/022 ,  H01S5/12 ,  H01S5/125 ,  H01S5/20

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

公开(公告)号：US20160018600A1

公开(公告)日：2016-01-21

申请号：US14709050

申请日：2015-05-11

Applicant: FINISAR CORPORATION

Inventor： Yasuhiro Matsui ,  Bernd Huebner ,  Charles B. Roxlo

IPC: G02B6/293

CPC classification number: G02B6/29355 ,  G02B6/2938 ,  H04J14/02

Abstract: In an embodiment, a delay line interferometer (DLI) multiplexer (MUX) includes a first stage and a second stage. The first stage includes a first DLI and a second DLI. The first DLI includes a first left input, a first right input, and a first output and has a free spectral range (FSR) that is about four times a nominal channel spacing. The second DLI includes a second left input, a second right input, and a second output and has an FSR that is about four times the nominal channel spacing. The second stage is coupled to the first stage and includes a third DLI. The third DLI includes a third left input optically coupled to the first output, a third right input optically coupled to the second output, and a third output. An FSR of the third DLI is about two times the nominal channel spacing.

Abstract translation: 在一个实施例中，延迟线干涉仪（DLI）多路复用器（MUX）包括第一级和第二级。 第一阶段包括第一DLI和第二DLI。 第一DLI包括第一左输入，第一右输入和第一输出，并且具有约为标称通道间隔的四倍的自由光谱范围（FSR）。 第二DLI包括第二左输入，第二右输入和第二输出，并具有约为标称通道间隔的四倍的FSR。 第二阶段耦合到第一阶段并且包括第三DLI。 第三DLI包括光耦合到第一输出的第三左输入，光耦合到第二输出的第三右输入和第三输出。 第三个DLI的FSR约为标称信道间隔的两倍。

公开(公告)号：US10802214B2

公开(公告)日：2020-10-13

申请号：US16212355

申请日：2018-12-06

Applicant: Finisar Corporation

Inventor： Daniel Mahgerefteh ,  Jin-Hyoung Lee ,  Bernd Huebner

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/30

Abstract: In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.

公开(公告)号：US20200073065A1

公开(公告)日：2020-03-05

申请号：US16555701

申请日：2019-08-29

Applicant: Finisar Corporation

Inventor： Bernd Huebner ,  Tsurugi Sudo ,  Shiyun Lin

IPC: G02B6/42

Abstract: An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

公开(公告)号：US20190170941A1

公开(公告)日：2019-06-06

申请号：US16212355

申请日：2018-12-06

Applicant: Finisar Corporation

Inventor： Daniel Mahgerefteh ,  Jin-Hyoung Lee ,  Bernd Huebner

IPC: G02B6/122 ,  G02B6/30 ,  G02B6/12

CPC classification number: G02B6/1228 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1223 ,  G02B6/305 ,  G02B2006/12061 ,  G02B2006/12147

Abstract: In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.

公开(公告)号：US10261251B2

公开(公告)日：2019-04-16

申请号：US15692793

申请日：2017-08-31

Applicant: FINISAR CORPORATION

Inventor： Daniel Mahgerefteh ,  Bryan Park ,  Jianxiao Chen ,  Xiaojie Xu ,  Gilles P. Denoyer ,  Bernd Huebner

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  G02B6/124 ,  G02B6/126 ,  G02B6/27 ,  G02B6/125 ,  G02B6/30 ,  G02B6/42

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.