公开(公告)号：US09900974B2

公开(公告)日：2018-02-20

申请号：US15171704

申请日：2016-06-02

申请人： FINISAR CORPORATION

发明人： Wenhua Ling ,  Yan Yang Zhao ,  Yongsheng Liu ,  Yuheng Lee

IPC分类号： G02B6/42 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18

CPC分类号： H05K1/021 ,  G02B6/00 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/428 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09509 ,  H05K2201/10121

摘要： In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.

公开(公告)号：US20170354026A1

公开(公告)日：2017-12-07

申请号：US15171704

申请日：2016-06-02

申请人： FINISAR CORPORATION

发明人： Wenhua Ling ,  Yan Yang Zhao ,  Yongsheng Liu ,  Yuheng Lee

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K1/03 ,  G02B6/42

CPC分类号： H05K1/021 ,  G02B6/00 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/428 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09509 ,  H05K2201/10121

摘要： In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.