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公开(公告)号：US20140299276A1
公开(公告)日：2014-10-09
申请号：US14182411
申请日：2014-02-18
申请人： FUK CO., LTD.
发明人： Mitsuo UEMURA
CPC分类号： G02F1/1303 , B29C66/92 , B32B37/003 , B32B37/10 , B32B38/1858 , B32B38/1866 , B32B2457/20 , G02F2001/133331 , G02F2202/28 , G06F3/041 , Y10T156/1741
摘要： The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.
摘要翻译： 接合装置1包括限制第二板状构件200的前端201沿上下方向移动的前端支撑部10，其限制第二板的后端202的后端支撑部20 以及中间支撑部40，其在与后端202和后端202之间的中间点支撑第二板状构件200的同时沿着与接合辊30相同的方向移动。 接合位置P.当接合辊30移动时，后端支撑部20将后端202保持在比前端201更低的位置，并且中间支撑部40保持支撑 第二板状构件200的中间点处于低于前端201但高于后端202的位置。
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2.发明授权公开(公告)号：US09987838B2
公开(公告)日：2018-06-05
申请号：US15591201
申请日：2017-05-10
申请人： FUK Co., Ltd.
发明人： Mitsuo Uemura
IPC分类号： B32B38/10 , B32B43/00 , B23K26/402 , B23K103/00 , B32B38/18
CPC分类号： B32B43/006 , B23K26/402 , B23K2103/50 , B32B38/10 , B32B38/1858 , B32B2310/0843 , B32B2457/20 , Y10T156/1132 , Y10T156/1158 , Y10T156/1174 , Y10T156/1917 , Y10T156/1944 , Y10T156/195 , Y10T156/1978
摘要： A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.
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3.发明申请公开(公告)号：US20170348960A1
公开(公告)日：2017-12-07
申请号：US15591201
申请日：2017-05-10
申请人： FUK Co., Ltd.
发明人： Mitsuo UEMURA
IPC分类号： B32B43/00 , B23K26/402 , B32B38/10 , B23K103/00
CPC分类号： B32B43/006 , B23K26/402 , B23K2103/50 , B32B38/10 , B32B38/1858 , B32B2310/0843 , B32B2457/20 , Y10T156/1132 , Y10T156/1158 , Y10T156/1174 , Y10T156/1917 , Y10T156/1944 , Y10T156/195 , Y10T156/1978
摘要： A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.
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公开(公告)号：US20160279915A1
公开(公告)日：2016-09-29
申请号：US14955087
申请日：2015-12-01
申请人： FUK Co., Ltd.
发明人： Mitsuo UEMURA
CPC分类号： B32B37/0053 , B32B37/003 , B32B37/025 , B32B37/1045 , B32B37/18 , B32B38/1858 , B32B41/00 , B32B2307/412 , B32B2309/16 , B32B2315/08 , B32B2457/208
摘要： A bonding apparatus for bonding a flexible member to a curved member in the atmosphere while preventing air bubbles from entering between the members includes a bonding stage for holding a first member with an inside surface facing up, a flexible carrier sheet for holding a second member with a bonding surface facing the inside surface of the first member, and a moveable bonding roller disposed above the carrier sheet. A control portion causes the bonding roller to move down so that the carrier sheet is depressed into a V-like shape, whereby a portion of the second member is bonded to the first member preceding the remaining portion of the second member, and thereafter, the bonding roller is caused to move along the curved shape of the first member to bond the remaining portion of the second member to the first member.
摘要翻译： 一种用于将柔性构件粘合到大气中的弯曲构件的接合装置，同时防止气泡进入构件之间包括用于保持具有面向内侧的第一构件的接合台，用于保持第二构件的柔性载体片 面对第一构件的内表面的接合表面和设置在载体片上方的可移动接合辊。 控制部使接合辊向下移动，使得载体片被压入V形状，由此第二部件的一部分在第二部件的剩余部分之前接合到第一部件，然后， 使粘合辊沿着第一部件的弯曲形状移动，以将第二部件的剩余部分结合到第一部件。
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公开(公告)号：US08919406B2
公开(公告)日：2014-12-30
申请号：US14182411
申请日：2014-02-18
申请人： Fuk Co., Ltd.
发明人： Mitsuo Uemura
CPC分类号： G02F1/1303 , B29C66/92 , B32B37/003 , B32B37/10 , B32B38/1858 , B32B38/1866 , B32B2457/20 , G02F2001/133331 , G02F2202/28 , G06F3/041 , Y10T156/1741
摘要： The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.
摘要翻译： 接合装置1包括限制第二板状构件200的前端201沿上下方向移动的前端支撑部10，其限制第二板的后端202的后端支撑部20 以及中间支撑部40，其在与后端202和后端202之间的中间点支撑第二板状构件200的同时沿着与接合辊30相同的方向移动。 接合位置P.当接合辊30移动时，后端支撑部20将后端202保持在比前端201更低的位置，并且中间支撑部40保持支撑 第二板状构件200的中间点处于低于前端201但高于后端202的位置。
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