摘要:
An integrated circuit (IC) having a heat-generating element, such as a power MOSFET, a current-carrying conductor coupled to the heat-generating element, a sense conductor adjacent the current-carrying conductor, and a failure-detection circuit coupled to the sense conductor. When thermal cycling of the IC causes the resistance of the sense conductor to become greater than a temperature-dependent threshold value, the failure-detection circuit generates a signal indicating that the integrated circuit will soon fail. The resistance of the sense conductor is determined by injecting a current into the sense conductor to generate a voltage. The temperature-dependent threshold value is a voltage generated by injecting a current into a reference conductor disposed away from the current-carrying and sense conductors. A voltage comparator compares the two voltages to generate the output. Alternatively, the failure-detection circuit includes a processor that calculates the temperature-dependent threshold value from a temperature measurement taken on the integrated circuit.
摘要:
The embodiments described herein provide antifuse devices and methods that can be utilized in a wide variety of semiconductor devices. In one embodiment a semiconductor device is provided that includes an antifuse, a first diode coupled with the antifuse in a parallel combination, and a second diode coupled in series with the parallel combination. In such an embodiment the first diode effectively provides a bypass current path that can reduce the voltage across the antifuse when other antifuses are being programmed. As such, these embodiments can provide improved ability to tolerate programming voltages without damage or impairment of reliability.
摘要:
A buffer or voltage protection circuit, a circuit including same, and an associated method of operation are disclosed. In one example embodiment, the integrated circuit includes a first input terminal, a first circuit portion having a second input terminal, and a second circuit portion. The second circuit portion includes a transistor device having first, second, and third ports, where the first and second ports are respectively electrically coupled to the first input terminal and second input terminal, respectively. Additionally, the second circuit portion also includes a diode-type device that is electrically coupled between the third port and either a power source or a power input terminal, and a buffer/driver circuit and a capacitor coupled in series between the third and second ports. The second circuit portion operates to prevent the second input terminal from being exposed to an undesirably-high voltage level.
摘要:
An integrated circuit (IC) having a heat-generating element, such as a power MOSFET, a current-carrying conductor coupled to the heat-generating element, a sense conductor adjacent the current-carrying conductor, and a failure-detection circuit coupled to the sense conductor. When thermal cycling of the IC causes the resistance of the sense conductor to become greater than a temperature-dependent threshold value, the failure-detection circuit generates a signal indicating that the integrated circuit will soon fail. The resistance of the sense conductor is determined by injecting a current into the sense conductor to generate a voltage. The temperature-dependent threshold value is a voltage generated by injecting a current into a reference conductor disposed away from the current-carrying and sense conductors. A voltage comparator compares the two voltages to generate the output. Alternatively, the failure-detection circuit includes a processor that calculates the temperature-dependent threshold value from a temperature measurement taken on the integrated circuit.
摘要:
A buffer or voltage protection circuit, a circuit including same, and an associated method of operation are disclosed. In one example embodiment, the integrated circuit includes a first input terminal, a first circuit portion having a second input terminal, and a second circuit portion. The second circuit portion includes a transistor device having first, second, and third ports, where the first and second ports are respectively electrically coupled to the first input terminal and second input terminal, respectively. Additionally, the second circuit portion also includes a diode-type device that is electrically coupled between the third port and either a power source or a power input terminal, and a buffer/driver circuit and a capacitor coupled in series between the third and second ports. The second circuit portion operates to prevent the second input terminal from being exposed to an undesirably-high voltage level.
摘要:
An integrated circuitry includes a first logic block coupled between a first power supply terminal and a second power supply terminal. The first logic block includes a first scan chain and a configurable defect coupled to a scan output node of the first scan chain. The configurable defect has a logic node and a conductive element coupled between the logic node and the first or the second power supply terminal. The configurable defect is configured to, during a quiescent current testing mode, place a predetermined logic state on the logic node such that a current flows through the conductive element. The current can be detected by external equipment.
摘要:
A voltage supply regulator includes a first output resistor including a first terminal coupled to an output voltage of the voltage supply regulator and a second terminal; a first comparator including a first input coupled to a reference voltage, a second input coupled to the second terminal of the first output resistor, and an output coupled to a base of a first regulator transistor; a current mirror coupled to a collector of the first regulator transistor; and an slew rate detector coupled to the current mirror that includes a first terminal coupled to control electrodes of first and second transistors in the current mirror, and a detection bipolar junction transistor having a collector coupled to the control electrodes of the first and second transistors in the current mirror, and a base coupled to a second terminal of the capacitor.
摘要:
The embodiments described herein provide a semiconductor device layout and method that can be utilized in a wide variety of semiconductor devices. In one embodiment a semiconductor device is provided that includes a plurality of deep trench isolation structures that define and surround a first plurality of first trench-isolated regions in the substrate, and further define a second plurality of second trench-isolated regions in the substrate. The first plurality of first trench-isolated regions is arranged in a plurality of first columns, with each of the first columns including at least two of the first plurality of first trench-isolated regions. Likewise, the plurality of first columns are interleaved with the second trench-isolated regions to alternate in an array such that a second trench-isolated region is between consecutive first columns in the array and such that at least two first trench-isolated regions are between consecutive second trench-isolated regions in the array.
摘要:
An interface for processing a variable reluctance sensor signal provided by a variable reluctance sensor including an integrator, an arming comparator and a detect circuit. The integrator includes an input for receiving the variable reluctance sensor signal and an output providing an integrated signal indicative of total flux change of the variable reluctance sensor. The arming comparator compares the integrated signal with a predetermined arming threshold and provides an armed signal indicative thereof. The detect circuit provides a reset signal after the armed signal is provided to reset the integrator. A corresponding method of processing the variable reluctance sensor signal is also described.