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1.发明公开公开(公告)号：US20240182750A1
公开(公告)日：2024-06-06
申请号：US18285091
申请日：2022-03-29
Applicant: FUJIMI INCORPORATED
Inventor： Kyosuke TENKO , Jun ITO , Daisuke YASUI , Hitoshi MORINAGA
CPC classification number: C09G1/02 , C09K3/1409
Abstract: Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing.
A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.-
公开(公告)号：US20160002500A1
公开(公告)日：2016-01-07
申请号：US14768998
申请日：2014-02-07
Applicant: FUJIMI INCORPORATED
Inventor： Jun ITO , Kazutoshi HOTTA , Hiroyasu SUGIYAMA , Hitoshi MORINAGA
CPC classification number: C09G1/02 , B24B37/00 , B24B37/044 , C09G1/00 , C09K3/1409 , C09K3/1454 , C09K3/1463 , C30B29/20 , C30B33/00 , H01L21/304 , H01L21/30625 , H01L21/3212
Abstract: Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate.The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m2/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.
Abstract translation: 本发明提供一种能够以高抛光速度对具有非极性面或半极性面的蓝宝石基板进行研磨的研磨用组合物。 本发明是一种用于抛光具有非极性平面或半极性面的蓝宝石衬底的抛光组合物，该抛光组合物含有胶体二氧化硅颗粒和水，其中通过将比表面积（ 胶体二氧化硅粒子的数均粒径（单位：nm），即（比表面积/数均粒径）为0.5以上且3.0以下。
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