公开(公告)号：US20160161355A1

公开(公告)日：2016-06-09

申请号：US14562154

申请日：2014-12-05

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON ,  MIGUEL A. SALHUANA ,  JOHN B. YOUNG

IPC分类号： G01L27/00

CPC分类号： G01L27/005 ,  G01C25/005 ,  G01L27/002 ,  G01P21/00

摘要： A mechanism is provided to field adjust offset values for packaged sensors incorporated in devices. Embodiments provide for a processor in the sensor package to measure current environmental conditions and set a zero offset for the sensors in the package in light of those current environmental conditions. In this manner, any changes in the sensor over the sensor's lifetime and current environmental conditions that can affect functioning of the sensor can be accounted for in operational measurements taken by the device.

摘要翻译： 提供了一种机制来现场调整装在装置中的封装传感器的偏移值。 实施例提供了传感器封装中的处理器来测量当前环境条件，并根据当前的环境条件为封装中的传感器设置零偏移。 以这种方式，传感器在传感器的寿命和当前环境条件下的变化可能会影响传感器的功能，这在设备的运行测量中可以考虑。

公开(公告)号：US20150298964A1

公开(公告)日：2015-10-22

申请号：US14755595

申请日：2015-06-30

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON

IPC分类号： B81B7/00

CPC分类号： B81B7/0016 ,  B81B3/0078 ,  B81C2201/017

摘要： A microelectromechanical systems (MEMS) device includes a structural layer having a top surface. The top surface includes surface regions that are generally parallel to one another but are offset relative to one another such that a stress concentration location is formed between them. Laterally propagating shallow surface cracks have a tendency to form in the structural layer, especially near the joints between the surface regions. A method entails fabricating the MEMS device and forming trenchesin the top surface of the structural layer of the MEMS device. The trenches act as a crack inhibition feature to largely prevent the formation of deep cracks in structural layer which might otherwise result in MEMS device failure.

摘要翻译： 微机电系统（MEMS）装置包括具有顶表面的结构层。 顶表面包括通常彼此平行但相对于彼此偏移的表面区域，使得在它们之间形成应力集中位置。 横向传播的浅表面裂纹在结构层中形成倾向，特别是在表面区域之间的接头附近。 一种方法需要制造MEMS器件并在MEMS器件的结构层的顶表面上形成沟槽。 沟槽充当裂纹抑制特征，以大大防止在结构层中形成深裂纹，否则可能导致MEMS器件失效。

公开(公告)号：US20160169758A1

公开(公告)日：2016-06-16

申请号：US14569068

申请日：2014-12-12

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： STEPHEN R. HOOPER ,  CHAD S. DAWSON

IPC分类号： G01L9/00 ,  B81C1/00 ,  B81B7/00

CPC分类号： B81B7/0061 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  G01L9/0073 ,  G01L13/025 ,  G01L15/00 ,  H01L2224/48137

摘要： A package includes a MEMS die and a cap element coupled to and stacked with the MEMS die. The MEMS die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure. A first pressure sensor is vented to a first external environment via a first vent extending through the bottom of the MEMS die and is adapted to detect a first pressure of the first external environment. The MEMS die can be coupled to a lead frame having an opening that is aligned with the first vent. A second sensor is vented to a second external environment via a second vent extending through the cap element and is adapted to detect a second pressure of the second external environment. A difference between the first and second pressures is the differential pressure.

摘要翻译： 封装包括MEMS管芯和耦合到MEMS管芯并与其堆叠的帽元件。 MEMS管芯包括至少两个物理隔离的压力传感器，每个压力传感器位于其单独的悬臂平台结构上。 第一压力传感器经由延伸穿过MEMS管芯的底部的第一通气孔排放到第一外部环境，并适于检测第一外部环境的第一压力。 MEMS管芯可以连接到具有与第一通气口对准的开口的引线框架。 第二传感器经由延伸穿过盖元件的第二通风孔排放到第二外部环境，并适于检测第二外部环境的第二压力。 第一和第二压力之间的差值是差压。

公开(公告)号：US20160159642A1

公开(公告)日：2016-06-09

申请号：US14564340

申请日：2014-12-09

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： STEPHEN R. HOOPER ,  CHAD S. DAWSON

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0061 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A package includes a MEMS die and an integrated circuit (IC) die coupled to and stacked with the MEMS die. The MEMS die includes a substrate having a recess formed therein. A cantilevered platform structure of the MEMS die has a platform and an arm suspended over the recess, where the arm is fixed to the substrate. A MEMS device resides on the platform. The IC die is coupled to the MEMS die to serve as a protective cap for MEMS device. The MEMS die may be a pressure sensor die, and the MEMS device residing on the platform may be a sensor diaphragm. Thus, the IC die can include access vents extending through it for passage of a fluid from an external environment so that the sensor diaphragm can detect the pressure of the fluid.

