公开(公告)号：US20170354026A1

公开(公告)日：2017-12-07

申请号：US15171704

申请日：2016-06-02

申请人： FINISAR CORPORATION

发明人： Wenhua Ling ,  Yan Yang Zhao ,  Yongsheng Liu ,  Yuheng Lee

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K1/03 ,  G02B6/42

CPC分类号： H05K1/021 ,  G02B6/00 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/428 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09509 ,  H05K2201/10121

摘要： In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.

公开(公告)号：US10996409B2

公开(公告)日：2021-05-04

申请号：US16660692

申请日：2019-10-22

申请人： Finisar Corporation

发明人： Wenhua Ling ,  Yuheng Lee

IPC分类号： G02B6/42

摘要： An optoelectronic assembly may include a PCB and an optical lens. The PCB includes a top surface where at least a portion of the top surface includes a first material with a first thermal property. The optical lens includes a lens frame and an optical portion positioned within the lens frame. The lens frame is coupled to the top surface of the PCB. The lens frame includes a second material with a second thermal property, the second material being different from the first material. The optical portion positioned includes a third material with a third thermal property, the third material being different from the first material and the second material. The third material is optically transparent.

公开(公告)号：US20170176700A1

公开(公告)日：2017-06-22

申请号：US15394642

申请日：2016-12-29

申请人： FINISAR CORPORATION

发明人： Yan yang Zhao ,  Bernd Huebner ,  Tengda Du ,  Yuheng Lee

IPC分类号： G02B6/42 ,  H05K1/02 ,  G01J1/04 ,  H05K1/11

CPC分类号： G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

摘要： Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

公开(公告)号：US09900974B2

公开(公告)日：2018-02-20

申请号：US15171704

申请日：2016-06-02

申请人： FINISAR CORPORATION

发明人： Wenhua Ling ,  Yan Yang Zhao ,  Yongsheng Liu ,  Yuheng Lee

IPC分类号： G02B6/42 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18

CPC分类号： H05K1/021 ,  G02B6/00 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/428 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09509 ,  H05K2201/10121

摘要： In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.