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    DEVICE AND METHOD FOR WELDING PROFILED PARTS
    2.
    发明申请
    DEVICE AND METHOD FOR WELDING PROFILED PARTS 有权
    焊接配件的装置和方法

    公开(公告)号：US20130037211A1

    公开(公告)日：2013-02-14

    申请号：US13636150

    申请日：2011-02-01

    申请人： Bernd Eisenbach ,  Hans Schmitt

    发明人： Bernd Eisenbach ,  Hans Schmitt

    IPC分类号： B32B37/00

    CPC分类号： B29C66/8412 ,  B29C65/203 ,  B29C65/7841 ,  B29C66/1162 ,  B29C66/52431 ,  B29C66/71 ,  B29C66/8161 ,  B29C66/8163 ,  B29C66/8223 ,  B29C66/8242 ,  B29C66/843 ,  B29C66/8748 ,  B29C66/92 ,  B29C66/92311 ,  B29C66/9241 ,  B29C66/92651 ,  B29C66/95 ,  B29C66/961 ,  B29C66/9674 ,  B29L2031/005 ,  Y10T156/17 ,  B29C65/00 ,  B29K2027/06

    摘要： The invention relates to a device for welding profiled parts (8), in particular plastics profiled parts, having at least one welding head (1) that can be positioned in a predetermined or predeterminable target welding position (6) relative to another welding head (1, 9) and/or relative to a holding device. According to the invention the welding head (1) and/or a part of the welding head (1), that comprises at least one heating element, such as a heating plate, for melting the profiled parts, can be positioned and/or is movable in accordance with at least one dimensional variation of at least one of the profiled parts (8) from a target dimension in a spatial tolerance range (5) around the target welding position (6).

    摘要翻译： 本发明涉及一种用于焊接异型件（8），特别是塑料型材部件的装置，其具有至少一个焊接头（1），该焊接头可相对于另一个焊接头位于预定或可预定的目标焊接位置（6） 1,9）和/或相对于保持装置。 根据本发明，焊接头（1）和/或焊接头（1）的一部分，其包括用于熔化成型部件的至少一个加热元件，例如加热板，可以被定位和/或是 根据目标焊接位置（6）周围的空间公差范围（5）中的目标尺寸，至少一个成型部件（8）的至少一个尺寸变化可移动。

    BONDING APPARATUS
    8.
    发明申请
    BONDING APPARATUS 有权
    绑定装置

    公开(公告)号：US20140299276A1

    公开(公告)日：2014-10-09

    申请号：US14182411

    申请日：2014-02-18

    申请人： FUK CO., LTD.

    发明人： Mitsuo UEMURA

    IPC分类号： G02F1/13 ,  B32B37/10 ,  G06F3/041

    CPC分类号： G02F1/1303 ,  B29C66/92 ,  B32B37/003 ,  B32B37/10 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2457/20 ,  G02F2001/133331 ,  G02F2202/28 ,  G06F3/041 ,  Y10T156/1741

    摘要： The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.

    摘要翻译： 接合装置1包括限制第二板状构件200的前端201沿上下方向移动的前端支撑部10，其限制第二板的后端202的后端支撑部20 以及中间支撑部40，其在与后端202和后端202之间的中间点支撑第二板状构件200的同时沿着与接合辊30相同的方向移动。 接合位置P.当接合辊30移动时，后端支撑部20将后端202保持在比前端201更低的位置，并且中间支撑部40保持支撑 第二板状构件200的中间点处于低于前端201但高于后端202的位置。