摘要翻译： 封装包括MEMS管芯和耦合到MEMS管芯并与其堆叠的集成电路（IC）管芯。 MEMS管芯包括其中形成有凹部的基板。 MEMS模具的悬臂平台结构具有悬挂在凹部上的平台和臂，其中臂固定到基板。 MEMS设备驻留在平台上。 IC芯片耦合到MEMS管芯以用作MEMS器件的保护盖。 MEMS管芯可以是压力传感器管芯，并且驻留在平台上的MEMS器件可以是传感器隔膜。 因此，IC芯片可以包括延伸穿过它的通路，用于使流体从外部环境通过，使得传感器隔膜可以检测流体的压力。

公开(公告)号：US20170081179A1

公开(公告)日：2017-03-23

申请号：US14861550

申请日：2015-09-22

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON ,  STEPHEN R. HOOPER ,  FENGYUAN LI ,  ARVIND S. SALIAN

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

摘要： A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.

公开(公告)号：US20150346046A1

公开(公告)日：2015-12-03

申请号：US14823851

申请日：2015-08-11

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON ,  Peter T. Jones

IPC分类号： G01L25/00 ,  G01L1/14 ,  G01L1/04

CPC分类号： G01L25/00 ,  G01L1/04 ,  G01L1/142 ,  G01L1/148 ,  G01L9/0073 ,  G01L27/002

摘要： A pressure sensor (20) includes a test cell (32) and sense cell (34). The sense cell (34) includes an electrode (42) formed on a substrate (30) and a sense diaphragm (68) spaced apart from the electrode (42) to produce a sense cavity (64). The test cell (32) includes an electrode (40) formed on the substrate (30) and a test diaphragm (70) spaced apart from the electrode (40) to produce a test cavity (66). Both of the cells (32, 34) are sensitive to pressure (36). However, a critical dimension (76) of the sense diaphragm (68) is less than a critical dimension (80) of the test diaphragm (70) so that the test cell (32) has greater sensitivity (142) to pressure (36) than the sense cell (34). Parameters (100) measured at the test cell (32) are utilized to estimate a sensitivity (138) of the sense cell (34).

摘要翻译： 压力传感器（20）包括测试单元（32）和感测单元（34）。 感测单元（34）包括形成在基板（30）上的电极（42）和与电极（42）间隔开的感测隔膜（68）以产生感测腔（64）。 测试电池（32）包括形成在基板（30）上的电极（40）和与电极（40）间隔开的测试膜（70），以产生测试腔（66）。 两个电池（32,34）对压力敏感（36）。 然而，感测隔膜（68）的临界尺寸（76）小于测试隔膜（70）的临界尺寸（80），使得测试电池（32）具有较高的灵敏度（142）至压力（36） 比感测单元（34）。 在测试单元（32）处测量的参数（100）用于估计感测单元（34）的灵敏度（138）。

公开(公告)号：US20160272482A1

公开(公告)日：2016-09-22

申请号：US14658598

申请日：2015-03-16

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON ,  FENGYUAN LI ,  RUBEN B. MONTEZ ,  COLIN B. STEVENS

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B7/0048

摘要： A microelectromechanical systems (MEMS) die includes a substrate having a first substrate layer, a second substrate layer, and an insulator layer interposed between the first and second substrate layers. A structure is formed in the first substrate layer and includes a platform upon which a MEMS device resides. Fabrication methodology entails forming the MEMS device on a front side of the first substrate layer of the substrate, forming openings extending through the second substrate layer from a back side of the second substrate layer to the insulator layer, and forming a trench in the first substrate layer extending from the front side to the insulator layer. The trench is laterally offset from the openings. The trench surrounds the MEMS device to produce the structure in the first substrate layer on which the MEMS device resides. The insulator layer is removed underlying the structure to suspend the structure.

