Abstract:
An insulating layer provided metal substrate, including a metal substrate having a metallic aluminum on at least one surface and a composite structure layer formed of a porous aluminum oxide film provided on the metallic aluminum by anodization and an alkali metal silicate film covering pore surfaces of the porous aluminum oxide film, in which the mass ratio of silicon to aluminum in the composite structure layer is 0.001 to 0.2 at an arbitrary position within a region between a position 1 μm to the composite structure layer side in thickness from the interface between the composite structure layer and the metallic aluminum and a position 1 μm to the composite structure layer side in thickness from the interface between the composite structure layer and an upper layer on the opposite side of the metallic aluminum.
Abstract:
A semiconductor device is provided with a porous structure layer formed by silicone resin between a substrate and a semiconductor element. Alternatively, a porous layer having a density of 0.7 g/cm3 or less, formed by a compound obtained by hydrolyzing and condensing at least one type of alkoxysilane selected from a group consisting of monoalkoxysilane, dialkoxysilane, and trialkoxysilane, and tetraalkoxysilane is provided between the substrate and the semiconductor element. As a further alternative, an adhesion layer formed by a compound obtained by hydrolyzing and condensing an alkoxysilane is provided on a resin substrate, and a porous layer having a density of 0.7 g/cm3 or less, formed by a compound obtained by hydrolyzing and condensing an alkoxysilane, is provided on the adhesion layer.
Abstract translation:半导体器件具有由硅树脂在衬底和半导体元件之间形成的多孔结构层。 或者,通过将由单烷氧基硅烷,二烷氧基硅烷和三烷氧基硅烷组成的组中选择的至少一种烷氧基硅烷水解和缩合得到的化合物和四烷氧基硅烷形成的密度为0.7g / cm 3以下的多孔层, 衬底和半导体元件。 作为另外的替代方案,在树脂基板上设置由通过水解和缩合烷氧基硅烷获得的化合物形成的粘附层,并且通过水解和冷凝获得的化合物形成密度为0.7g / cm 3以下的多孔层 在粘合层上设置有烷氧基硅烷。
Abstract:
An anodizing device has: a power supply drum that supports, in close contact therewith, a web consisting of an anodizable metal and has a part configured with a conductive material, to which the web is closely attached; a counter electrode provided facing the power supply drum; an electrolysis tank filled with an electrolyte, into which part of the power supply drum and the counter electrode are immersed; a protection member formed of a non-conductive material that protects the lateral direction end portions of the web supported by the power supply drum in close contact therewith and a portion of the power supply drum, to which the web is not closely attached, from the electrolyte; and a driver adapted to make the web and the protection member travel concurrently in the electrolyte in synchronization with the circumferential speed of the power supply drum.