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1.发明授权Carbon nanotube contact structures for use with semiconductor dies and other electronic devices 有权用于半导体管芯和其他电子器件的碳纳米管接触结构公开(公告)号：US08756802B2
公开(公告)日：2014-06-24
申请号：US13731259
申请日：2012-12-31
Applicant: FormFactor, Inc.
Inventor： John K. Gritters , Rodney I. Martens , Onnik Yaglioglu
CPC classification number: H01L24/80 , B82Y10/00 , B82Y30/00 , H01B1/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L25/0657 , H01L51/0048 , H01L2224/0401 , H01L2224/0557 , H01L2224/11003 , H01L2224/11334 , H01L2224/13021 , H01L2224/13025 , H01L2224/13082 , H01L2224/1329 , H01L2224/133 , H01L2224/13582 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H05K3/4007 , H05K2201/026 , H05K2201/0323 , H05K2201/0367 , H05K2203/0338 , Y10T29/49147 , Y10T29/49206 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
Abstract: A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
Abstract translation: 在电子设备上制造碳纳米管接触结构的方法包括在心轴上生长多个碳纳米管柱。 将导电粘合剂施加到远离心轴的柱的端部，并且柱被转移到电子装置。 导电材料沉积在一些或所有的柱上。 心轴可以重新用于生长第二多个碳纳米管柱。
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2.发明申请Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices 有权碳纳米管接触结构用于半导体模具和其他电子设备公开(公告)号：US20130140057A1
公开(公告)日：2013-06-06
申请号：US13731259
申请日：2012-12-31
Applicant: FormFactor, Inc.
Inventor： John K. Gritters , Rodney I. Martens , Onnik Yaglioglu
CPC classification number: H01L24/80 , B82Y10/00 , B82Y30/00 , H01B1/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L25/0657 , H01L51/0048 , H01L2224/0401 , H01L2224/0557 , H01L2224/11003 , H01L2224/11334 , H01L2224/13021 , H01L2224/13025 , H01L2224/13082 , H01L2224/1329 , H01L2224/133 , H01L2224/13582 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H05K3/4007 , H05K2201/026 , H05K2201/0323 , H05K2201/0367 , H05K2203/0338 , Y10T29/49147 , Y10T29/49206 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
Abstract: A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
Abstract translation: 在电子设备上制造碳纳米管接触结构的方法包括在心轴上生长多个碳纳米管柱。 将导电粘合剂施加到远离心轴的柱的端部，并且柱被转移到电子装置。 导电材料沉积在一些或所有的柱上。 心轴可以重新用于生长第二多个碳纳米管柱。
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公开(公告)号：US10266402B2
公开(公告)日：2019-04-23
申请号：US13681967
申请日：2012-11-20
Applicant: FormFactor, Inc.
Inventor： Onnik Yaglioglu , Benjamin N. Eldridge , Alexander Slocum
Abstract: Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion.
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4.发明申请Contactor Devices With Carbon Nanotube Probes Embedded In A Flexible Film And Processes Of Making Such 审中-公开具有嵌入在柔性膜中的碳纳米管探针的接触器器件及其制造方法公开(公告)号：US20140139250A1
公开(公告)日：2014-05-22
申请号：US13681967
申请日：2012-11-20
Applicant: FORMFACTOR, INC.
Inventor： Onnik Yaglioglu , Benjamin N. Eldridge , Alexander Slocum
IPC: G01R1/073
CPC classification number: B82Y30/00 , G01R1/06744 , G01R1/07314
Abstract: Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion.
Abstract translation: 嵌入质量柔软，有弹性的电绝缘材料的缠绕在一起的碳纳米管的导电柱可用作导电接触探针。 柱可以在材料块的相对侧之间延伸。 布线基板的端子可以延伸到列中并且电连接到电连接到测试器的电接口，该测试器控制被测器件的测试。 一对物理互锁的结构可以将材料质量耦合到布线基板。 该对可以包括容器和突起。
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