摘要翻译： 微机电系统（MEMS）管芯包括具有第一衬底层，第二衬底层和介于第一和第二衬底层之间的绝缘体层的衬底。 在第一衬底层中形成结构，并且包括MEMS器件所在的平台。 制造方法需要在衬底的第一衬底层的前侧上形成MEMS器件，从第二衬底层的背面到绝缘体层形成从第二衬底层延伸的开口，以及在第一衬底中形成沟槽 层从前侧延伸到绝缘体层。 沟槽从开口侧向偏移。 沟槽围绕MEMS器件以在MEMS器件所在的第一衬底层中产生结构。 在结构下方移除绝缘体层以悬挂结构。

公开(公告)号：US20160216290A1

公开(公告)日：2016-07-28

申请号：US14603016

申请日：2015-01-22

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： JUN TANG ,  CHAD S. DAWSON ,  ANDREW C. MCNEIL

IPC分类号： G01P15/125 ,  B81C1/00 ,  B81B3/00

CPC分类号： G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81C1/00849 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0831 ,  G01P2015/0871

摘要： A MEMS device comprises a substrate, a proof mass spaced apart from a surface of the substrate, and an over-travel stop structure. The over-travel stop structure includes a lateral stop structure and a cap coupled to the lateral stop structure. The MEMS device is fabricated to include relatively small gap sections and relatively large gap regions separating the lateral stop structure from the proof mass. The larger gap regions are covered by the cap and the smaller gap sections are exposed from the gap. During fabrication, removal of particles from the smaller gap sections is facilitated by their exposure from the cap and removal of particles from the larger gap regions underlying the cap is facilitated by their larger size. The lateral stop structure may be cross-shaped to limit deflection of the proof mass along two in-plane axes. The cap limits deflection of the proof mass along an out-of-plane axis.

摘要翻译： MEMS器件包括衬底，与衬底的表面间隔开的校准质量块和超行程停止结构。 超行程停止结构包括侧向停止结构和联接到侧向停止结构的帽。 MEMS器件被制造成包括相对小的间隙部分和将横向止动结构与检验质量块分开的相对较大的间隙区域。 较大的间隙区域被盖覆盖，较小的间隙部分从间隙露出。 在制造过程中，从较小间隙部分去除颗粒通过它们从盖子的暴露而促进，并且通过其较大的尺寸来促进从帽下方较大的间隙区域去除颗粒。 横向止挡结构可以是十字形的，以限制证明块沿着两个面内轴线的偏转。 盖帽限制了检验质量沿着平面外轴线的偏转。

公开(公告)号：US20160096724A1

公开(公告)日：2016-04-07

申请号：US14506037

申请日：2014-10-03

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： CHAD S. DAWSON ,  STEPHEN R. HOOPER

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81B7/007 ,  B81B2203/0118 ,  B81C1/00301 ,  B81C1/00325

摘要： A microelectromechanical systems (MEMS) die includes a substrate having a recess formed therein and a cantilevered platform structure. The cantilevered platform structure has a platform and an arm extending from the platform, wherein the platform and arm are suspended over the recess. The arm is fixed to the substrate and is a sole attachment point of the platform to the substrate. A MEMS device resides on the platform. Fabrication methodology entails forming the recess in the substrate, with the recess extending inwardly from a surface of the substrate, and attaching a structural layer over the recess and over the surface of the substrate. The MEMS device is formed on the structural layer and the structural layer is removed around a perimeter of the platform and the arm to form the cantilevered platform structure.

摘要翻译： 微机电系统（MEMS）模具包括其中形成有凹部的基板和悬臂平台结构。 悬臂式平台结构具有从平台延伸的平台和臂，其中平台和臂悬挂在凹部上。 臂固定到基底上，并且是平台与基底的唯一附着点。 MEMS设备驻留在平台上。 制造方法需要在衬底中形成凹部，其中凹部从衬底的表面向内延伸，并且将结构层附着在凹部上并在衬底的表面上方。 MEMS器件形成在结构层上，并且围绕平台和臂的周边移除结构层以形成悬臂平台结构。