公开(公告)号：US09987838B2

公开(公告)日：2018-06-05

申请号：US15591201

申请日：2017-05-10

申请人： FUK Co., Ltd.

发明人： Mitsuo Uemura

IPC分类号： B32B38/10 ,  B32B43/00 ,  B23K26/402 ,  B23K103/00 ,  B32B38/18

CPC分类号： B32B43/006 ,  B23K26/402 ,  B23K2103/50 ,  B32B38/10 ,  B32B38/1858 ,  B32B2310/0843 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1174 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1978

摘要： A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

公开(公告)号：US08919406B2

公开(公告)日：2014-12-30

申请号：US14182411

申请日：2014-02-18

申请人： Fuk Co., Ltd.

发明人： Mitsuo Uemura

IPC分类号： B32B37/00 ,  G02F1/13 ,  G06F3/041 ,  B32B37/10 ,  B29C65/00

CPC分类号： G02F1/1303 ,  B29C66/92 ,  B32B37/003 ,  B32B37/10 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2457/20 ,  G02F2001/133331 ,  G02F2202/28 ,  G06F3/041 ,  Y10T156/1741

摘要： The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.

摘要翻译： 接合装置1包括限制第二板状构件200的前端201沿上下方向移动的前端支撑部10，其限制第二板的后端202的后端支撑部20 以及中间支撑部40，其在与后端202和后端202之间的中间点支撑第二板状构件200的同时沿着与接合辊30相同的方向移动。 接合位置P.当接合辊30移动时，后端支撑部20将后端202保持在比前端201更低的位置，并且中间支撑部40保持支撑 第二板状构件200的中间点处于低于前端201但高于后端202的位置。