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    Module board
    1.
    发明授权
    Module board 有权
    模块板

    公开(公告)号：US09468104B2

    公开(公告)日：2016-10-11

    申请号：US14184958

    申请日：2014-02-20

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Tatsuya Kakehashi ,  Masakazu Muranaga ,  Shinya Yamamoto

    IPC: H05K1/14 ,  H05K1/11 ,  H01L23/498

    CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

    Abstract translation: 模块板包括：第一板，包括第一表面和第二表面;第二板，其第一表面面对第一板的第二表面，外部电极形成在第二板的外部;接合构件， 外部电极和设置在第一板的第二表面上的端子。 外部电极包括位于第二板的第一表面上的第一表面部分，位于与第一表面相对的第二板的第二表面上的第二表面部分和连接第一和第二表面部分的连接部分。 接合构件包括接合到外部电极的接合表面。 接合表面覆盖第一表面部分和连接部分的比第二表面部分更靠近第一表面部分的至少一部分。

    Printed circuit board
    2.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US09398691B2

    公开(公告)日：2016-07-19

    申请号：US14661635

    申请日：2015-03-18

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Shinya Yamamoto

    IPC: H05K7/12 ,  H05K1/09 ,  H05K1/00 ,  H05K1/16 ,  H05K7/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/40 ,  H05K3/34 ,  H05K3/38

    CPC classification number: H05K1/113 ,  H05K1/09 ,  H05K1/116 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/099 ,  Y10T29/49155

    Abstract: A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.

    Abstract translation: 印刷电路板包括：基板; 设置在所述基板的表面上并且包括中心部分和多个延伸部分的区域，所述中心部分具有与表面安装装置的平台相同的形状和尺寸相同的尺寸，并且所述延伸部分向上 相对于穿过中心部分的中心的直线对称和右对称; 设置在基板的表面上的间隙，每个间隙设置在中心部分的周边和延伸部分之间; 以及设置在基板的表面上的抗蚀剂，并且具有形成在与中心部分和间隙相对应的位置处的开口部分。

    MODULE BOARD
    3.
    发明申请
    MODULE BOARD 有权
    模组

    公开(公告)号：US20140233191A1

    公开(公告)日：2014-08-21

    申请号：US14184958

    申请日：2014-02-20

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Tatsuya Kakehashi ,  Masakazu Muranaga ,  Shinya Yamamoto

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

    Abstract translation: 模块板包括：第一板，包括第一表面和第二表面;第二板，其第一表面面对第一板的第二表面，外部电极形成在第二板的外部;接合构件， 外部电极和设置在第一板的第二表面上的端子。 外部电极包括位于第二板的第一表面上的第一表面部分，位于与第一表面相对的第二板的第二表面上的第二表面部分和连接第一和第二表面部分的连接部分。 接合构件包括接合到外部电极的接合表面。 接合表面覆盖第一表面部分和连接部分的比第二表面部分更靠近第一表面部分的至少一部分。

    Printed circuit board and method for manufacturing the same
    4.
    发明授权
    Printed circuit board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US09013894B2

    公开(公告)日：2015-04-21

    申请号：US14022611

    申请日：2013-09-10

    Applicant: Fujitsu Component Limited

    Inventor： Shinya Yamamoto

    IPC: H05K7/00 ,  H05K1/09 ,  H05K1/00 ,  H05K1/16 ,  H05K1/11 ,  H05K7/10 ,  H05K3/42 ,  H05K3/40 ,  H05K3/34 ,  H05K3/38

    CPC classification number: H05K1/113 ,  H05K1/09 ,  H05K1/116 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/099 ,  Y10T29/49155

    Abstract: A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.

    Abstract translation: 印刷电路板包括：基板; 设置在所述基板的表面上并且包括中心部分和多个延伸部分的区域，所述中心部分具有与表面安装装置的平台相同的形状和尺寸相同的尺寸，并且所述延伸部分向上 相对于穿过中心部分的中心的直线对称和右对称; 设置在基板的表面上的间隙，每个间隙设置在中心部分的周边和延伸部分之间; 以及设置在基板的表面上的抗蚀剂，并且具有形成在与中心部分和间隙相对应的位置处的开口部分。

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